Display substrate comprising fingerprint recognition sensors, method for manufacturing the same, and display device

Patent metadata

Field	Value
Publication number	US-11653529-B2
Application number	US-202217881045-A
Country	US
Kind code	B2
Filing date	Aug 4, 2022
Priority date	Nov 23, 2018
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

Embodiments of the present disclosure relate to a display substrate, a method for manufacturing the same, and a display device. The display substrate includes a substrate, a pixel definition layer for defining pixels on the substrate, the pixel definition layer including a plurality of inter-pixel portions located between adjacent pixels, and a fingerprint recognition sensor located in the inter-pixel portions.

First claim

What is claimed is:

1. A method for manufacturing a display substrate comprising:
providing a substrate;
forming a pixel definition layer for defining pixels on the substrate, wherein each pixel comprises a light emitting device; and
forming the light emitting devices on the substrate and in the pixel definition layer, the pixel definition layer comprising a plurality of inter-pixel portions located between adjacent light emitting devices,
wherein forming the pixel definition layer comprises forming a fingerprint recognition sensor in the inter-pixel portion,
wherein the fingerprint recognition sensor is an ultrasonic fingerprint recognition sensor, and wherein the ultrasonic fingerprint recognition sensor comprises a generator and a receiver,
wherein forming the ultrasonic fingerprint recognition sensor comprises positioning the generator and the receiver in a same inter-pixel portion, and
wherein forming the ultrasonic fingerprint recognition sensor comprises:
forming a first lower electrode and a second lower electrode in a region for forming the inter-pixel portion on the substrate;
forming a first portion of the inter-pixel portion covering the substrate, the first lower electrode, and the second lower electrode in the region for forming the inter-pixel portion;
forming a first hole exposing the first lower electrode and a second hole exposing the second lower electrode in the first portion of the inter-pixel portion;
forming a first piezoelectric material in the first hole, and forming a second piezoelectric material in the second hole;
forming a first upper electrode on the first portion of the inter-pixel portion and the first piezoelectric material, and forming a second upper electrode on the first portion of the inter-pixel portion and the second piezoelectric material; and
forming a second portion of the inter-pixel portion on the first portion of the inter-pixel portion, the first upper electrode, and the second upper electrode.

2. The method according to claim 1 , wherein forming the first lower electrode and the second lower electrode comprises:
forming a first conductive layer on the substrate; and
patterning the first conductive layer to form the first lower electrode and the second lower electrode in the region for forming the inter-pixel portion,
and wherein forming the first upper electrode and the second upper electrode comprises:
forming a second conductive layer covering the first portion of the inter-pixel portion, the first piezoelectric material and the second piezoelectric material; and
patterning the second conductive layer to form the first upper electrode on the first portion of the inter-pixel portion and the first piezoelectric material and form the second upper electrode on the first portion of the inter-pixel portion and the second piezoelectric material.

3. The method according to claim 2 , wherein
forming the light emitting device comprises:
forming an anode on the substrate, wherein the anode is formed simultaneously with the first lower electrode and the second lower electrode;
forming the light emitting layer on the anode; and
forming a cathode on the light emitting layer and the pixel definition layer.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Qi Mingchun
• Kong Mengxia
• Hu Xuwu
• Si Donghui

Classifications

• H10K59/65

  OLEDs integrated with inorganic image sensors · CPC title

• H10K59/00 Primary

  Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00 · CPC title

• G06V40/1306 Primary

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10N30/857

  Macromolecular compositions · CPC title