Wafer chucking system for advanced plasma ion energy processing systems
US-9435029-B2 · Sep 6, 2016 · US
US11670484B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11670484-B2 |
| Application number | US-202117231931-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 15, 2021 |
| Priority date | Nov 30, 2018 |
| Publication date | Jun 6, 2023 |
| Grant date | Jun 6, 2023 |
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Various RF plasma systems are disclosed that do not require a matching network. In some embodiments, the RF plasma system includes an energy storage capacitor; a switching circuit coupled with the energy storage capacitor, the switching circuit producing a plurality of pulses with a pulse amplitude and a pulse frequency, the pulse amplitude being greater than 100 volts; a resonant circuit coupled with the switching circuit. In some embodiments, the resonant circuit includes: a transformer having a primary side and a secondary side; and at least one of a capacitor, an inductor, and a resistor. In some embodiments, the resonant circuit having a resonant frequency substantially equal to the pulse frequency, and the resonant circuit increases the pulse amplitude to a voltage greater than 2 kV.
Opening claim text (preview).
That which is claimed: 1. An RF system comprising: an energy storage capacitor; a switching circuit coupled with the energy storage capacitor, the switching circuit producing a plurality of pulses with a pulse amplitude and a pulse frequency, the pulse amplitude being greater than 100 volts; a transformer having a primary side and a secondary side, the transformer coupled with the switching circuit; and an energy recovery circuit coupled with the energy storage capacitor and the secondary side of the transformer. 2. The RF system according to claim 1 , further comprising: a resonant circuit, wherein the resonant circuit comprises a circuit element selected from the group consisting of a capacitor, an inductor, and a resistor; wherein the resonant circuit has a resonant frequency substantially equal to the pulse frequency, and the resonant circuit increases the pulse amplitude to a voltage greater than 1 kV; and a plasma chamber coupled with the resonant circuit. 3. The RF system according to claim 1 , wherein the switching circuit comprises either a full-bridge driver or a half-bridge driver, and wherein the energy recovery circuit comprises a diode and an inductor. 4. The RF system according to claim 1 , wherein the resonant circuit comprises an inductor, and the resonant frequency comprises f r e s o n a n t ≈ 1 2 π ( L ) ( C ) , where the inductance L includes any stray inductance of the transformer and the inductance of the inductor, and the capacitance C includes any stray capacitance of the transformer. 5. The RF system according to claim 1 , wherein the resonant circuit comprises a capacitor, and the resonant frequency comprises f r e s o n a n t ≈ 1 2 π ( L ) ( C ) , where the inductance L includes any stray inductance of the transformer, and the capacitance C includes any stray capacitance of the transformer and the capacitance of the capacitor. 6. An RF plasma system comprising: an RF driver in a half-bridge or full-bridge configuration, the RF driver comprising a plurality of switches producing a plurality of pulses with a pulse amplitude and a pulse frequency, the pulse amplitude being greater than 100 volts; a transformer coupled with the RF driver; an energy recovery circuit coupled with the transformer; a bias compensation circuit coupled with the energy recovery circuit; and a plasma chamber coupled with the bias-compensation circuit. 7. The RF plasma system according to claim 6 , further comprising a resonant circuit coupled with the RF driver, the resonant circuit having a resonant frequency substantially equal to the pulse frequency and the resonant circuit increases the amplitude of the plurality of pulses to a voltage greater than 1 kV. 8. The RF plasma system according to claim 6 , wherein each of the plurality of switches is coupled in parallel with a respective diode. 9. The RF plasma system according to claim 6 , further comprising a half-wave rectifier coupled with the energy recovery circuit. 10. The RF plasma system according to claim 9 , wherein the half-wave rectifier comprises a blocking diode. 11. The RF plasma system according to claim 6 , wherein either or both the inductance (L) and/or the capacitance (C) of the transformer determine the resonant frequency according to: f r e s o n a n t ≈ 1 2 π ( L ) ( C ) . 12. The RF plasma system according to claim 6 , wherein the resonant frequency comprises f r e s o n a n t ≈ 1 2 π ( L
using particular waveforms, e.g. polarised waves · CPC title
the radio frequency energy being inductively coupled to the plasma · CPC title
by the use, as active elements, of semiconductors, not otherwise provided for · CPC title
the switching device being a semiconductor device · CPC title
Matching circuits · CPC title
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