Temperature probe with improved response time

Patent metadata

Field	Value
Publication number	US-11650106-B2
Application number	US-202017137648-A
Country	US
Kind code	B2
Filing date	Dec 30, 2020
Priority date	Dec 30, 2020
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A temperature probe includes a sheath, a temperature sensitive element, and an insert. The sheath has a sidewall defining an interior space therein. The temperature sensitive element is disposed within the interior space of the sidewall and has an electrical characteristic that varies with temperature. The insert, which is formed of silicon carbide, is operably interposed between the sidewall and the temperature-sensitive element. A method of manufacturing a temperature probe is also provided. A temperature sensing system employing a temperature probe is also provided.

First claim

What is claimed is:

1. A temperature probe comprising:
a metallic sheath having a sidewall defining an interior space therein;
an RTD element disposed within the interior space of the sidewall, the RTD element having an electrical characteristic ne varies with temperature, and
an insert operably interposed between the sidewall and the RTD element, the insert being formed of silicon carbide.

2. The temperature probe of claim 1 , wherein the insert has a cylindrical shape and art outer diameter positioned adject an inner diameter of the sidewall of the metallic sheath.

3. The temperature probe of claim 2 , wherein the RTD element is a wire-wound RTD element having a cylindrical shape With an outer diameter disposed proximate an inner diameter of the insert.

4. The temperature probe of claim 2 , wherein the RTD element is a thin film RTD element having a rectangular shape, wherein the thin film RTD element is disposed within art inner diameter of the insert.

5. The temperature probe of claim 4 , and further comprising insulative powder disposed in spaces between the inner diameter of the insert and the rectangular surface of the thin film RTD element.

6. The temperature probe of claim 5 , and wherein the insulative powder spaces the thin film RTD element front a distal end of the metallic sheath.

7. The temperature probe of claim 2 , wherein the sheath includes an endcap portion welded to the sidewall, and whereM the insert has a length that is, greater than a distance from a distal end of the metallic sheath to the weld.

8. A method of manufacturing a temperature probe, the method comprising:
providing a metallic sheath having an end;
positioning a silicon carbide insert within the metallic sheath, the silicon carbide insert having a bore extending at least partially therethrough;
inserting an RTD element into, the bore of the silicon carbide insert.

9. The method or claim 8 , wherein positioning the silicon carbide insert is pressed into the metallic sheath.

10. The method of claim 8 , wherein the RTD element is a thin film RTD element.

11. The method of claim 10 , and further comprising filling space between a rectangular shape of the thin film RTD element and an inner diameter of the bore of the insert with insulative powder.

12. The method of claim 11 , wherein the insulative powder is magnesium oxide (MgO) powder.

13. The method of claim 8 , wherein the temperature-sensitive element is a solid blank, that is sized and shaped like an RTD.

14. A temperature measurement system comprising:
a thermowell having a distal end and a cylindrical sidewall extending therefrom;
an RTD temperature probe having a metallic sheath disposed within the thermowell;
a silicon carbide insert positioned within the thermowell and disposed about, the temperature probe.

15. The temperature measurement system of claim 14 , wherein the RTD temperature probe includes:
a metallic sheath having a sidewall defining an interior space therein;
an RTD element disposed within the interior space of the sidewall, the RTD element having an electrical resistance that varies with temperature; and
an insert operably interposed between the sidewall and the RTD element, the insert being formed of silicon carbide.

16. The temperature measurement system claim 15 , wherein the RTD element is a thin film RTD element.

17. The temperature measurement system of claim 16 , and further comprising insulative powder disposed in spaces between a rectangular surface of the thin film RTD element and an inner diameter of the silicon carbide insert.

18. The temperature measurement system of claim 15 , wherein the RTD element is a wire-wound RTD element.

19. The temperature measurement system of claim 14 , wherein the temperature probe is a thermocouple probe.

20. The temperature measurement system of claim 14 , wherein an end cap of the temperature probe is disposed in contact with the distal end of the thermowell.

Assignees

• Rosemount Inc

Inventors

• Cavanaugh Jack M
• Loya Nathan S

Classifications

• G01K1/10 Primary

  for preventing chemical attack · CPC title

• G01K7/16 Primary

  using resistive elements · CPC title

• G01K7/06

  the thermoelectric materials being arranged one within the other with the junction at one end exposed to the object, e.g. sheathed type · CPC title

• G01K1/12 Primary

  for preventing damage due to heat overloading · CPC title