Light emitting device, and method for manufacturing light emitting device

Patent metadata

Field	Value
Publication number	US-11664353-B2
Application number	US-202016988938-A
Country	US
Kind code	B2
Filing date	Aug 10, 2020
Priority date	Sep 3, 2019
Publication date	May 30, 2023
Grant date	May 30, 2023

Abstract

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

First claim

The invention claimed is:

1. A light-emitting device comprising:
a light-emitting panel comprising a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and
a flexible wiring board comprising a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board,
wherein a ratio of a minimum distance between a substrate of the flexible wiring board and the first board at a portion where the conductor patterns and the circuit pattern are not in electrical contact with each other via the anisotropic conductive layer relative to a distance between the substrate of the flexible wiring board and the first board at a portion where the conductor patterns and the circuit pattern are in electrical contact with each other via the anisotropic conductive layer is at least ¾ and no more than 9/10.

2. A light-emitting device comprising:
a light-emitting panel comprising a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and
a flexible wiring board comprising a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board,
wherein a minimum interval between the conductor patterns and the circuit pattern at a point spaced apart in a direction along the first board by a distance which is 8 times the diameter of a conductive particle included in the anisotropic conductive layer from a contact point of the conductive particle which contacts both the circuit pattern and the conductor patterns in a region where the conductor patterns are in electrical contact with the circuit pattern via the anisotropic conductive layer is no more than ½ and at least 1/20 of the diameter of the conductive particle.

3. A light-emitting device comprising:
a light-emitting panel comprising a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and
a flexible wiring board comprising a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board,
wherein a minimum interval between the conductor patterns and the circuit pattern at a point spaced apart in a direction along the first board by a distance which is 8 times the diameter of a conductive particle included in the anisotropic conductive layer from a contact point of the conductive particle which contacts both the circuit pattern and the conductor patterns in a region where the conductor patterns are in electrical contact with the circuit pattern via the anisotropic conductive layer is at least 0.2 μm and no more than 2.5 μm.

4. The light-emitting device according to claim 1 , wherein an adhesive layer of the anisotropic conductive layer is made of a fluororesin.

5. The light-emitting device according to claim 1 , wherein the conductive particle included in the anisotropic conductive layer is a resin spherical body covered in nickel and/or gold, or is a nickel particle.

6. The light-emitting device according to claim 1 , wherein a connection portion with the flexible wiring board that has the circuit pattern and that is electrically connected via the anisotropic conductive layer to the exposed part of the conductor patterns formed on the first board is sealed by a protective tape and a mold resin.

7. The light-emitting device according to claim 1 , wherein at an end of the flexible wiring board, an end of the circuit pattern is divided into a plurality of wires having a wire width that is narrower than a wire width of the plurality of conductor patterns, and an end of the conductor pattern of the light-emitting panel is electrically connected, at an end of the first board, via the anisotropic conductive layer to the ends of the circuit pattern of the flexible wiring board which is divided into the plurality of wires.

Assignees

• Toshiba Hokuto Electronics Corp
• Nichia Corp

Inventors

• Makita Kairi
• Ueno Fumio

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/01

  Manufacture or treatment · CPC title