Detection chip, method for operating detection chip, and reaction system

US11654435B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11654435-B2
Application numberUS-201916753115-A
CountryUS
Kind codeB2
Filing dateMar 29, 2019
Priority dateMar 29, 2019
Publication dateMay 23, 2023
Grant dateMay 23, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The detection chip includes a first substrate, a micro-cavity defining layer, a hydrophilic layer, and a hydrophobic layer. The micro-cavity defining layer is on the first substrate and defines a plurality of micro-reaction chambers. Each of the plurality of micro-reaction chambers includes a reaction trap, and the reaction trap includes a sidewall and a bottom. The micro-cavity defining layer includes a spacing region between the plurality of micro-reaction chambers, and the spacing region includes a first region adjacent to the sidewall, and a second region non-adjacent to the sidewall. The hydrophilic layer covers the sidewall and the bottom of each of the plurality of micro-reaction chambers, and the hydrophobic layer covers the second region.

First claim

Opening claim text (preview).

What is claimed is: 1. A detection chip, comprising: a first substrate; a micro-cavity defining layer on the first substrate and defining a plurality of micro-reaction chambers, wherein each of the plurality of micro-reaction chambers comprises a reaction trap, the reaction trap comprises a sidewall and a bottom, the micro-cavity defining layer comprises a spacing region between the plurality of micro-reaction chambers, and the spacing region comprises a first region adjacent to sidewalls of the plurality of micro-reaction chambers, and a second region non-adjacent to the sidewalls of the plurality of micro-reaction chambers; a hydrophilic layer covering the sidewall and the bottom of each of the plurality of micro-reaction chambers; and a hydrophobic layer covering the second region in the spacing region of the micro-cavity defining layer, wherein the hydrophilic layer further covers the first region and the second region in the spacing region of the micro-cavity defining layer, and the hydrophobic layer only covers the hydrophilic layer in the second region excluding the first region, so that the micro-cavity defining layer in the second region is covered by the hydrophilic layer and the hydrophobic layer which are stacked, wherein the detection chip further comprises a control electrode, the control electrode is on the first substrate and is electrically connected to the heating electrode through a via hole or overlapped with the heating electrode, and the control electrode is configured to apply an electrical signal to the heating electrode. 2. The detection chip according to claim 1 , wherein the first region is in a circular ring shape, and a width of the circular ring shape is 2 μm to 5 μm. 3. The detection chip according to claim 1 , further comprising a heating electrode, wherein the heating electrode is on the first substrate and closer to the first substrate than the micro-cavity defining layer, and is configured to heat the plurality of micro-reaction chambers, and orthographic projections of the plurality of micro-reaction chambers on the first substrate are within an orthographic projection of the heating electrode on the first substrate. 4. The detection chip according to claim 1 , wherein the plurality of micro-reaction chambers are arranged in an array on the first substrate. 5. The detection chip according to claim 3 , further comprising a second substrate, wherein the second substrate is opposite to the first substrate, the hydrophobic layer further covers a side, facing the first substrate, of the second substrate, and the micro-cavity defining layer is on a side, facing the second substrate, of the first substrate. 6. The detection chip according to claim 5 , further comprising a control electrode, wherein the control electrode is on the first substrate and is electrically connected to the heating electrode through a via hole or overlapped with the heating electrode, and the control electrode is configured to apply an electrical signal to the heating electrode. 7. The detection chip according to claim 6 , further comprising a first insulating layer, wherein the first insulating layer covers the control electrode, and the heating electrode is on the first insulating layer; and the first insulating layer comprises the via hole penetrating the first insulating layer, and the heating electrode is electrically connected to the control electrode through the via hole. 8. The detection chip according to claim 3 , further comprising a second insulating layer, wherein the second insulating layer is between the heating electrode and the micro-cavity defining layer. 9. The detection chip according to claim 7 , wherein the first substrate comprises a reaction region and a peripheral region, the peripheral region is at least partially around the reaction region, the reaction region comprises a functional region, the micro-cavity defining layer is in the functional region, the control electrode and the via hole are in the peripheral region, and the heating electrode is in the reaction region and the peripheral region. 10. The detection chip according to claim 9 , wherein the via hole comprises a first via hole group and a second via hole group, and the first via hole group and the second via hole group are on two opposite sides of the peripheral region, respectively; the control electrode comprises a first control electrode group and a second control electrode group; the first control electrode group is on a same side as the first via hole group in the peripheral region, and is electrically connected to the heating electrode through the first via hole group; and the second control electrode group extends along the peripheral region and is partially around the heating electrode, and the second control electrode group is electrically connected to the heating electrode through the second via hole group. 11. The detection chip according to claim 9 , further comprising a plurality of spacers, wherein the plurality of spacers are in the peripheral region and between the first substrate and the second substrate, and the plurality of spacers are configured to maintain a distance between the first substrate and the second substrate. 12. The detection chip according to claim 11 , wherein a height of the spacers is greater than a height of the micro-cavity defining layer in a direction perpendicular to the first substrate. 13. The detection chip according to claim 9 , further comprising a sample inlet and a sample outlet, wherein the reaction region further comprises a non-functional region, the sample inlet and the sample outlet are both in the non-functional region and on different sides of the functional region, and both the sample inlet and the sample outlet penetrate the second substrate and the hydrophobic layer covering the second substrate. 14. The detection chip according to claim 13 , wherein the sample inlet and the sample outlet are in the non-functional region and are symmetrically distributed on different sides of the functional region. 15. The detection chip according to claim 9 , further comprising a first temperature sensor, wherein the first temperature sensor is on a side, away from the micro-cavity defining layer, of the first substrate, and the first temperature sensor is in the reaction region and configured to detect a temperature of the reaction region. 16. A reaction system, comprising a control device and the detection chip according to claim 1 , wherein the control device is electrically connected to the detection chip, and is configured to apply an electrical signal to the detection chip to drive a heating electrode of the detection chip. 17. The reaction system according to claim 16 , further comprising a second temperature sensor, wherein the second temperature sensor is on a side, away from the micro-cavity defining layer, of the first substrate of the detection chip, the second temperature sensor is in a reaction region of the first substrate, and the second temperature sensor is configured to detect a temperature of the reaction region of the detection chip. 18. A reaction system, comprising a control device and the detection chip according to claim 15 , wherein the control device is electrically connected to the detection chip, and is configured to apply an electrical signal to the detection chip to drive the heating electrode of the detection chip. 19. A method for operating the detection chip according to claim 1 , comprising: allowing a reaction system liquid

Assignees

Inventors

Classifications

  • having a very large number of wells, microfabricated wells · CPC title

  • Geometry, shape and general structure · CPC title

  • Apparatus for enzymology or microbiology · CPC title

  • Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks · CPC title

  • Laminated structure · CPC title

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What does patent US11654435B2 cover?
The detection chip includes a first substrate, a micro-cavity defining layer, a hydrophilic layer, and a hydrophobic layer. The micro-cavity defining layer is on the first substrate and defines a plurality of micro-reaction chambers. Each of the plurality of micro-reaction chambers includes a reaction trap, and the reaction trap includes a sidewall and a bottom. The micro-cavity defining layer …
Who is the assignee on this patent?
Beijing Boe Technology Dev Co Ltd, Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification B01L7/52. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 23 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).