Adhesive bonding composition and method of use

Patent metadata

Field	Value
Publication number	US-11648750-B2
Application number	US-202016944877-A
Country	US
Kind code	B2
Filing date	Jul 31, 2020
Priority date	Jun 30, 2014
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

First claim

The invention claimed is:

1. A curable composition comprising:
a polymerizable adhesive composition, wherein the polymerizable adhesive composition comprises at least one photoinitiator and at least one downconverting energy converting material; and
said polymerizable adhesive composition including a sulfur-containing compound comprising at least one of CaS, ZnSeS, and iron sulfate, and capable of being cured by vulcanization of bonds in the polymerizable adhesive composition upon exposure to a first wavelength of radiation which is at least one of x-rays or e-beam, wherein the first wavelength is converted by the at least one downconverting energy converting material to a second wavelength, wherein the second wavelength activates the at least one photoinitiator to both cure the polymerizable adhesive composition and interact with the sulfur-containing compound to cause vulcanization of bonds in the polymerizable adhesive composition.

2. The curable composition of claim 1 , further comprising a primer for application to said surface of the element to be bonded.

3. The curable composition of claim 1 , wherein said downconverting material comprises inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

4. The curable composition of claim 1 , wherein said downconverting material comprises at least one of Y 2 O 3 , Y 2 O 2 S, NaYF 4 , NaYbF 4 , YAG, YAP, Nd 2 O 3 , LaF 3 , LaCl 3 , La 2 O 3 , TiO 2 , LuPO 4 , YVO 4 , YbF 3 , YF 3 , Na-doped YbF 3 , ZnS; ZnSe; MgS; CaS; ZnSe x S y ; ZnSe x S y :Cu, Ag, Ce, Tb; and alkali lead silicate including compositions of SiO 2 , B 2 O 3 , Na 2 O, K 2 O, PbO, MgO, or Ag, and combinations or alloys or layers thereof.

5. The curable composition of claim 4 , wherein the downconverting material comprises a dopant including at least one of Er, Eu, Yb, Tm, Nd, Mn Tb, Ce, Y, U, Pr, La, Gd and other rare-earth species or a combination thereof.

6. The curable composition of claim 1 , wherein said at least one downconverting energy converting material comprises an organic phosphor.

7. The curable composition of claim 6 , wherein the organic phosphor comprises at least one of include anthracene, sulfoflavine, fluorescein, eosin, polyvinyltoluene, styrene, fluors, and rhodamine.

Assignees

• Immunolight Llc

Inventors

• Fathi Zakaryae
• Bourke Jr Frederic A
• Walder Harold

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07311

  Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title