Biosensor apparatus, method of fabricating biosensor apparatus, biosensor chip, and method of detecting target molecule

Patent metadata

Field	Value
Publication number	US-11648558-B2
Application number	US-201916605776-A
Country	US
Kind code	B2
Filing date	May 6, 2019
Priority date	Oct 23, 2018
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A biosensor apparatus is provided. The biosensor apparatus includes a base substrate; a first fluid channel layer on the base substrate and having a first fluid channel passing therethrough; a foundation layer on a side of the first fluid channel layer away from the base substrate, a foundation layer throughhole extending through the foundation layer to connect to the first fluid channel; and a micropore layer on a side of the foundation layer away from the base substrate, a micropore extending through the micropore layer to connect to the first fluid channel through the foundation layer throughhole. The micropore layer extends into the foundation layer throughhole and at least partially covers an inner wall of the foundation layer throughhole.

First claim

What is claimed is:

1. A biosensor apparatus, comprising:
a base substrate;
a first fluid channel layer on the base substrate and having a first fluid channel passing therethrough;
a foundation layer on a side of the first fluid channel layer away from the base substrate, a foundation layer throughhole extending through the foundation layer to connect to the first fluid channel;
a micropore layer on a side of the foundation layer away from the base substrate, a micropore extending through the micropore layer to connect to the first fluid channel through the foundation layer throughhole; and
a first conductive layer on a side of the micropore layer away from the base substrate;
wherein the micropore layer extends into the foundation layer throughhole and at least partially covers an inner wall of the foundation layer throughhole;
the foundation layer comprises a conductive material; and
the micropore layer comprises an insulating material.

2. The biosensor apparatus of claim 1 , wherein the first conductive layer is a unitary electrode, a first conductive layer throughhole extending through the first conductive layer to connect to the micropore.

3. The biosensor apparatus of claim 1 , wherein the first conductive layer comprises two block electrodes spaced apart from each other and on two opposite side of a periphery of the micropore.

4. The biosensor apparatus of claim 1 , wherein the foundation layer comprises an insulating material;
the micropore layer comprises an insulating material;
wherein the biosensor apparatus further comprises:
a detection electrode in the first fluid channel; and
a second conductive layer on a side of the micropore layer away from the base substrate.

5. The biosensor apparatus of claim 1 , wherein the foundation layer comprises an insulating material;
the micropore layer comprises an insulating material;
wherein the biosensor apparatus further comprises a semiconductor layer on a side of the micropore layer away from the base substrate, a semiconductor layer throughhole extending through the semiconductor layer to connect to the micropore.

6. The biosensor apparatus of claim 1 , wherein the foundation layer comprises an insulating material;
the micropore layer comprises a semiconductor material;
wherein the biosensor apparatus further comprises a third conductive layer on a side of the micropore layer away from the base substrate;
wherein the third conductive layer comprises two block electrodes spaced apart from each other and on two opposite side of a periphery of the micropore.

7. The biosensor apparatus of claim 1 , wherein the foundation layer comprising:
an insulating sub-layer on a side of the first fluid channel layer away from the base substrate, the insulating sub-layer comprising an insulating material; and
a conductive sub-layer on a side of the insulating sub-layer away from the base substrate, the conductive sub-layer comprising a conductive material;
wherein the foundation layer is divided into two parts spaced apart from each other by the foundation layer throughhole and a split gap connected to the foundation layer throughhole; and
the micropore layer extends into the split gap and fills in the split gap.

8. The biosensor apparatus of claim 1 , further comprising a capping layer covering an outmost conductive layer of the biosensor apparatus.

9. The biosensor apparatus of claim 1 , further comprising a second fluid channel layer on a side of the micropore layer away from the base substrate and having a second fluid channel passing therethrough, the second fluid channel connected to the micropore.

10. A biosensor chip, comprising the biosensor apparatus of claim 1 .

11. A method of fabricating a biosensor apparatus, comprising:
forming a first fluid channel layer on a base substrate and having a first fluid channel passing therethrough;
forming a foundation layer on a side of the first fluid channel layer away from the base substrate, a foundation layer throughhole formed to extend through the foundation layer to connect to the first fluid channel; and
forming a micropore layer on a side of the foundation layer away from the base substrate, a micropore formed to extend through the micropore layer to connect to the first fluid channel through the foundation layer throughhole;
subsequent to forming the micropore layer, forming a first conductive layer on a side of the micropore layer away from the base substrate;
wherein the micropore layer is formed to extend into the foundation layer throughhole and at least partially covers an inner wall of the foundation layer throughhole;
the foundation layer is formed using a conductive material; and
the micropore layer is formed using an insulating material.

12. The method of claim 11 , wherein forming the first fluid channel layer and forming the foundation layer comprise:
forming a first fluid channel material layer on a base substrate;
forming a foundation material layer on a side of the first fluid channel material layer away from the base substrate;
patterning the foundation material layer to form the foundation layer, the foundation layer formed to have the foundation layer throughhole extending therethrough; and
patterning the first fluid channel material layer to form the first fluid channel layer, the first fluid channel layer formed to have the first fluid channel passing therethrough, the foundation layer throughhole formed to connect to the first fluid channel;
wherein forming the micropore layer comprises depositing a micropore layer material on a side of the foundation layer away from the base substrate;
wherein the micropore layer material is deposited onto an inner wall of the foundation layer throughhole.

13. The method of claim 11 , wherein the foundation layer is formed using an insulating material; and
the micropore layer is formed using an insulating material;
wherein the method further comprises, prior to forming the first fluid channel layer, forming a detection electrode on the base substrate; and
subsequent to forming the micropore layer, forming a second conductive layer on a side of the micropore layer away from the base substrate.

14. The method of claim 11 , wherein the foundation layer is formed using an insulating material; and
the micropore layer is formed using an insulating material;
wherein the method further comprises, subsequent to forming the micropore layer, forming a semiconductor layer on a side of the micropore layer away from the base substrate, a semiconductor layer throughhole formed to extend through the semiconductor layer to connect to the micropore.

15. The method of claim 11 , wherein the foundation layer is formed using an insulating material; and
the micropore layer is formed using a semiconductor material;
wherein the method further comprises, subsequent to forming the micropore layer, forming a third conductive layer on a side of the micropore layer away from the base substrate, the third conductive layer formed to comprise two block electrodes spaced apart from each other and on two opposite side of a periphery of the micropore.

16. The method of claim 11 , wherein the micropore layer is formed using an insulating material;
wherein forming the foundation layer comprises forming an insulating sub-layer on a side of the first fluid channel layer away from the base substrate, the insulating sub-layer formed using an insulating material; and
forming a conductive sub-layer on a side of the insulating sub-layer away from the base substrate, the conductive sub-layer formed using a conductive material;
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Assignees

• Boe Technology Group Co Ltd

Inventors

• Ma Xiaochen
• Yuan Guangcai
• Ning ce
• Gu Xin
• Hu hehe

Classifications

• B01L3/502707 Primary

  characterised by the manufacture of the container or its components · CPC title

• B01L2300/0864

  comprising only one inlet and multiple receiving wells, e.g. for separation, splitting · CPC title

• B01L3/502761 Primary

  specially adapted for handling suspended solids or molecules independently from the bulk fluid flow, e.g. for trapping or sorting beads or physically stretching molecules · CPC title

• G01N27/128

  Microapparatus · CPC title

• B01L2200/0647

  Handling flowable solids, e.g. microscopic beads, cells, particles · CPC title