Wiring harness assembly having multiple separated conductors embedded within a substrate

Patent metadata

Field	Value
Publication number	US-11670434-B2
Application number	US-202217688252-A
Country	US
Kind code	B2
Filing date	Mar 7, 2022
Priority date	Dec 5, 2017
Publication date	Jun 6, 2023
Grant date	Jun 6, 2023

Abstract

A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.

First claim

We claim:

1. A method of manufacturing a wiring harness assembly, comprising:
forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material;
forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening;
disposing a support segment within the opening;
securing a connector segment including a plurality of terminals to the support segment; and
placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires, wherein the method employs an apparatus to perform the steps of forming the plurality of electrically conductive wires encased within the substrate formed of the dielectric material and forming the opening in the substrate such that the section of the plurality of electrically conductive wires is exposed within the opening, the apparatus comprising:
an extruding device configured to selectively dispense a dielectric material though an orifice;
a wire feed device configured to selectively feed a conductive wire through the orifice:
a cutting device configured to selectively sever the conductive wire after it is fed through the orifice; and
an electronic controller configured to control the extruding device, the wire feed device, and the cutting device.

2. The method according to claim 1 , wherein the substrate is formed by an additive manufacturing process.

3. The method according to claim 2 , wherein the additive manufacturing process is selected from a list consisting of 3D printing, stereolithography, digital light processing, fused deposition modeling, fused filament fabrication, selective laser sintering, selecting heat sintering, multi-jet modeling, multi-jet fusion, electronic beam melting, and laminated object manufacturing.

4. The method according to claim 1 , further comprising forming a location feature integrally with the substrate, wherein the location feature is selected from a list consisting of an edge of the substrate, a corner of the substrate, a notch in the substrate, a slot in the substrate, and a hole in the substrate.

5. The method according to claim 4 , further comprising using the location feature as a fiducial mark, thereby providing a point of reference to determine a location of the opening.

6. The method according to claim 5 , further comprising placing the fiducial mark in a field of view of an automated assembly robot for use as a point of reference to determine the location of the opening.

7. The method according to claim 4 , further comprising placing the location feature on the substrate with a positional tolerance of less than or equal to 1 mm relative to the opening.

8. The method according to claim 1 , further comprising mating the connector segment with a corresponding mating connector having a plurality of corresponding mating terminals.

9. The method according to claim 1 , further comprising receiving the connector segment within the support segment.

10. The method according to claim 1 , wherein each terminal in the plurality of terminals defines a forked end having two tines and wherein the method further comprises receiving and compressively engaging a wire of the plurality of electrically conductive wires between the two tines.

11. The method according to claim 10 , further comprising:
applying a coating of an electrically conductive material having a lower melting point than the plurality of electrically conductive wires on outer surfaces of the plurality of electrically conductive wires; and
locally heating the coating to metallurgically bond one terminal in the plurality of terminals to one electrical conductor in the plurality of electrically conductive wires.

12. The method according to claim 11 , wherein the support segment defines a plurality of recesses in which the two tines are received.

13. The method according to claim 1 , wherein the support segment comprises a lower lip engaging a lower surface of the substrate around a perimeter of the opening and wherein the connector segment comprises an upper lip engaging an upper surface of the substrate around the perimeter of the opening.

14. The method according to claim 13 , wherein the lower lip comprises a lower seal formed of a first compliant material and sealingly engaging the lower surface of the substrate around the perimeter of the opening and wherein the upper lip comprises an upper seal formed of a second compliant material and sealingly engaging the upper surface of the substrate around the perimeter of the opening.

15. The method according to claim 1 , wherein the support segment comprises a lower seal formed of a first compliant material and sealing engaging a lower inner surface of the substrate within the opening and wherein the method further comprises disposing an upper seal formed of a second compliant between the connector and an upper inner surface within the opening.

16. The method according to claim 15 , further comprising disposing an inner seal formed of a third compliant material intermediate the connector segment and the support segment.

17. The method according to claim 1 , further comprising forming the support segment integrally with the substrate.

18. The method according to claim 1 , further comprising arranging and maintaining the plurality of electrically conductive wires in a predetermined order.

19. The method according to claim 1 , further comprising forming a first region of the substrate surrounding the opening such that it has a stiffness that is greater than a second region of the substrate remote from the opening.

Assignees

• Aptiv Tech Ltd

Inventors

• Bilas Jared
• Peterson David R
• Seifert Kurt P
• Reider Christopher G
• Sohn Doyeon Y
• Rhinehart Jr Gerald A
• Stevens Therese G
• Drew George A
• Kightlinger John T

Classifications

• H01R2201/26

  for vehicles · CPC title

• H01R13/502

  composed of different pieces (H01R13/514 takes precedence) · CPC title

• H01B13/01236

  the wires being disposed by machine · CPC title

• H01B7/0045 Primary

  Cable-harnesses · CPC title

• B29C64/106

  using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title