Adjustable-tilt housing with flattened dome shape, array antenna, and bracket mount
US-11011835-B2 · May 18, 2021 · US
US11670844B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11670844-B2 |
| Application number | US-202117233178-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 16, 2021 |
| Priority date | Feb 8, 2013 |
| Publication date | Jun 6, 2023 |
| Grant date | Jun 6, 2023 |
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Official abstract text for this publication.
Radio devices for wireless transmission including an integrated adjustable mount allowing mounting to a pole or stand and adjustment of the angle of the device (e.g., the altitude). The device may include a compact array antenna having a high gain configured to operate in, for example, the 5.15 to 5.85 GHz band and/or the 2.40-2.48 GHz band. The antenna emitters may be arranged in a separate plane from a plane containing the antenna feed connecting the emitting elements and also from a ground plane. The antenna array may be contained within a protective weatherproof housing along with the radio control circuitry.
Opening claim text (preview).
What is claimed is: 1. A wireless broadband access device, the device comprising: an antenna having an antenna port radio frequency (RF) pin extending therefrom; a printed circuit board (PCB) comprising a first layer and a plurality of additional layers; an antenna contact electrically coupling the antenna port RF pin to the first layer of the PCB, wherein the antenna port RF pin passes through the additional layers of the PCB without making electrical contact therewith; a clearing region on each layer of the additional layers of the PCB, wherein each clearing region surrounds the antenna port RF pin on all sides in each layer of the additional layers of the PCB by more than about 0.5 mm, wherein the clearing region is substantially free of conductive materials; and a pair of ground pins extending from the antenna, passing through the clearing region and contacting each of the additional layers of the PCB. 2. The device of claim 1 , wherein each clearing region forms a square region that is substantially free of conductive materials. 3. The device of claim 1 , wherein each clearing region surrounds the antenna port RF pin by more than about 1 mm. 4. The device of claim 1 , wherein each clearing region surrounds the antenna port RF pin by more than about 1.9 mm. 5. The device of claim 1 , wherein each clearing region forms a rectangle. 6. The device of claim 1 , wherein the pair of ground pins each make an electrical contact with the first layer. 7. The device of claim 6 , wherein the antenna contact does not pass between the electrical contacts of the pair of ground pins on the first layer. 8. The device of claim 1 , wherein the antenna comprises an array antenna. 9. The device of claim 1 , wherein the antenna comprises a patch array antenna comprising a plurality of radiating elements. 10. The device of claim 1 , further comprising a second antenna port RF pin extending from the antenna that passes through the additional layers and makes electrical contact with the first layer, wherein each of the additional layers comprises a second clearing region around the second antenna port RF pin. 11. The device of claim 1 , wherein only the first layer of the PCB makes electrical contact with the antenna port RF pin. 12. A wireless broadband access device, the device comprising: an antenna having an antenna port radio frequency (RF) pin extending therefrom; a printed circuit board (PCB) comprising a first layer and a plurality of additional layers; an antenna contact electrically coupling the antenna port RF pin to the first layer of the PCB, wherein the antenna port RF pin passes through the additional layers of the PCB without making electrical contact therewith; a clearing region on each layer of the additional layers of the PCB, wherein each clearing region surrounds the antenna port RF pin on all sides in each layer of the additional layers of the PCB by more than about 0.5 mm, wherein the clearing region is substantially free of conductive materials; and a pair of ground pins extending from the antenna, the pair of ground pins passing through the clearing region and contacting each of the additional layers of the PCB and being in electrical contact with the first layer of the PCB, wherein the antenna contact does not pass between the pair of ground pins. 13. The device of claim 12 , wherein each clearing region forms a square region that is substantially free of conductive materials. 14. The device of claim 12 , wherein each clearing region surrounds the antenna port RF pin by more than about 1 mm. 15. The device of claim 12 , wherein each clearing region surrounds the antenna port RF pin by more than about 1.9 mm. 16. The device of claim 12 , wherein the antenna comprises an array antenna. 17. The device of claim 12 , wherein the antenna comprises a patch array antenna comprising a plurality of radiating elements. 18. The device of claim 12 , further comprising a second antenna port RF pin extending from the antenna that passes through the additional layers and makes electrical contact with the first layer, wherein each of the additional layers comprises a second clearing region extending at least 0.5 mm all around the second antenna port RF pin. 19. The device of claim 12 , wherein only the first layer of the PCB makes electrical contact with the antenna port RF pin. 20. A wireless broadband access device, the device comprising: an antenna comprising multiple radiating elements; a first antenna port radio frequency (RF) pin extending from the antenna; a second antenna port RF pin extending from the antenna; a printed circuit board (PCB) comprising a first layer and a plurality of additional layers, wherein the first antenna port RF pin is in electrical contact with a first antenna contact on the first layer and wherein the second antenna port RF pin is in electrical contact with a second antenna contact on the first layer, and wherein the first and second antenna port RF pins pass through, but do not make electrical contact with, the additional layers, wherein each of the additional layers comprises a first clearing region that is substantially free of conductive materials and surrounds the first antenna port RF pin and a second clearing region that is substantially free of conductive material and surrounds the second antenna port RF pin, wherein each of the first and second clearing regions extend from the antenna port RF pin on all sides by at least 0.5 mm; a first pair of ground pins extending from the antenna, passing through the first clearing region and contacting each of the additional layers; and a second pair of ground pins extending from the antenna, passing through the second clearing region and contacting each of the additional layers.
with other electrical component · CPC title
with particular feeding means (for circular polarisation H01Q9/0428) · CPC title
Feeding or matching arrangements for broad-band or multi-band operation · CPC title
Housings not intimately mechanically associated with radiating elements, e.g. radome · CPC title
used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W) · CPC title
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