Resin composition, inorganic fine particle-dispersed slurry composition, inorganic fine particle-dispersed sheet, method for manufacturing all-solid-state battery, and method for manufacturing laminated ceramic capacitor

US11649308B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11649308-B2
Application numberUS-201816621005-A
CountryUS
Kind codeB2
Filing dateJun 21, 2018
Priority dateJun 23, 2017
Publication dateMay 16, 2023
Grant dateMay 16, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin composition which has excellent decomposability at low temperature, can provide a molded article having high strength, and enables an increase in the number of layers and thinning so as to enable production of an all-solid-state battery and a ceramic laminate having excellent properties. An inorganic fine particle-dispersed slurry composition containing the resin composition, an inorganic fine particle-dispersed sheet, a method for producing an all-solid-state battery, and a method for producing a multilayer ceramic capacitor. A resin composition containing a (meth)acrylic resin, the (meth)acrylic resin containing 20 to 70% by weight in total of a segment derived from methyl methacrylate and a segment derived from isobutyl methacrylate, 1 to 10% by weight of a segment derived from a glycidyl group-containing (meth)acrylate, and 5 to 40% by weight of a segment derived from a (meth)acrylate containing an ester substituent having a carbon number of 8 or more.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising a (meth)acrylic resin having a glass transition temperature of 40° C. or higher and 60° C. or lower, wherein the (meth)acrylic resin comprises a segment derived from methyl methacrylate, a segment derived from isobutyl methacrylate, a segment derived from a glycidyl group-containing (meth)acrylate, and a segment derived from a (meth)acrylate containing an ester substituent having a carbon number of 8 or more, a total amount of the segment derived from methyl methacrylate and the segment derived from isobutyl methacrylate is 55 to 70% by weight, an amount of the segment derived from a glycidyl group-containing (meth)acrylate is 1 to 10% by weight, an amount of the segment derived from a (meth)acrylate containing an ester substituent having a carbon number of 8 or more is 15 to 40% by weight, the (meth)acrylic resin has a weight average molecular weight (Mw) of 100,000 to 3,000,000, a ratio (Mw/Mn) of a weight average molecular weight (Mw) to a number average molecular weight (Mn) of the (meth)acrylic resin is 2 or higher and 8 or lower, and the (meth)acrylic resin is obtained by copolymerizing a monomer mixture containing 55 to 70% by weight in total of methyl methacrylate and isobutyl methacrylate, 1 to 10 by weight of a glycidyl group-containing (meth)acrylate and 15 to 40% by weight of a (meth)acrylate containing an ester substituent having a carbon number of 8 or more. 2. The resin composition according to claim 1 , wherein in the (meth)acrylate containing an ester substituent having a carbon number of 8 or more, the ester substituent has a carbon number of 8 to 20 and has a branched chain structure. 3. The resin composition according to claim 1 , wherein the (meth)acrylate containing an ester substituent having a carbon number of 8 or more is a (meth)acrylate containing a branched alkyl group having a carbon number of 8 to 20 or a polyalkylene glycol methacrylate having a branched alkylene glycol structure wherein the total number of carbon atoms in the ester substituent is 8 or more. 4. The resin composition according to claim 1 , wherein a weight ratio of the amount of the segment derived from methyl methacrylate to the amount of the segment derived from isobutyl methacrylate in the (meth)acrylic resin is 15:85 to 95:5. 5. The resin composition according to claim 1 , wherein the (meth)acrylic resin molded into a sheet form having a thickness of 20 μm has a maximum stress of 20 N/mm 2 or more in a tensile test. 6. The resin composition according to claim 1 , wherein the amount of the segment derived from a glycidyl group-containing (meth)acrylate is 2 to 10% by weight. 7. An inorganic fine particle-dispersed slurry composition comprising: the resin composition according to claim 1 ; inorganic fine particles; an organic solvent; and a plasticizer. 8. The inorganic fine particle-dispersed slurry composition according to claim 7 , wherein the inorganic fine particles comprise lithium or titanium. 9. The inorganic fine particle-dispersed slurry composition according to claim 7 , wherein the plasticizer comprises: a component derived from adipic acid, triethylene glycol, or citric acid; and an alkyl group having a carbon number of 4 or more, and the plasticizer has a carbon:oxygen ratio of 5:1 to 3:1.

Assignees

Inventors

Classifications

  • and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate · CPC title

  • C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate · CPC title

  • Glass · CPC title

  • Use of inorganic substances as compounding ingredients · CPC title

  • C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate · CPC title

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Frequently asked questions

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What does patent US11649308B2 cover?
A resin composition which has excellent decomposability at low temperature, can provide a molded article having high strength, and enables an increase in the number of layers and thinning so as to enable production of an all-solid-state battery and a ceramic laminate having excellent properties. An inorganic fine particle-dispersed slurry composition containing the resin composition, an inorgan…
Who is the assignee on this patent?
Sekisui Chemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08F220/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 16 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).