Dielectric-heating bonding film and bonding method using dielectric-heating bonding film

Patent metadata

Field	Value
Publication number	US-11673340-B2
Application number	US-201716345155-A
Country	US
Kind code	B2
Filing date	Oct 18, 2017
Priority date	Oct 27, 2016
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

First claim

The invention claimed is:

1. A dielectric welding film configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film comprising:
a first thermoplastic resin as an A1 component having a predetermined first solubility parameter (δ1);
a second thermoplastic resin as an A2 component, the second thermoplastic resin having a second solubility parameter (δ2) larger than the first solubility parameter of the first thermoplastic resin; and
a dielectric filler as a B component,
wherein the A1 component and the A2 component are directly mixed with each other as adhesive components,
the A1 component is a polyolefin resin and the A2 component is a polyester resin or maleic anhydride modified polypropylene,
the B component is at least one compound selected from the group consisting of zinc oxide and silicon carbide, and
a content of the B component is in a range from 50 to 600 parts by mass with respect to 100 parts by mass of a total amount of the A1 component and the A2 component.

2. The dielectric welding film according to claim 1 , wherein
a difference (δ2−δ1) between the second solubility parameter (δ2) of the A2 component and the first solubility parameter (δ1) of the A1 component is 0.5 (J/(cm 3 )) 1/2 or more.

3. The dielectric welding film according to claim 1 , wherein
the first solubility parameter (δ1) of the A1 component is 12 (J/(cm 3 )) 1/2 or more and less than 19.5 (J/(cm 3 )) 1/2 , and
the second solubility parameter (δ2) of the A2 component is in a range from 19.5 (J/(cm 3 )) 1/2 to 31.5 (J/(cm 3 )) 1/2 .

4. The dielectric welding film according to claim 1 , wherein the A1 component is a polyolefin resin and the A2 component is a polyester resin.

5. The dielectric welding film according to claim 1 , wherein a blend ratio of the A1 component and the A2 component in parts by mass is in a range from 5:95 to 95:5.

6. The dielectric welding film according to claim 1 , wherein the B component is zinc oxide.

7. The dielectric welding film according to claim 1 , wherein a mean particle size of the B component measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm.

8. A welding method using a dielectric welding film configured to weld a pair of adherends of the same material or different materials through dielectric heating, comprising steps (1) and (2) of:
(1) holding the dielectric welding film between the pair of adherends; and
(2) applying the dielectric heating on the dielectric welding film held between the pair of adherends with a dielectric heater by applying a high-frequency wave of 1 to 100 MHz frequency,
wherein the dielectric welding film comprising a first thermoplastic resin as an A1 component having a predetermined first solubility parameter (δ1), a second thermoplastic resin as an A2 component having a second solubility parameter (δ2) larger than the first solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component, and
wherein a content of the B component is in a range from 50 to 600 parts by mass with respect to 100 parts by mass of a total amount of the A1 component and the A2 component, the A1 component and the A2 component are directly mixed with each other as adhesive components, the A1 component is a polyolefin resin and the A2 component is a polyester resin or maleic anhydride modified polypropylene, and the B component is at least one compound selected from the group consisting of zinc oxide and silicon carbide.

9. The welding method according to claim 8 , wherein, in the step (2), the high-frequency wave is applied at a high-frequency output ranging from 0.1 to 20 kW for a high-frequency wave application time of 1 second or more and less than 40 seconds.

10. The welding method according to claim 8 , wherein, a mean particle size of the B component measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm.

11. The dielectric welding film according to claim 1 , wherein the A1 component is a non-modified polyolefin resin, and
the polyolefin resin as the A1 component is a homopolymer resin comprising polyethylene, polypropylene, polybutene or polymethylpentene, or an α-olefin resin comprising a copolymer of ethylene, propylene, butene, hexene, octene, or 4-methylpentene.

12. The welding method according to claim 8 , wherein the A1 component is a non-modified polyolefin resin, and
the polyolefin resin as the A1 component is a homopolymer resin comprising polyethylene, polypropylene, polybutene or polymethylpentene, or an α-olefin resin comprising a copolymer of ethylene, propylene, butene, hexene, octene, or 4-methylpentene.

13. The dielectric welding film according to claim 1 , wherein a blend ratio of the A1 component and the A2 component in parts by mass is in a range from 20:80 to 95:5.

14. The welding method according to claim 8 , wherein a blend ratio of the A1 component and the A2 component in parts by mass is in a range from 20:80 to 95:5.

Assignees

• Lintec Corp

Inventors

• Ishikawa Masakazu

Classifications

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J167/00

  Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain (based on polyester-amides C09J177/12; based on polyester-imides C09J179/08); Adhesives based on derivatives of such polymers · CPC title

• B29C65/40

  Applying molten plastics, e.g. hot melt (using welding bar {combined with hot gases} B29C65/12; by moulding B29C65/70) · CPC title

• C09J11/04

  inorganic · CPC title

• C09J9/00

  Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) · CPC title