Power module with the integration of control circuit
US-2017012030-A1 · Jan 12, 2017 · US
Electronic module
US11658109B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11658109-B2 |
| Application number | US-201716078602-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 14, 2017 |
| Priority date | Jul 14, 2017 |
| Publication date | May 23, 2023 |
| Grant date | May 23, 2023 |
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- Title
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Abstract
Official abstract text for this publication.
An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending part 113 extending toward one side or the other side. The second terminal part 120 has a second surface direction extending part 124 and a second normal direction extending part 123 extending toward one side or the other side. The second surface direction extending part 124 is provided on one side of the first surface direction extending part 114, and the first surface direction extending part 114 and the second surface direction extending part 124 overlap one another in a surface direction.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electronic module comprising: a first substrate; a first electronic element provided on an upper side of the first substrate; a first connector body provided on an upper side of the first electronic element; a second electronic element provided on an upper side of the first connector body; a second connector body provided on an upper side of the second electronic element, a second substrate provided on an upper side of the second connector body; a first terminal part provided on the upper side of the first substrate and electrically connected to the first electronic element; and a second terminal part provided on a down side of the second substrate and electrically connected to the second electronic element; wherein the first terminal part has a first terminal base end part, a first surface direction extending part that extends along a surface direction of the first substrate, and a first normal direction extending part that is provided at an end part of the first surface direction extending part and extends upward away from the upper side of the first substrate, the second terminal part has a second terminal base end part, a second surface direction extending part that extends along a surface direction of the second substrate, and a second normal direction extending part that is provided at an end part of the second surface direction extending part and extends upward toward upper side of the second substrate, the second surface direction extending part is provided on upper side of the first surface direction extending part, wherein the first surface direction extending part and the second surface direction extending part overlap one another in a surface direction. 2. The electronic module according to claim 1 , wherein the first terminal part has a first bend part that is provided between the first terminal base end part and the first surface direction extending part, and that is bent upward away from the upper side of the first substrate, and the second terminal part has a second bend part that is provided between the second terminal base end part and the second surface direction extending part, and that is bent downward away from down side of the second substrate. 3. The electronic module according to claim 1 , wherein a plurality of first terminal parts is provided, second terminal parts, whose number is equal to the number of the first terminal parts, are provided, each of the second surface direction extending parts is provided on an upper side of each of the first surface direction extending parts.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Multiple chips on leadframes · CPC title
characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title
Package configurations · CPC title
for connecting multiple chips together · CPC title
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Frequently asked questions
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- What does patent US11658109B2 cover?
- An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending…
- Who is the assignee on this patent?
- Shindengen Electric Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10W70/479. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 23 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).