Systems and methods for printing patterns

US11660862B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11660862-B2
Application numberUS-202017024499-A
CountryUS
Kind codeB2
Filing dateSep 17, 2020
Priority dateSep 17, 2020
Publication dateMay 30, 2023
Grant dateMay 30, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system and method for applying patterns to surfaces. A pattern may be applied to a surface of an object using a three-dimensional (3D) printer system. The 3D printer system may include a printer head including an applicator holding material used to form the pattern on the surface, a structure configured to hold a substrate to which the material will be applied, and a controller for adjusting a location of the printer head relative to a surface and initiating applying material from the applicator onto the surface. The applicator may be a syringe with a needle. 3D coordinates at which material is to be applied to a surface to form the pattern may be determined and identified based on a relative location of the substrate and the pattern. The pattern may be a speckle dot pattern used in Digital Image Correlation (DIC) material testing and characterization techniques.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of applying a digital image correlation (DIC) pattern to a surface of a substrate, the method comprising: determining a three-dimensional coordinate for each of one or more locations at which ink is to be applied to a surface of a substrate to achieve a predetermined DIC pattern, the three-dimensional coordinates are determined based on a location of the surface of the substrate and the predetermined DIC pattern; adjusting a position of a printer head to a three-dimensional coordinate of a location of the one or more locations; and applying ink to the surface of the substrate at the three-dimensional coordinate using the printer head, the ink on the surface of the substrate having a dimension based on the predetermined DIC pattern. 2. The method as in claim 1 , wherein the adjusting a position of a printer head to the three-dimensional coordinate of the location of the one or more locations and the applying the ink to the surface of the substrate at the three-dimensional coordinate are repeated for each of the one or more locations. 3. The method as in claim 1 , wherein: the adjusting a position of the printer head to the three-dimensional coordinate of the location of the one or more locations of the predetermined DIC pattern includes adjusting the printer head to x-axis and y-axis coordinates and lowering the printer head to a z-axis coordinate; and the applying the ink to the surface of the substrate at the three-dimensional coordinate occurs when the printer head is adjusted to the x-axis coordinate, the y-axis coordinate, and the z-axis coordinate. 4. The method as in claim 1 , wherein the applying the ink to the surface of the substrate at the three-dimensional coordinate includes applying a predetermined amount of ink to the substrate to achieve the dimension based on the predetermined DIC pattern. 5. The method as in claim 1 , wherein the dimension of the ink on the surface of the substrate is a radius of a printed ink dot in a range of ten (10) micrometers-ten (10) millimeters. 6. The method as in claim 1 , wherein the predetermined DIC pattern is a speckle dot pattern. 7. The method as in claim 6 , further comprising: determining the speckle dot pattern based on optimization rules for the predetermined DIC pattern. 8. The method as in claim 7 , wherein the optimization rules for predetermined DIC pattern include a predetermined dot diameter range and a predetermined dot coverage range for the surface of the substrate. 9. The method as in claim 6 , wherein the one or more locations are locations of one or more dots of the speckle dot pattern and a center position of the one or more dots of the speckle dot pattern are configured to be distributed on a predetermined area of the surface of the substrate based on optimization rules. 10. The method as in claim 1 , wherein the applying the ink to the surface of the substrate includes applying the ink to a flat surface of the substrate. 11. The method as in claim 1 , wherein the applying the ink to the surface of the substrate includes applying the ink to a non-flat surface of the substrate. 12. A computer readable medium having stored thereon in a non-transitory state a program code for use by a computing device, the program code causing the computing device to execute a method of operating a three-dimensional printer system comprising: identifying a three-dimensional coordinate for a dot of one or more dots of a digital image correlation (DIC) pattern to be applied to a surface of a substrate; adjusting a position of a printer head to the three-dimensional coordinate of the dot of the one or more dots of the DIC pattern; and applying ink to the surface of the substrate at the three-dimensional coordinate using the printer head, the ink on the surface of the substrate has a dimension based on the DIC pattern. 13. The computer readable medium as in claim 12 , wherein the method further comprises: providing the three-dimensional coordinate for each of the one or more dots of the DIC pattern based on a location of a surface of a substrate. 14. The computer readable medium as in claim 12 , wherein: the adjusting the position of the printer head to the three-dimensional coordinate of the dot of the one or more dots of the DIC pattern includes adjusting the printer head to an x-axis and y-axis coordinates and lowering the printer head to a z-axis coordinate; and the applying the ink to the surface of the substrate at the three-dimensional coordinate occurs when the printer head is adjusted to the x-axis coordinate, the y-axis coordinate, and the z-axis coordinate. 15. The computer readable medium as in claim 14 , wherein the method further comprises: raising the printer head from the z-axis coordinate after applying the ink to the surface of the substrate; and for each of the one or more dots of the DIC pattern, repeating the adjusting the position of the printer head to the three-dimensional coordinate of the dot of the one or more dots of the DIC pattern, the applying the ink to the substrate at the three-dimensional coordinate, and the raising the printer head from the z-axis coordinate after applying the ink to the substrate. 16. The computer readable medium as in claim 12 , wherein the applying the dot of ink to the substrate at the three-dimensional coordinate includes applying a predetermined volume of ink to the substrate to achieve the dimension based on the DIC pattern. 17. The computer readable medium as in claim 12 , wherein the applying the ink to the surface of the substrate includes applying the ink to a non-flat surface of the substrate. 18. The computer readable medium as in claim 17 , wherein the method further comprises: adjusting a position of the substrate in a z-axis direction when the ink is to be applied to the non-flat surface of the substrate. 19. A three-dimensional printing system comprising: a printer head comprising a syringe configured to hold ink; a structure configured to hold a substrate to which the ink from the syringe is to be applied; a processor; and memory configured to store in a non-transitory state instructions executable by the processor to cause the processor to: adjust a position of the printer head to a three-dimensional coordinate of a dot of one or more dots of a digital image correlation (DIC) pattern to be applied to a surface of the substrate; and apply ink to the surface of the substrate at the three-dimensional coordinate using the printer head, the ink on the surface of the substrate having a dimension on the surface of the substrate based on the DIC pattern. 20. The system as in claim 19 , wherein the dimension of the ink on the surface of the substrate is a radius in a range of ten (10) micrometers-ten (10) millimeters.

Assignees

Inventors

Classifications

  • Processes of additive manufacturing · CPC title

  • Heads; Nozzles · CPC title

  • Embodiments of or processes related to ink-jet heads · CPC title

  • Housings, e.g. machine housings · CPC title

  • Curing or drying the ink on the copy materials, e.g. by heating or irradiating · CPC title

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Frequently asked questions

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What does patent US11660862B2 cover?
A system and method for applying patterns to surfaces. A pattern may be applied to a surface of an object using a three-dimensional (3D) printer system. The 3D printer system may include a printer head including an applicator holding material used to form the pattern on the surface, a structure configured to hold a substrate to which the material will be applied, and a controller for adjusting …
Who is the assignee on this patent?
Wisconsin Alumni Res Found
What technology area does this patent fall under?
Primary CPC classification B41J3/4073. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 30 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).