Piezoelectric substrate attachment structure, sensor module, moving body, and protection body

Patent metadata

Field	Value
Publication number	US-11647675-B2
Application number	US-201716335564-A
Country	US
Kind code	B2
Filing date	Sep 22, 2017
Priority date	Sep 27, 2016
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

A piezoelectric substrate attachment structure including a press section pressed by contact, a piezoelectric substrate provided adjacent to the press section, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section. The following relationship Equation (a) is satisfied:

da/E′a<db/E′b   (a)
wherein da is a thickness of the press section in a direction of adjacency to the piezoelectric substrate, E′a is a storage modulus of the press section from dynamic viscoelastic analysis, db is a thickness of the base section in the adjacency direction, and E′b is a storage modulus of the base section from dynamic viscoelastic analysis.

First claim

The invention claimed is:

1. A piezoelectric substrate attachment structure comprising:
a press section pressed by contact;
a piezoelectric substrate provided adjacent to the press section;
the piezoelectric substrate including an elongate plate-shaped conductor wound around a fiber in one direction and an elongate plate-shaped piezoelectric material helically wound around the conductor in the one direction,
the piezoelectric substrate being continuously fixed to the press section along an axial direction of the piezoelectric substrate, and
a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section,
the piezoelectric substrate attachment structure being configured such that the following relationship Equation (a) is satisfied
da/E′a<db/E′b   (a)

wherein da is a thickness of the press section in a direction of adjacency to the piezoelectric substrate, E′a is a storage modulus of the press section from dynamic viscoelastic analysis, db is a thickness of the base section in the adjacency direction, and E′b is a storage modulus of the base section from dynamic viscoelastic analysis.

2. The piezoelectric substrate attachment structure of claim 1 , wherein the thickness da is in a range of from 0.005 to 50 mm, and the thickness db is in a range of from 0.005 to 100 mm.

3. The piezoelectric substrate attachment structure of claim 1 , wherein the storage modulus E′a is in a range of from 1×10 5 to 1×10 12 Pa, and the storage modulus E′b is in a range of from 1×10 4 to 1×10 10 Pa.

4. The piezoelectric substrate attachment structure of claim 1 , wherein:
the piezoelectric material is a body formed from an organic piezoelectric material.

5. The piezoelectric substrate attachment structure of claim 4 , wherein the organic piezoelectric material includes polylactic acid.

6. The piezoelectric substrate attachment structure of claim 1 , wherein:
the press section, the piezoelectric substrate, and the base section are arranged in this sequence along a direction of pressure-application to the press section.

7. The piezoelectric substrate attachment structure of claim 1 , wherein:
the piezoelectric substrate is provided such that an axial direction of the piezoelectric substrate lies in a direction intersecting a direction of pressure-application.

8. The piezoelectric substrate attachment structure of claim 1 , wherein:
axial direction movement of the piezoelectric substrate is restricted with respect to at least one of the press section or the base section.

9. The piezoelectric substrate attachment structure of claim 1 , wherein:
the press section is an insulator covering an outer periphery of the piezoelectric substrate adjacent to the base section.

10. A sensor module comprising the piezoelectric substrate attachment structure of claim 1 .

11. The sensor module of claim 10 , comprising a main body configured by an integrated unit of the press section and the base section.

12. A moving body comprising:
a shock absorbing member on at least a moving direction side of the moving body; and
the piezoelectric substrate attachment structure of claim 1 ,
the shock absorbing member configuring the base section, and
the press section and the piezoelectric substrate of the attachment structure being mounted to the shock absorbing member.

13. A moving body having the base section of the sensor module according to claim 10 attached to a moving direction side of the moving body.

14. A protection body comprising:
a contact member at a contact portion where the protection body makes external contact; and
the piezoelectric substrate attachment structure of claim 1 ,
the contact member configuring the base section, and
the press section and the piezoelectric substrate of the attachment structure being mounted to the contact member.

15. A protection body in which the sensor module of claim 10 is formed so as to conform to a shape of an object to be protected.

Assignees

• Mitsui Chemicals Inc

Inventors

• Tanimoto Kazuhiro
• Mitsuzuka Masahiko
• Yoshida Mitsunobu

Classifications

• G01L1/16 Primary

  using properties of piezoelectric devices · CPC title

• H10N30/883

  Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings · CPC title

• H10N30/88

  Mounts; Supports; Enclosures; Casings · CPC title

• A41D1/005

  with embedded cable or connector · CPC title

• H10N30/857

  Macromolecular compositions · CPC title