Method for fabricating a crystalline metal-phosphide hetero-layer by converting first and second crystalline metal-source layers into first and second crystalline metal phosphide layers

US11674237B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11674237-B2
Application numberUS-201916411651-A
CountryUS
Kind codeB2
Filing dateMay 14, 2019
Priority dateMay 14, 2019
Publication dateJun 13, 2023
Grant dateJun 13, 2023

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  5. First independent claim

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Abstract

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Fabricating a crystalline metal-phosphide layer may include providing a crystalline base substrate and a step of forming a crystalline metal-source layer. The method may further include performing a chemical conversion reaction to convert the metal-source layer to the crystalline metal phosphide layer. One or more corresponding semiconductor structures can be also provided.

First claim

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What is claimed is: 1. A method for fabricating a crystalline metal-phosphide hetero-layer, the method comprising; providing a crystalline base substrate; forming a crystalline buffer layer on the crystalline base substrate; forming a first crystalline metal-source layer comprising a first metal source on the crystalline buffer layer, wherein the first crystalline metal-source is a metal oxide of W, Mo or Nb, or a metal nitride of W, Mo or Nb; forming a second crystalline metal-source layer comprising a second metal-source on the first crystalline metal-source layer, wherein the second crystalline metal-source is a metal oxide of W, Mo or Nb, or a metal nitride of W, Mo or Nb and is compositionally different from the first metal-source; performing a chemical conversion reaction to convert the first crystalline metal-source layer into a first crystalline metal phosphide layer; and performing a chemical conversion reaction to convert the second crystalline metal-source layer into a second crystalline metal phosphide layer. 2. The method of claim 1 , wherein the base substrate comprises silicon. 3. The method of claim 2 , wherein the base substrate has a (100) crystal orientation. 4. The method of claim 1 , wherein the crystalline buffer layer is a layer comprising SrTiO 3 . 5. Thee method of claim 1 , wherein the crystalline buffer layer is a layer comprising sapphire. 6. The method of claim 1 , wherein the first crystalline metal-source layer is a layer comprising WO 3 , the second crystalline metal-source layer is a layer comprising MoO 3 , the first crystalline metal phosphide layer is a layer comprising WP 2 , and the second crystalline metal phosphide layer is a layer comprising MoP 2 . 7. The method of claim 1 , wherein the first crystalline metal-source layer is a layer comprising MoO 3 , the second crystalline metal-source layer is a layer comprising WO 3 , the first crystalline metal phosphide layer is a layer comprising MoP 2 , and the second crystalline metal phosphide layer is a layer comprising WP 2 . 8. The method of claim 1 , wherein the chemical conversion reaction is performed by an annealing in a phosphorous environment. 9. The method of claim 8 , wherein the annealing is performed at a temperature range of 600° C. to 1000° C. 10. The method of claim 1 , wherein the chemical conversion reaction is a solid-phase phosphidation. 11. The method of claim 1 , wherein the chemical conversion reaction is performed in a chemical vapor deposition (CVD) reactor with a precursor selected from the group consisting of: tertiarybutylphosphine (TBP) and phospine (PH 3 ).

Assignees

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Classifications

  • Phosphides · CPC title

  • by solid state reactions or multi-phase diffusion · CPC title

  • Solid phase epitaxial growth through a disordered intermediate layer · CPC title

  • C30B1/02Primary

    by thermal treatment, e.g. strain annealing (C30B1/12 takes precedence) · CPC title

  • C23C28/04Primary

    only coatings of inorganic non-metallic material · CPC title

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What does patent US11674237B2 cover?
Fabricating a crystalline metal-phosphide layer may include providing a crystalline base substrate and a step of forming a crystalline metal-source layer. The method may further include performing a chemical conversion reaction to convert the metal-source layer to the crystalline metal phosphide layer. One or more corresponding semiconductor structures can be also provided.
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification C30B1/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).