LED package structure

Patent metadata

Field	Value
Publication number	US-11670748-B2
Application number	US-202117195539-A
Country	US
Kind code	B2
Filing date	Mar 8, 2021
Priority date	Mar 11, 2020
Publication date	Jun 6, 2023
Grant date	Jun 6, 2023

Abstract

A light emitting diode (LED) package structure includes a circuit board, a reflective cup, a LED chip and a lens structure. The reflective cup is mounted on the circuit board, wherein the reflective cup and the circuit board collectively form a concave cup with an opening. The reflective cup has a first metal ring in the concave cup. The LED chip is mounted on the circuit board and within the concave cup. The lens structure has a second metal ring configured to join the first metal ring to cover the opening.

First claim

What is claimed is:

1. A light emitting diode (LED) package structure comprising:
a circuit board;
a reflective cup disposed on the circuit board, wherein the reflective cup and the circuit board collectively form a concave cup having an opening, the reflective cup has a first metal ring in the concave cup;
a LED chip disposed on the circuit board and within the concave cup; and
a lens structure having a second metal ring configured to join the first metal ring to cover the opening, wherein a bottom surface of the reflective cup has a third metal ring, and the circuit board has a fourth metal ring configured to join the third metal ring.

2. The LED package structure of claim 1 further comprising a metal paste or a glass paste disposed between the first and second metal rings, and disposed between the third and fourth metal rings.

3. The LED package structure of claim 1 further comprising a polymer adhesive disposed between the first and second metal rings, and disposed between the third and fourth metal rings.

4. The LED package structure of claim 1 , wherein the first metal ring and the third metal ring are connected to each other and have substantially the same diameter.

5. The LED package structure of claim 1 , wherein the circuit board has a stage on which the LED chip is mounted, a top of the stage is higher than an interface between the reflective cup and the circuit board.

6. The LED package structure of claim 1 , wherein the lens structure comprises a flat lens or a convex lens.

7. The LED package structure of claim 1 , wherein the lens structure is embedded in the concave cup.

8. The LED package structure of claim 1 , wherein the first, second, third and fourth metal rings are continuously closed metal rings.

9. The LED package structure of claim 1 , wherein the first, second, third and fourth metal rings are discontinuous metal rings.

10. The LED package structure of claim 1 , wherein an inner surface of the concave cup has a light reflective coating.

11. The LED package structure of claim 1 further comprising another pair of first and second metal rings with a different diameter configured to secure the lens structure to the reflective cup.

12. The LED package structure of claim 11 further comprising a polymer adhesive disposed between the another pair of first and second metal rings.

13. The LED package structure of claim 1 further comprising another pair of third and fourth metal rings with a different diameter configured to secure the reflective cup to the circuit board.

14. The LED package structure of claim 13 further comprising a polymer adhesive disposed between the another pair of third and fourth metal rings.

Assignees

• Lextar Electronics Corp

Inventors

• Chen Chang-Han
• Lin Chun-Peng
• Lai Lung-Kuan

Classifications

• H10H20/8506 Primary

  Containers · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/856 Primary

  Reflecting means · CPC title

• H01L33/62

  Electricity · mapped topic