Coil component

US11676753B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11676753-B2
Application numberUS-202016943474-A
CountryUS
Kind codeB2
Filing dateJul 30, 2020
Priority dateMay 8, 2020
Publication dateJun 13, 2023
Grant dateJun 13, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion, a nonmagnetic layer disposed below the through-portion, and an insulating layer disposed between the nonmagnetic layer and the through-portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A coil component comprising: a support substrate; a coil portion including a plurality of turns disposed directly on the support substrate; a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion; a nonmagnetic layer disposed below the through-portion; and an insulating layer disposed between the nonmagnetic layer and the through-portion, and extending from the coil portion to the nonmagnetic layer so that the insulating layer is in contact with an upper surface and a side surface of an innermost turn of the plurality of turns and the nonmagnetic layer, wherein the nonmagnetic layer has a thickness less than a thickness of the support substrate. 2. The coil component of claim 1 , wherein, based on a thickness direction of the body, a distance from one surface of the support substrate, on which the turns of the coil portion are disposed, to an upper surface of the coil portion is greater than a distance from the insulating layer to the upper surface of the coil portion. 3. The coil component of claim 1 , wherein thicknesses of the support substrate and the nonmagnetic layer are substantially the same. 4. The coil component of claim 1 , wherein the insulating layer includes parylene. 5. The coil component of claim 1 , wherein, based on a thickness direction of the body, a distance from one surface of the support substrate, on which the turns of the coil portion are disposed, to an upper surface of the coil portion is less than a distance from the insulating layer to the upper surface of the coil portion. 6. The coil component of claim 1 , wherein a width of the through-portion is decreased in a direction toward the nonmagnetic layer. 7. The coil component of claim 1 , wherein a boundary surface is disposed between the nonmagnetic layer and the support substrate. 8. The coil component of claim 1 , wherein the nonmagnetic layer includes at least one of a polymer, a ceramic material, or alumina (Al 2 O 3 ). 9. The coil component of claim 1 , further comprising: an external electrode disposed on an external surface of the body to be connected to an end portion of the coil component. 10. The coil component of claim 1 , wherein the nonmagnetic layer extends from the support substrate. 11. The coil component of claim 10 , wherein the nonmagnetic layer and the support substrate comprise the same material. 12. The coil component of claim 11 , wherein each of the plurality of turns of the coil portion has one surface in contact with the support substrate, and another surface opposing the one surface and spaced apart from the support substrate. 13. A coil component comprising: a support substrate; a coil portion disposed on at least one surface of the support substrate; a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion; a nonmagnetic layer disposed below the through-portion; and an insulating layer disposed between the nonmagnetic layer and the through-portion, wherein a portion of a surface of the nonmagnetic layer, on which the insulating layer is disposed, is inclined with respect to a stacking direction of the coil portion and the support substrate such that a width of the through-portion is decreased in a direction toward the nonmagnetic layer, the insulating layer extends from the coil portion to the nonmagnetic layer so that the insulating layer is in contact with an upper surface and a side surface of an innermost turn of a plurality of turns of the coil portion and the nonmagnetic layer, and the nonmagnetic layer has a thickness less than a thickness of the support substrate. 14. The coil component of claim 13 , wherein the insulating layer extends along a surface of the coil portion. 15. The coil component of claim 13 , wherein the insulating layer includes parylene. 16. The coil component of claim 13 , wherein the nonmagnetic layer includes at least one of a polymer, a ceramic material, or alumina (Al 2 O 3 ). 17. The coil component of claim 13 , further comprising: an external electrode disposed on an external surface of the body to be connected to an end portion of the coil component. 18. The coil component of claim 13 , wherein the nonmagnetic layer extends from the support substrate, and comprises the same material as the support substrate.

Assignees

Inventors

Classifications

  • with stacked layers · CPC title

  • Composite arrangements of magnetic circuits · CPC title

  • Insulation between coil and core, between different winding sections, around the coil; Other insulation structures · CPC title

  • with magnetic core · CPC title

  • Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

Patent family

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Frequently asked questions

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What does patent US11676753B2 cover?
A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion, a nonmagnetic layer disposed below the through-portion, and an insulating layer disposed between the nonmagnetic layer…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01F17/0013. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).