3D-printed conformal cooling for hot stamping casted die inserts

US11673177B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11673177-B2
Application numberUS-202016812847-A
CountryUS
Kind codeB2
Filing dateMar 9, 2020
Priority dateMar 23, 2017
Publication dateJun 13, 2023
Grant dateJun 13, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mold assembly for a hot stamping die is provided. The mold assembly includes a mold having a body defining a cavity and a removable channel insert. The removable channel insert is positioned in the cavity and has a curved shape. The removable channel insert also includes a plurality of projections integrating the insert with the body. The removable channel insert is configured to form inlets and outlets for fluid in the hot stamping die upon removal of the insert.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a hot stamping die mold comprising: positioning a lower mold defining a first cavity therein, and having an upper surface with a curved surface profile and defining recesses in the upper surface; providing a channel insert having an insert body with insert projections extending from the insert body, the insert projections corresponding to the recesses in the upper surface, and the channel insert having a shape corresponding to the curved surface profile; placing the insert projections within the recesses in the upper surface to position the channel insert on the lower mold; and positioning an upper mold defining a second cavity therein, having a lower surface with a curved surface profile corresponding to the profile of the lower mold on the lower mold and the insert to form a mold assembly, wherein the first cavity and the second cavity cooperate to define an interior cavity of the mold assembly, the interior cavity sized to receive bulk material around the channel insert and form a hot stamping die with channels formed by the channel insert, and the insert body is supported within the interior cavity by the insert projections being placed in the recesses such that the channel insert is supported on the upper surface at the insert projections. 2. The method of claim 1 , wherein the insert projections are placed in the recesses such that the channel insert extends through the interior cavity according to the shape. 3. The method of claim 1 , further comprising 3D printing the lower mold and the upper mold. 4. The method of claim 1 , further comprising 3D printing the insert from sand to the shape corresponding to the surface profile to form a removable insert. 5. The method of claim 1 , further comprising forming an opening in the upper mold for receiving bulk material, the opening being fluidly connected to the interior cavity. 6. The method of claim 1 , further comprising printing surface features on the channel insert for forming fluid flow regions in channels. 7. The method of claim 1 , wherein the insert projections correspond to inlets and outlets for the channels. 8. A method of forming a hot stamping die mold comprising: positioning a lower mold having an upper surface with a curved surface profile and defining recesses; placing a 3D printed channel insert having an insert body with insert projections extending therefrom, the channel insert having a shape corresponding to the curved surface profile of the lower mold on the upper surface such that each insert projection is positioned in a corresponding recess of the recesses in the lower mold and the 3D printed channel insert is supported on the lower mold at the insert projections, the 3D printed channel insert further defining surface features thereon for forming fluid flow regions in channels; and positioning an upper mold having a lower surface with a curved surface profile corresponding to the profile of the lower mold on the lower mold and the insert. 9. A method of forming a hot stamping die comprising: positioning a lower mold defining a first cavity therein, and having an upper surface with a curved surface profile and defining recesses; providing a channel insert having insert projections extending from an insert body, and a shape corresponding to the curved surface profile of the lower mold, the channel insert comprising a lost core material; placing the insert projections in the recesses in the upper surface to position the channel insert on the upper surface of the lower mold such that the channel insert is supported on the lower mold only by the insert projections; positioning an upper mold on the lower mold and the insert to form a mold assembly, the upper mold defining a second cavity therein, and having a lower surface with a curved surface profile corresponding to the upper surface of the lower mold, and the first cavity and the second cavity cooperating to form an interior cavity; introducing bulk material into the interior cavity of the mold assembly around the channel insert to mold a hot stamping die; and removing the lost core material of the channel insert to form channels in the hot stamping die.

Assignees

Inventors

Classifications

  • Heating or cooling · CPC title

  • Selection of materials · CPC title

  • Processes of additive manufacturing · CPC title

  • B21D22/022Primary

    by heating the blank or stamping associated with heat treatment (C21D takes precedence) · CPC title

  • Sand moulds or like moulds for shaped castings · CPC title

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Frequently asked questions

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What does patent US11673177B2 cover?
A mold assembly for a hot stamping die is provided. The mold assembly includes a mold having a body defining a cavity and a removable channel insert. The removable channel insert is positioned in the cavity and has a curved shape. The removable channel insert also includes a plurality of projections integrating the insert with the body. The removable channel insert is configured to form inlets …
Who is the assignee on this patent?
Ford Motor Co
What technology area does this patent fall under?
Primary CPC classification B21D22/022. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).