Valve assembly and system used to control flow rate of a fluid

US11669111B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11669111-B2
Application numberUS-202017010496-A
CountryUS
Kind codeB2
Filing dateSep 2, 2020
Priority dateSep 13, 2019
Publication dateJun 6, 2023
Grant dateJun 6, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A valve assembly for controlling fluid flow rate comprising a valve block, a valve, a sensor chip package, and a controller interface. The valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from an upstream location to a downstream location. The valve having a moveable member. The sensor chip package having at least one sensor coupled with the valve. The controller interface is communicable coupled to a control unit, the valve, and the sensor chip package. The controller interface sends at least one parametric value provided by the sensor chip package to the control unit. The controller interface receives a control signal used to adjust valve stroke of the valve. The control signal of the valve is determined based on the at least one measured parametric value and at least one other parametric value provided by a fluid processing system.

First claim

Opening claim text (preview).

What is claimed is: 1. A valve assembly for controlling fluid flow rate, the valve assembly comprising: a valve block having an upstream reservoir, a downstream reservoir and a valve seat for communicating fluid from an upstream location to a downstream location; a stand-alone valve having a moveable member; a sensor chip package having at least one on-board sensor coupled with the stand-alone valve; and a controller interface for receiving an at least one measured parametric value provided by the at least one on-board sensor, and for further receiving at least one other parametric value provided by at least one off-board sensor, the at least one off-board sensor located external to the valve assembly at a process tool; wherein the controller interface generates a control signal for the stand-alone valve, the control signal determined in response to the at least one measured parametric value and the at least one other measured parametric value; wherein a first parametric value indicating pressure is generated at an upstream entrance channel of the valve assembly; and wherein a second parametric value indicating pressure is generated at a downstream entrance channel of the valve assembly. 2. A fluid processing system for use in a manufacturing facility, the fluid processing system comprising: a valve block having an upstream reservoir, a downstream reservoir and a valve seat for communicating fluid from an upstream location to a downstream location; a stand-alone valve having a moveable member; a sensor chip package having at least one sensor coupled with the valve; an upstream fluid source fluidly coupled to the stand-alone valve, wherein a first pressure sensor is located between the valve block and the upstream fluid source; a downstream process tool fluidly coupled to the stand-alone valve, wherein a second pressure sensor is located between the valve block and the downstream process tool; wherein the downstream process tool comprises a downstream pressure sensor; and a control unit having an interface communicable coupled to the first pressure sensor, the second pressure sensor, the stand-alone valve and the sensor chip package; wherein the control unit generates a control signal used to control a stroke of the stand-alone valve based on at least one parametric value from the sensor chip package, the first pressure sensor, and the second pressure sensor. 3. A method of using a valve assembly for controlling fluid flow rate in a fluid processing system, the method comprising: generating, at the valve assembly a first parametric value indicating position of a moveable member of a stand-alone valve; generating, upstream of the valve assembly, a second parametric value indicating absolute pressure at a location between the valve assembly and an upstream fluid source; generating, at an upstream entrance channel of the valve assembly, another parametric valve indicating pressure; generating, downstream of the valve assembly and at a process tool, a third parametric value indicating pressure at a location between the valve assembly and a downstream process tool; generating, at a downstream exit channel of the valve assembly, another parametric value indicating pressure; and adjusting a position of a valve based on the first parametric value, the second parametric value, the third parametric value, and at least one other parametric value selected from a group comprising set point value, current fluid flow rate, fluid type, at least one other pressure, temperature, and differential pressure.

Assignees

Inventors

Classifications

  • Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

  • Apparatus for monitoring, sorting, marking, testing or measuring · CPC title

  • Valve seats (for double-seat valves F16K1/44) · CPC title

  • F16K37/005Primary

    for measuring fluid parameters (F16K37/0033 takes precedence) · CPC title

  • F16K1/00Primary

    Lift valves {or globe valves}, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces ({in combination with sliding valves F16K3/246, F16K3/267} ; diaphragm valves F16K7/00) · CPC title

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What does patent US11669111B2 cover?
A valve assembly for controlling fluid flow rate comprising a valve block, a valve, a sensor chip package, and a controller interface. The valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from an upstream location to a downstream location. The valve having a moveable member. The sensor chip package having at least one sensor coupled with…
Who is the assignee on this patent?
Illinois Tool Works
What technology area does this patent fall under?
Primary CPC classification F16K37/005. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jun 06 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).