Pressure sensor with multiple pressure sensing elements

Patent metadata

Field	Value
Publication number	US-11650119-B2
Application number	US-202117448159-A
Country	US
Kind code	B2
Filing date	Sep 20, 2021
Priority date	Apr 5, 2019
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A pressure sensor includes a substrate, a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on a first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element, thus multiple pressure sensing elements being disposed on a single substrate can reduce material cost and improve the performance of the pressure sensor.

First claim

The invention claimed is:

1. A pressure sensor, comprising:
a substrate having a first surface;
a first tubing port disposed on the first surface, wherein a first pressure sensing element is disposed within the first tubing port; and
a second tubing port disposed on the first surface, wherein a second pressure sensing element is disposed within the second tubing port.

2. The pressure sensor of claim 1 , further comprising:
a sensor conditioning circuitry electronically coupled to the first pressure sensing element and the second pressure sensing element.

3. The pressure sensor of claim 2 , wherein the sensor conditioning circuitry is disposed within the first tubing port.

4. The pressure sensor of claim 2 , wherein the sensor conditioning circuitry multiplexes signals from the first pressure sensing element and the second pressure sensing element.

5. The pressure sensor of claim 2 , wherein the sensor conditioning circuitry amplifies signals from the first pressure sensing element and the second pressure sensing element.

6. The pressure sensor of claim 2 , wherein the sensor conditioning circuitry converts analog signals from the first pressure sensing element and the second pressure sensing element to digital signals.

7. The pressure sensor of claim 2 , wherein the sensor conditioning circuitry is a signal conditioning application-specific integrated circuit (ASIC).

8. The pressure sensor of claim 1 , further comprising:
a first torus piece surrounding the first tubing port; and
a second torus piece surrounding the second tubing port.

9. The pressure sensor of claim 8 , wherein the first torus piece and the second torus piece comprise at least one of rubber material or silicon material.

10. The pressure sensor of claim 1 , wherein the first pressure sensing element is a first micro-electro-mechanical system (MEMS) pressure sensing die, wherein the second pressure sensing element is a second MEMS pressure sensing die.

11. The pressure sensor of claim 1 , wherein the first pressure sensing element and the second pressure sensing element are disposed on the first surface of the substrate.

12. The pressure sensor of claim 1 , further comprising:
a third tubing port disposed on the first surface, wherein a third pressure sensing element is disposed within the third tubing port.

13. The pressure sensor of claim 12 , further comprising:
a sensor conditioning circuitry electronically coupled to the first pressure sensing element, the second pressure sensing element, and the third pressure sensing element.

14. The pressure sensor of claim 13 , wherein the sensor conditioning circuitry is disposed within the second tubing port.

15. The pressure sensor of claim 13 , wherein the sensor conditioning circuitry multiplexes signals from the first pressure sensing element, the second pressure sensing element, and the third pressure sensing element.

16. The pressure sensor of claim 13 , wherein the sensor conditioning circuitry amplifies signals from the first pressure sensing element, the second pressure sensing element and the third pressure sensing element.

17. The pressure sensor of claim 13 , wherein the sensor conditioning circuitry converts analog signals from the first pressure sensing element, the second pressure sensing element, and the third pressure sensing element to digital signals.

18. The pressure sensor of claim 13 , wherein the sensor conditioning circuitry is a signal conditioning application-specific integrated circuit (ASIC).

19. The pressure sensor of claim 12 , wherein the first pressure sensing element is a first micro-electro-mechanical system (MEMS) pressure sensing die, wherein the second pressure sensing element is a second MEMS pressure sensing die, wherein the third pressure sensing element is a third MEMS pressure sensing die.

20. The pressure sensor of claim 12 , wherein the first pressure sensing element, the second pressure sensing element, and the third pressure sensing element are disposed on the first surface of the substrate.

Assignees

• Honeywell Int Inc

Inventors

• Ricks Lamar Floyd
• Bentley Ian
• Cook Jim
• Fribley Josh M

Classifications

• G01L19/147

  Details about the mounting of the sensor to support or covering means · CPC title

• G01L15/00 Primary

  Devices or apparatus for measuring two or more fluid pressure values simultaneously · CPC title

• G01L19/141

  Monolithic housings, e.g. molded or one-piece housings · CPC title

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• G01L19/143 Primary

  Two part housings · CPC title