Light emitting module and driving method thereof, and displaying device

Patent metadata

Field	Value
Publication number	US-11664408-B2
Application number	US-202117328168-A
Country	US
Kind code	B2
Filing date	May 24, 2021
Priority date	Oct 28, 2020
Publication date	May 30, 2023
Grant date	May 30, 2023

Abstract

A light emitting module and a driving method thereof, and a displaying device. The light emitting module includes: a light emitting base plate, wherein the light emitting base plate includes M rows and N columns of light emitting regions, and each of the light emitting regions includes a plurality of light emitting devices that are connected in series; and a driving assembly, wherein the driving assembly includes one or more driving chips, each of the driving chips includes a plurality of first leads and a plurality of second leads, each of the first leads is connected to the first terminal of a corresponding one instance of the light emitting regions, and each of the second leads is connected to the second terminal of a corresponding one instance of the light emitting regions; wherein a total quantity of the second leads in the driving assembly is integer multiples of N.

First claim

The invention claimed is:

1. A light emitting module, wherein the light emitting module comprises:
a light emitting base plate, wherein the light emitting base plate comprises M rows and N columns of light emitting regions, each of the light emitting regions comprises a plurality of light emitting devices that are connected in series, a first terminal of each of the light emitting regions is an anode of a first instance of the light emitting devices in the light emitting region, a second terminal of each of the light emitting regions is a cathode of a last instance of the light emitting devices in the light emitting region, and both of M and N are a positive integer greater than 1; and
a driving assembly, wherein the driving assembly comprises one or more driving chips, each of the driving chips comprises a plurality of first leads and a plurality of second leads, each of the first leads is connected to the first terminal of a corresponding one instance of the light emitting regions, and each of the second leads is connected to the second terminal of a corresponding one instance of the light emitting regions;
wherein a total quantity of the second leads in the driving assembly is integer multiples of N;
M is integer multiples of a quantity of the first leads comprised in each of the driving chips, the quantity of the first leads comprised in each of the driving chips is greater than or equal to M/8, and a product between the quantity of the first leads and a quantity of the second leads comprised in each of the driving chips is greater than or equal to (M×N)/8.

2. The light emitting module according to claim 1 , wherein each of the first leads is connected to first terminals of some or all of the light emitting regions in the corresponding row, and each of the first leads corresponds to at least one row of the light emitting regions; and
each of the second leads is connected to second terminals of some or all of the light emitting regions in the corresponding column, and each of the second leads corresponds to one column of the light emitting regions.

3. The light emitting module according to claim 1 , wherein the quantity of the driving chips comprised in the driving assembly is 2;
the quantity of the first leads comprised in each of the driving chips is M/2, and the quantity of the second leads comprised in each of the driving chips is 2N;
each of the first leads is connected to first terminals of all of the light emitting regions in two corresponding neighboring rows; and
each column of the light emitting regions is divided into two groups, second terminals of the light emitting regions in the same one group are connected to a same one second lead, and the second leads that are connected to the two groups of the light emitting regions are different.

4. The light emitting module according to claim 1 , wherein the quantity of the driving chips comprised in the driving assembly is 4;
the quantity of the first leads comprised in each of the driving chips is M/2, and the quantity of the second leads comprised in each of the driving chips is N;
each of the first leads is connected to first terminals of all of the light emitting regions in one corresponding row; and
each column of the light emitting regions is divided into two groups, second terminals of the light emitting regions in the same one group are connected to a same one second lead, and the second leads that are connected to the two groups of the light emitting regions are different.

5. A light emitting module, the light emitting module comprises:
a light emitting base plate, wherein the light emitting base plate comprises M rows and N columns of light emitting regions, each of the light emitting regions comprises a plurality of light emitting devices that are connected in series, a first terminal of each of the light emitting regions is an anode of a first instance of the light emitting devices in the light emitting region, a second terminal of each of the light emitting regions is a cathode of a last instance of the light emitting devices in the light emitting region, and both of M and N are a positive integer greater than 1; and
a driving assembly, wherein the driving assembly comprises one or more driving chips, each of the driving chips comprises a plurality of first leads and a plurality of second leads, each of the first leads is connected to the first terminal of a corresponding one instance of the light emitting regions, and each of the second leads is connected to the second terminal of a corresponding one instance of the light emitting regions;
wherein a total quantity of the second leads in the driving assembly is integer multiples of N;
wherein the plurality of second leads comprised in each of the driving chips are classified into at least two types, different types of the second leads are connected in series to each other, and each of the second terminals of the light emitting regions is connected to any one of the second leads that are connected in series.

6. The light emitting module according to claim 5 , wherein the types into which the plurality of second leads comprised in each of the driving chips are classified are related to a maximum current value required by the light emitting base plate and a current limit of each of the second leads of the driving chips.

7. The light emitting module according to claim 1 , wherein the driving assembly further comprises a voltage boosting sub-assembly and a voltage dropping sub-assembly;
the voltage boosting sub-assembly is connected to an input terminal of an external power supply and the driving chips, and is configured for boosting an external-power-supply voltage supplied by the input terminal of the external power supply, to obtain a driving voltage, to supply the driving voltage to the light emitting devices in the light emitting regions via the driving chips; and
the voltage dropping sub-assembly is connected to the input terminal of the external power supply and the driving chips, and is configured for dropping the external-power-supply voltage supplied by the input terminal of the external power supply, to obtain an operating voltage, and supplying the operating voltage to the driving chips, to cause the driving chips to be in an operating state.

8. The light emitting module according to claim 7 , wherein the driving assembly further comprises a controlling sub-assembly;
the controlling sub-assembly is connected to a time-sequence controller and the driving chips, and is configured for, according to a controlling signal sent by the time-sequence controller, controlling the driving chips to supply the driving voltage and a driving-current signal to the light emitting devices in the corresponding light emitting region; and
the voltage dropping sub-assembly is further connected to the controlling sub-assembly, and is configured for supplying the operating voltage to the controlling sub-assembly, to cause the controlling sub-assembly to be in an operating state.

9. The light emitting module according to claim 1 , wherein the light emitting base plate comprises a glass base plate, electrode connecting lines provided on the glass base plate, and the light emitting devices connected to the electrode connecting lines; and
the electrode connecting lines are further connected to the driving chips.

10. The light emitting module according to claim 9 , wherein the electrode connecting lines include anode connecting lines and cathode connecting lines, and the anode connecting lines and the cathode connecting lines are insulated from each other; and
the first terminal of each of the light emitting regions is connected to one of the anode connecting lines, the second terminal of each of the lig

Assignees

• Beijing Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Dong Xiaoqiao
• Han Rui
• Wang Xiaoxia
• Qi Qi
• Yu Jie
• Li Meng
• Wang Yaoyao
• Wang Chunhua
• Zhao Tielei
• Li Pengtao

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H29/942

  Serial electrical configurations of multiple light-emitting semiconductor components or devices · CPC title

• H10H29/857

  Interconnections (of active-matrix LED displays H10H29/49) · CPC title

• H10H29/142 Primary

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title