Methods of phosphidation and structures made therefrom
US-2018080136-A1 · Mar 22, 2018 · US
US11674237B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11674237-B2 |
| Application number | US-201916411651-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 14, 2019 |
| Priority date | May 14, 2019 |
| Publication date | Jun 13, 2023 |
| Grant date | Jun 13, 2023 |
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Fabricating a crystalline metal-phosphide layer may include providing a crystalline base substrate and a step of forming a crystalline metal-source layer. The method may further include performing a chemical conversion reaction to convert the metal-source layer to the crystalline metal phosphide layer. One or more corresponding semiconductor structures can be also provided.
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What is claimed is: 1. A method for fabricating a crystalline metal-phosphide hetero-layer, the method comprising; providing a crystalline base substrate; forming a crystalline buffer layer on the crystalline base substrate; forming a first crystalline metal-source layer comprising a first metal source on the crystalline buffer layer, wherein the first crystalline metal-source is a metal oxide of W, Mo or Nb, or a metal nitride of W, Mo or Nb; forming a second crystalline metal-source layer comprising a second metal-source on the first crystalline metal-source layer, wherein the second crystalline metal-source is a metal oxide of W, Mo or Nb, or a metal nitride of W, Mo or Nb and is compositionally different from the first metal-source; performing a chemical conversion reaction to convert the first crystalline metal-source layer into a first crystalline metal phosphide layer; and performing a chemical conversion reaction to convert the second crystalline metal-source layer into a second crystalline metal phosphide layer. 2. The method of claim 1 , wherein the base substrate comprises silicon. 3. The method of claim 2 , wherein the base substrate has a (100) crystal orientation. 4. The method of claim 1 , wherein the crystalline buffer layer is a layer comprising SrTiO 3 . 5. Thee method of claim 1 , wherein the crystalline buffer layer is a layer comprising sapphire. 6. The method of claim 1 , wherein the first crystalline metal-source layer is a layer comprising WO 3 , the second crystalline metal-source layer is a layer comprising MoO 3 , the first crystalline metal phosphide layer is a layer comprising WP 2 , and the second crystalline metal phosphide layer is a layer comprising MoP 2 . 7. The method of claim 1 , wherein the first crystalline metal-source layer is a layer comprising MoO 3 , the second crystalline metal-source layer is a layer comprising WO 3 , the first crystalline metal phosphide layer is a layer comprising MoP 2 , and the second crystalline metal phosphide layer is a layer comprising WP 2 . 8. The method of claim 1 , wherein the chemical conversion reaction is performed by an annealing in a phosphorous environment. 9. The method of claim 8 , wherein the annealing is performed at a temperature range of 600° C. to 1000° C. 10. The method of claim 1 , wherein the chemical conversion reaction is a solid-phase phosphidation. 11. The method of claim 1 , wherein the chemical conversion reaction is performed in a chemical vapor deposition (CVD) reactor with a precursor selected from the group consisting of: tertiarybutylphosphine (TBP) and phospine (PH 3 ).
Phosphides · CPC title
by solid state reactions or multi-phase diffusion · CPC title
Solid phase epitaxial growth through a disordered intermediate layer · CPC title
by thermal treatment, e.g. strain annealing (C30B1/12 takes precedence) · CPC title
only coatings of inorganic non-metallic material · CPC title
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