Display substrate, method of fabricating the same, and display panel

Patent metadata

Field	Value
Publication number	US-11644704-B2
Application number	US-202117514446-A
Country	US
Kind code	B2
Filing date	Oct 29, 2021
Priority date	Mar 18, 2021
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

The disclosure provides a display substrate and a method of fabricating the same, and a display panel. The display substrate includes: a substrate; a transistor structure on the substrate; a flexible circuit board having one end coupled to the transistor structure, and the other end capable of being bent to a side of the substrate away from the transistor structure; and a blocking conductive layer on the flexible circuit board and configured to block an interference electric field in an external environment from affecting the display substrate.

First claim

What is claimed is:

1. A display substrate, comprising:
a substrate;
a transistor structure on the substrate;
a flexible circuit board having one end coupled to the transistor structure, and another end capable of being bent to a side of the substrate away from the transistor structure; and
a blocking conductive layer on the flexible circuit board and configured to block an interference electric field in an external environment from affecting the display substrate,
wherein the blocking conductive layer is on a first surface of the flexible circuit board which is a surface of the flexible circuit board away from the transistor structure, and
the display substrate further comprises: a heat dissipation layer on a second surface of the flexible circuit board, the second surface being a surface of the flexible circuit board opposite to the first surface of the flexible circuit board.

2. The display substrate of claim 1 , further comprising:
a conductive wire structure on a side of the transistor structure away from the substrate,
wherein the blocking conductive layer covers at least a portion of the conductive wire structure.

3. The display substrate of claim 2 , wherein the blocking conductive layer is a black conductive tape with an insulation layer, and attached to the first surface of the flexible circuit board and electrically insulated from the flexible circuit board.

4. The display substrate of claim 1 , wherein the blocking conductive layer comprises a black conductive layer, a black conductive adhesive and an insulation layer which are sequentially stacked, and the insulation layer separates and electrically insulates the black conductive adhesive and the black conductive layer from the flexible circuit board.

5. The display substrate of claim 1 , wherein a first portion of the second surface of the flexible circuit board is coupled to the transistor structure, and the heat dissipation layer covers a second portion of the second surface of the flexible circuit board that is different from the first portion.

6. The display substrate of claim 5 , wherein the heat dissipation layer further covers at least a portion of the transistor structure.

7. The display substrate of claim 5 , wherein the heat dissipation layer comprises a first insulation layer, a thermal conductive adhesive layer, and a second insulation layer which are sequentially stacked.

8. The display substrate of claim 1 , wherein the blocking conductive layer and the heat dissipation layer have a one-piece structure.

9. The display substrate of claim 1 , further comprising:
a chip structure on a side of the transistor structure away from the substrate, and between the transistor structure and the blocking conductive layer in a vertical direction.

10. A display panel, comprising:
the display substrate of claim 1 ; and
a backlight module on a side of the substrate of the display substrate away from the transistor structure of the display substrate, wherein the flexible circuit board of the display substrate is bent from the display substrate to a side of the backlight module away from the display substrate, and the blocking conductive layer of the display substrate is bent from the display substrate to the side of the backlight module away from the display substrate.

11. The display panel of claim 10 , further comprising:
a color filter substrate on a side of the transistor structure away from the substrate, and separated from a chip structure of the display substrate in a horizontal direction.

12. The display panel of claim 10 , wherein the heat dissipation layer is bent from the display substrate to the side of the backlight module away from the display substrate.

13. The display panel of claim 10 , wherein the display substrate further comprises a conductive wire structure on a side of the transistor structure away from the substrate,
wherein the blocking conductive layer covers at least a portion of the conductive wire structure.

14. The display panel of claim 13 , wherein a first portion of the second surface of the flexible circuit board is coupled to the transistor structure, and the heat dissipation layer covers a second portion of the second surface of the flexible circuit board that is different from the first portion.

15. The display panel of claim 14 , wherein the heat dissipation layer further covers at least a portion of the transistor structure.

16. The display panel of claim 14 , wherein the heat dissipation layer comprises a first insulation layer, a thermal conductive adhesive layer, and a second insulation layer which are sequentially stacked.

17. The display panel of claim 10 , wherein the blocking conductive layer comprises a black conductive layer, a black conductive adhesive and an insulation layer which are sequentially stacked, and the insulation layer separates and electrically insulates the black conductive adhesive and the black conductive layer from the flexible circuit board.

18. A method of fabricating a display substrate, the display substrate being the display substrate of claim 1 , the method comprising:
forming the transistor structure on the substrate;
forming the flexible circuit board, one end of the flexible circuit board being coupled to the transistor structure; and
forming the blocking conductive layer on the flexible circuit board.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Wang Guohui
• Li Tianma
• Li Liang
• Ji Bin
• Zhang Yicai

Classifications

• H05K9/0022

  of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20) · CPC title

• G02F1/13452

  Conductors connecting driver circuitry and terminals of panels · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/10136

  Liquid Crystal display [LCD] · CPC title

• G02F1/1368

  in which the switching element is a three-electrode device {(G02F1/136277 takes precedence)} · CPC title