Mold molding apparatus and method for controlling mold molding apparatus

US11660664B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11660664-B2
Application numberUS-201917050126-A
CountryUS
Kind codeB2
Filing dateApr 25, 2019
Priority dateJun 15, 2018
Publication dateMay 30, 2023
Grant dateMay 30, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.

First claim

Opening claim text (preview).

The invention claimed is: 1. A mold molding apparatus comprising: at least one molding sensor that measures a pressure of molding sand exerted (i) on a surface of one or both of a pattern plate and a squeeze feet, or (ii) on a surface of one or both of the pattern plate and a squeeze board, the at least one molding sensor being disposed on the surface of one or both of the pattern plate and the squeeze feet, or on the surface of one or both of the pattern plate and the squeeze board, the molding sand coming into contact with the respective surface; a strength computation unit that computes a casting mold strength based on an output from the at least one molding sensor; and a control device that controls operation of the mold molding apparatus based on the casting mold strength computed by the strength computation unit. 2. The mold molding apparatus according to claim 1 , wherein a plurality of molding sensors, including the at least one molding sensor, are provided on the surface of one or both of the pattern plate and the squeeze feet, or on the surface of one or both of the pattern plate and the squeeze board. 3. The mold molding apparatus according to claim 2 , wherein the at least one molding sensor is selected in accordance with a shape of a product portion of the pattern plate. 4. The mold molding apparatus according to claim 2 , further comprising a display device that, when the outputs from the plurality of molding sensors, including the at least one molding sensor, have a disparity of a predetermined value or larger, displays a warning regarding clogging of an aeration nozzle, clogging of an aeration filter, or clumping of sand in a molding sand hopper, and when the disparity is lower than the predetermined value, the control device continues to control operation of the mold molding apparatus. 5. The mold molding apparatus according to claim 1 , wherein the control device includes a first control unit that controls a squeeze pressure based on the casting mold strength. 6. The mold molding apparatus according to claim 5 , wherein the control device includes a second control unit that controls an aeration pressure based on the casting mold strength. 7. The mold molding apparatus according to claim 6 , wherein the control device includes a third control unit that controls an aeration time based on the casting mold strength. 8. The mold molding apparatus according to claim 7 , wherein the control device includes a fourth control unit that controls a setting position of the squeeze feet or the squeeze board based on the casting mold strength. 9. The mold molding apparatus according to claim 8 , wherein the control device includes a fifth control unit that controls a leveling frame based on the casting mold strength. 10. The mold molding apparatus according to claim 9 , wherein the control device includes a sixth control unit that controls the squeeze feet based on the casting mold strength. 11. The mold molding apparatus according to claim 1 , further comprising a display device that, when the output from the at least one molding sensor is not at least a necessary output value, displays a cause due to which the necessary output is not obtained and a countermeasure therefor. 12. A method for controlling a mold molding apparatus, the method comprising: measuring a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze feet, or on a surface of one or both of the pattern plate and a squeeze board; computing a casting mold strength based on the measured pressure; and controlling operation of the mold molding apparatus based on the computed casting mold strength. 13. The method for controlling the mold molding apparatus according to claim 12 , further comprising measuring the pressure of molding sand in multiple places on the surface of one or both of the pattern plate and the squeeze feet, or on the surface of one or both of the pattern plate and the squeeze board. 14. The method for controlling the mold molding apparatus according to claim 13 , wherein measuring positions of the pressure of molding sand are selected in accordance with a shape of a product portion of the pattern plate. 15. The method for controlling the mold molding apparatus according to claim 13 , further comprising displaying a warning regarding clogging of an aeration nozzle, clogging of an aeration filter, or clumping of sand in a molding sand hopper, when measured pressures at the multiple places on the surface of one or both of the pattern plate and the squeeze feet, or on the surface of one or both of the pattern plate and the squeeze board have a disparity of a predetermined value or larger, and when the disparity is smaller than the predetermined value, the method continues to control the mold molding apparatus. 16. The method for controlling the mold molding apparatus according to claim 12 , further comprising controlling a squeeze pressure based on the casting mold strength. 17. The method for controlling the mold molding apparatus according to claim 12 , further comprising controlling an aeration pressure based on the casting mold strength. 18. The method for controlling the mold molding apparatus according to claim 12 , further comprising controlling an aeration time based on the casting mold strength. 19. The method for controlling the mold molding apparatus according to claim 12 , further comprising controlling a setting position of the squeeze feet or the squeeze board based on the casting mold strength. 20. The method for controlling the mold molding apparatus according to claim 12 , further comprising controlling a leveling frame based on the casting mold strength. 21. The method for controlling the mold molding apparatus according to claim 12 , further comprising controlling the squeeze feet based on the casting mold strength. 22. The method for controlling the mold molding apparatus according to claim 12 , further comprising displaying a cause due to which a necessary pressure is not obtained and a countermeasure therefor, when the measured pressure is not at least the necessary pressure value.

Assignees

Inventors

Classifications

  • B22C19/04Primary

    Controlling devices specially designed for moulding machines · CPC title

  • by a horizontal rotary table or carrier · CPC title

  • with one or more flasks forming part of the machine, from which only the sand moulds made by compacting are removed · CPC title

  • B22C15/08Primary

    involving pneumatic or hydraulic mechanisms · CPC title

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What does patent US11660664B2 cover?
A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls o…
Who is the assignee on this patent?
Sintokogio Ltd
What technology area does this patent fall under?
Primary CPC classification B22C19/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 30 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).