Low-dielectric resin composition, low-dielectric resin/metal composite material and preparation method thereof, and electronic equipment

Patent metadata

Field	Value
Publication number	US-11649355-B2
Application number	US-201816608649-A
Country	US
Kind code	B2
Filing date	Mar 28, 2018
Priority date	Apr 27, 2017
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a main resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliaries. The main resin is selected from at least one of PBT resin and PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz.

First claim

What is claimed is:

1. A low-dielectric resin composition, wherein based on 100% by weight of the resin composition, the resin composition comprises 45-70 wt % of a main resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliaries, wherein the main resin is selected from at least one of polybutylene terephthalate (PBT) resin and polyphenylene sulfide (PPS) resin, the chopped glass fiber has a dielectric constant of 4.0 to 4.4 at an electromagnetic wave signal of 1 MHz, and the toughening resin is selected from at least one of ethylene-glycidyl methacrylate copolymers, ethylene-methyl acrylate-glycidyl methacrylate tercopolymers, and maleic anhydride grafted polyolefin resins.

2. The resin composition according to claim 1 , further comprising a polytetrafluoroethylene powder, and based on 100% by weight of the resin composition, the resin composition comprises 45-58 wt % of the base resin, 20-40 wt % of the chopped glass fiber, 10-20 wt % of the polytetrafluoroethylene powder, 1-3 wt % of the toughening resin, 0.2-0.5 wt % of the unmodified glycidyl methacrylate, and 0-10 wt % of the auxiliaries.

3. The resin composition according to claim 2 , wherein a sum of weights of the chopped glass fiber and the polytetrafluoroethylene powder is 40-50 wt % by a total weight of the resin composition.

4. The resin composition according to claim 2 , wherein the polytetrafluoroethylene powder has a particle diameter D50 of 1 μm-20 μm.

5. The resin composition according to claim 1 , wherein the chopped glass fiber comprises silica, boron trioxide, alumina, and calcium oxide; and based on 100% by a total weight of the chopped glass fiber, a content of silica is 50 to 75 wt %, a content of boron trioxide is 10 to 30 wt %, a content of alumina is 5 to 20 wt %, and a content of calcium oxide is 0 to 10 wt %.

6. The resin composition according to claim 1 , wherein the chopped glass fiber is an alkali-free chopped glass fiber; based on 100% by a total weight of the chopped glass fiber, a content of the alkali metal oxide in the chopped glass fiber is less than 2 wt %; and the alkali metal oxide is one or more of Na 2 O, K 2 O and Li 2 O.

7. The resin composition according to claim 1 , wherein the chopped glass fiber has a diameter of 9-17 μm and a length of 2-6 mm.

8. A low-dielectric resin/metal composite material, comprising a low-dielectric resin material layer and a metal material layer, wherein the low-dielectric resin material layer is prepared with the resin composition according to claim 1 .

9. A method for preparing a low-dielectric resin/metal composite material, comprising:
providing a metal material, and pre-treating a surface of the metal material to form nano-pores; and providing a low-dielectric resin composition according to claim 1 , mixing and melting the raw materials in the low-dielectric resin composition to form a low-dielectric resin mixture, and attaching the low-dielectric resin mixture to the surface of the metal material on which nano-pores are formed, to obtain a low-dielectric resin-metal composite material after integral injection molding.

10. The preparation method according to claim 9 , wherein the step of pre-treating the surface of the metal material comprises: anodizing the surface of the metal material in the presence of an acidic etching solution, in which the anodizing condition comprises: electrolyzing the metal material at a temperature of 10 to 30° C. and a voltage of 10 to 100 V for 1 to 40 min with 10 to 30 wt % sulfuric acid as an acidic etching solution.

11. The preparation method according to claim 9 , further comprising after the anodizing treatment in the pretreatment step: immersing the anodized metal material in an alkaline etching solution, wherein the pH of the alkaline etching solution is 10-13; and in the step of immersing, the anodized metal material is alternately immersed with the alkaline etching solution and clean water, in which the number of times of alternate immersion is 2 to 10 times, and the time of each immersion is 1 to 60 min.

12. An electronic device, comprising a shell produced with the low-dielectric resin/metal composite material according to claim 8 .

13. The resin composition according to claim 2 , wherein the polytetrafluoroethylene powder has a particle diameter D50 of 5 μm-12 μm.

14. The resin composition according to claim 1 , wherein the chopped glass fiber is an alkali-free chopped glass fiber; based on 100% by a total weight of the chopped glass fiber, a content of the alkali metal oxide in the chopped glass fiber is less than 1 wt %; and the alkali metal oxide is one or more of Na 2 O, K 2 O and Li 2 O.

Assignees

• Byd Co Ltd

Inventors

• Gong Qing
• Zhou Wei
• Zhang Xiong
• Yu Yue
• Shi Renlan

Classifications

• C08K13/04

  Ingredients characterised by their shape and organic or inorganic ingredients · CPC title

• B29K2067/006

  PBT, i.e. polybutylene terephthalate · CPC title

• B29K2995/0006

  Dielectric · CPC title

• C08K3/36

  Silica · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title