Integrated front-end architecture modules for carrier aggregation

Patent metadata

Field	Value
Publication number	US-11664829-B2
Application number	US-202017103546-A
Country	US
Kind code	B2
Filing date	Nov 24, 2020
Priority date	Sep 28, 2015
Publication date	May 30, 2023
Grant date	May 30, 2023

Abstract

Circuitry, modules and devices for integrating front-end carrier aggregation architecture, are disclosed. In some embodiments, a front-end architecture includes a switching assembly configured to provide switching for two or more frequency bands. In some embodiments, the switching assembly includes at least one coupler configured to couple a signal associated with the switching assembly. The front-end architecture can also include a diplexer circuit including a first filter configured to pass a first frequency band, a second filter configured to pass a second frequency band, and a first electrostatic discharge network configured to dissipate electrostatic energy associated with the first and second frequency bands from the front-end architecture.

First claim

What is claimed is:

1. A radio-frequency packaged module comprising:
a packaging substrate configured to receive a plurality of components;
a first die implemented on the packaging substrate, the first die including a first antenna switch module configured to provide switching for a first frequency band, the first antenna switch module coupled to a first node associated with a first antenna, the first die including a first coupler configured to couple a signal associated with the first antenna switch module;
a second die implemented on the packaging substrate, the second die including a second antenna switch module configured to provide switching for a second frequency band and a third antenna switch module configured to provide switching for a third frequency band, the second antenna switch module coupled to the first node associated with the first antenna, the third antenna switch module coupled to a second node associated with a second antenna, the second die including a second coupler configured to couple a signal associated with the second antenna switch module and a third coupler configured to couple a signal associated with the third antenna switch module;
a third die implemented on the packaging substrate, the third die including a diplexer circuit including a first filter coupled to the first antenna switch module and configured to pass the first frequency band, a second filter coupled to the second antenna switch module and configured to pass the second frequency band, a first electrostatic discharge network configured to dissipate electrostatic energy associated with the first frequency band and the second frequency band from the first node associated with the first antenna, the first electrostatic discharge network coupled to the first filter and the second filter, and a second electrostatic discharge network configured to dissipate electrostatic energy associated with the third frequency band from the second node associated with the second antenna; and
a multiplexor assembly configured to select a signal from one of the first coupler or the second coupler for output to a coupler output node.

2. The radio-frequency packaged module of claim 1 wherein the first filter and the second filter are coupled to the first antenna.

3. The radio-frequency packaged module of claim 1 wherein the first electrostatic discharge network is coupled to the first antenna and the second electrostatic discharge network is coupled to the second antenna.

4. The radio-frequency packaged module of claim 1 wherein the second electrostatic discharge network is coupled to the third antenna switch module.

5. The radio-frequency packaged module of claim 1 further comprising a fourth die including a plurality of power amplifiers and a plurality of filters.

6. The radio-frequency packaged module of claim 5 wherein the fourth die includes a first power amplifier for a transmission signal associated with the first frequency band and a second power amplifier for a transmission signal associated with the second frequency band.

7. The radio-frequency packaged module of claim 6 wherein the first power amplifier is coupled to a transmission node of the first antenna switch module and the second power amplifier is coupled to a transmission node of the second antenna switch module.

8. The radio-frequency packaged module of claim 1 wherein at least a portion of the diplexer circuit is conjugately matched with one or more of the first antenna switch module, the second antenna switch module, and the third antenna switch module.

9. The radio-frequency packaged module of claim 1 wherein one or more ports of one or more of the first antenna switch module, the second antenna switch module, and the third antenna switch module include integrated notch filters.

10. The radio-frequency packaged module of claim 1 wherein one or more of the first coupler, the second coupler, and the third coupler are bidirectional.

11. The radio-frequency packaged module of claim 1 wherein at least one of the first filter and the second filter is an elliptic filter.

12. A wireless device comprising:
a transceiver configured to process radio-frequency signals;
a first antenna and a second antenna; and
a radio-frequency module including a first die including a first antenna switch module configured to provide switching for a first frequency band, the first antenna switch module coupled to the first antenna, the first die including a first coupler configured to couple a signal associated with the first antenna switch module, the radio-frequency module further including a second die including a second antenna switch module configured to provide switching for a second frequency band and a third antenna switch module configured to provide switching for a third frequency band, the second antenna switch module coupled to the first antenna, the third antenna switch module coupled to the second antenna, the second die including a second coupler configured to couple a signal associated with the second antenna switch module and a third coupler configured to couple a signal associated with the third antenna switch module, the radio-frequency module further including a third die including a diplexer circuit including a first filter coupled to the first antenna switch module and configured to pass the first frequency band, a second filter coupled to the second antenna switch module and configured to pass the second frequency band, a first electrostatic discharge network configured to dissipate electrostatic energy associated with the first frequency band and the second frequency band from the first antenna, the first electrostatic discharge network coupled to the first filter and the second filter, and a second electrostatic discharge network configured to dissipate electrostatic energy associated with the third frequency band from the second antenna, the radio-frequency module further including a multiplexor assembly configured to select a signal from one of the first coupler or the second coupler for output to a coupler output node.

13. The wireless device of claim 12 wherein the first filter and the second filter are coupled to the first antenna.

14. The wireless device of claim 12 wherein the first electrostatic discharge network is coupled to the first antenna and the second electrostatic discharge network is coupled to the second antenna.

15. The wireless device of claim 12 wherein the second electrostatic discharge network is coupled to the third antenna switch module.

16. The wireless device of claim 12 wherein the radio-frequency module includes a fourth die including a plurality of power amplifiers and a plurality of filters.

17. The wireless device of claim 16 wherein the fourth die includes a first power amplifier for a transmission signal associated with the first frequency band and a second power amplifier for a transmission signal associated with the second frequency band.

18. The wireless device of claim 12 wherein at least a portion of the diplexer circuit is conjugately matched with one or more of the first antenna switch module, the second antenna switch module, and the third antenna switch module.

19. The wireless device of claim 12 wherein one or more ports of one or more of the first antenna switch module, the second antenna switch module, and the third antenna switch module include integrated notch filters.

20. A radio-frequency packaged module comprising:
a packaging substrate configured to receive a plurality of components;
a first die implemented on the pac

Assignees

• Skyworks Solutions Inc

Inventors

• JAYARAMAN Srivatsan
• Mustafa Omar
• Jin Yalin
• Chang Ethan
• Shi Ying
• Kasnavi Reza
• Thompson Philip H
• Warren Kenneth Norman

Classifications

• H04W84/042

  Public Land Mobile systems, e.g. cellular systems · CPC title

• H04B1/0057 Primary

  using diplexing or multiplexing filters for selecting the desired band · CPC title

• H04W52/52 Primary

  using AGC [Automatic Gain Control] circuits or amplifiers · CPC title

• H04B7/04

  using two or more spaced independent antennas · CPC title