Thermal barrier material exhibiting manufacturability, high toughness and low thermal conductivity
US-2024174574-A1 · May 30, 2024 · US
US11655544B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11655544-B2 |
| Application number | US-201917284635-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 16, 2019 |
| Priority date | Oct 17, 2018 |
| Publication date | May 23, 2023 |
| Grant date | May 23, 2023 |
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A layered stack that can be used as an oxidation and chemical barrier with superalloy substrates, including Ni, Ni—Co, Co, and Ni-aluminide based substrates, and methods of preparing the layered stack. The layer system can be applied to a substrate in a single physical vapor deposition process with no interruption of vacuum conditions.
Opening claim text (preview).
The invention claimed is: 1. A multilayered structure comprising: a. a metallic substrate; and b. a multilayer coating disposed on the metallic substrate comprising: i. a discrete first layer disposed on the metallic substrate, the discrete first layer comprising a Ni-, Co-, Ni—Co-, or Ni-aluminide based material; ii. a discrete second layer disposed on the discrete first layer, the discrete second layer comprising Al, Cr, O, and further comprising a Ni-, Co-, Ni—Co, or Ni-aluminide based material; and iii. a discrete third layer disposed on the discrete second layer, the discrete third layer comprising Al, Cr, and O. 2. The multilayered structure according to claim 1 , wherein at least the metallic substrate is a Ni-based superalloy comprising 38 to 76 wt. % Ni, up to 27 wt. % Cr, and up to 20 wt. % Co or wherein the metallic substrate is a Co-based superalloy comprising 35 to 65 wt. % Co, 19 to 30 wt. % Cr, and up to 35 wt. % Ni. 3. The multilayered structure according to claim 1 , wherein at least the discrete first layer comprises 38 to 76 wt. % Ni, up to 27 wt. % Cr, and up to 20 wt. % Co or wherein the discrete first layer comprises 35 to 65 wt. % Co, 19 to 30 wt. % Cr, and up to 35 wt. % Ni. 4. The multilayered structure according to claim 1 , wherein the metallic substrate is a Ni—Co-based superalloy comprising 40 to 80 wt. % Ni, 9 to 35 wt. % Co, and 10 to 20 wt. % Cr. 5. The multilayered structure according to claim 1 , wherein the discrete first layer comprises 40 to 80 wt. % Ni, 9 to 35 wt. % Co, and 10 to 20 wt. % Cr. 6. The multilayered structure according to claim 1 , wherein the metallic substrate is a Ni-aluminide comprising NiAl, NiAl 3 , or Ni 3 Al with a deviation from nominal composition of ±10 wt. %. 7. The multilayered structure according to claim 1 , wherein the metallic substrate is a single-crystalline Ni-based superalloy comprising 38 to 76 wt. % Ni, up to 27 wt. % Cr, and up to 20 wt. % Co. 8. The multilayered structure according to claim 1 , the discrete first layer comprising a chemical composition that is the same as a chemical composition of the metallic substrate.
including layers graded in composition or physical properties · CPC title
Metal-aluminide intermetallic compounds · CPC title
Electric arc evaporation · CPC title
with at least one metal alloy layer · CPC title
Reactive sputtering or evaporation · CPC title
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