Three-dimensional hierarchical layered porous copper and method for making the same

US11660839B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11660839-B2
Application numberUS-202117344115-A
CountryUS
Kind codeB2
Filing dateJun 10, 2021
Priority dateFeb 5, 2021
Publication dateMay 30, 2023
Grant dateMay 30, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for making a three-dimensional hierarchical layered porous copper, comprising: stacking a copper layer and a zinc layer, to form a composite; folding the composite in half to form a folded composite, and rolling the folded composite; repeating the folding and the rolling, to form a composite structure being a solid body; annealing the composite structure, to form a copper-zinc alloy precursor, wherein the copper-zinc alloy precursor is a solid body, and the copper-zinc alloy precursor comprises a β′ phase and γ phase; and treating the copper-zinc alloy precursor by electrochemical dealloying. 2. The method of claim 1 , wherein when folding the composite in half to form the folded composite, the zinc layer is inside of the folded composite, and the copper layer is outside of the folded composite. 3. The method of claim 1 , wherein a thickness of the folded composite is defined as 2 d , during rolling the folded composite, the folded composite is rolled until the thickness of the folded composite becomes d. 4. The method of claim 1 , wherein during annealing the composite structure, an annealing temperature is in a range from 250 degrees Celsius to 300 degrees Celsius. 5. The method of claim 1 , wherein the copper-zinc alloy precursor consists of the β′ phase and the γ phase, and an atomic ratio of zinc is in a range from 55% to 60%. 6. The method of claim 1 , wherein treating the copper-zinc alloy precursor by electrochemical dealloying, so that zinc is removed from the copper-zinc alloy precursor. 7. The method of claim 1 , wherein during electrochemical dealloying, an electrolyte is a mixed solution of hydrochloric acid and sodium chloride, and a working electrode is the copper-zinc alloy precursor. 8. The method of claim 1 , wherein during electrochemical dealloying, a potential of potentiostatic polarization is in a range from −0.2V to 0.2V. 9. A method for making a three-dimensional hierarchical layered porous copper, comprising: stacking a copper layer and a zinc layer, to form a composite; folding the composite in half to form a folded composite, and rolling the folded composite; repeating the folding and the rolling, to form a composite structure being a solid body; annealing the composite structure, to form a copper-zinc alloy precursor, wherein the copper-zinc alloy precursor is a solid body, the copper-zinc alloy precursor comprises a β′ phase and a γ phase, and an atomic ratio of zinc is in a range from 55% to 60%; and treating the copper-zinc alloy precursor by electrochemical dealloying. 10. The method of claim 9 , wherein the method for making the three-dimensional hierarchical layered porous copper, consisting of: stacking a copper layer and a zinc layer, to form a composite; folding the composite in half to form a folded composite, and rolling the folded composite; repeating the folding and the rolling, to form a composite structure being a solid body; annealing the composite structure, to form a copper-zinc alloy precursor, wherein the copper-zinc alloy precursor is a solid body, the copper-zinc alloy precursor comprises a β′ phase and a γ phase, and an atomic ratio of zinc is in a range from 55% to 60%; washing the copper-zinc alloy precursor with ultrapure water and absolute ethanol in sequence, and drying; and treating the copper-zinc alloy precursor by electrochemical dealloying. 11. The method of claim 1 , wherein the method for making the three-dimensional hierarchical layered porous copper, consisting of: stacking a copper layer and a zinc layer, to form a composite; folding the composite in half to form a folded composite, and rolling the folded composite; repeating the folding and the rolling, to form a composite structure being a solid body; annealing the composite structure, to form a copper-zinc alloy precursor, wherein the copper-zinc alloy precursor is a solid body, the copper-zinc alloy precursor comprises a β′ phase and a γ phase, and an atomic ratio of zinc is in a range from 55% to 60%; washing the copper-zinc alloy precursor with ultrapure water and absolute ethanol in sequence, and drying; and treating the copper-zinc alloy precursor by electrochemical dealloying.

Assignees

Inventors

Classifications

  • Alloys based on zinc · CPC title

  • Alloys based on titanium · CPC title

  • Alloys based on copper · CPC title

  • characterised by their material · CPC title

  • of copper or alloys based thereon · CPC title

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What does patent US11660839B2 cover?
A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermedi…
Who is the assignee on this patent?
Univ Tsinghua, Hon Hai Prec Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B15/01. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 30 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).