Flux coupling sensor

Patent metadata

Field	Value
Publication number	US-11644343-B2
Application number	US-201916963287-A
Country	US
Kind code	B2
Filing date	Jan 22, 2019
Priority date	Jan 22, 2018
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

An apparatus for sensing a position of a target, in particular for offset invariant sensing of the position of the target, is described as well as a corresponding method. The apparatus comprises at least three sensor elements. At least one sensor element of the at least three sensor elements generates a first magnetic field. At least two sensor elements of the at least three sensor elements receive a second magnetic field associated with the first magnetic field. The at least two sensor elements of the at least three sensor elements form at least one sensor element pair and provide a signal indicative of the position of the target.

First claim

The invention claimed is:

1. An apparatus for sensing a position of a target, the apparatus comprising:
a semiconductor chip that includes at least three sensor elements arranged in one or more layers of a substrate of the semiconductor chip;
wherein at least one sensor element of the at least three sensor elements generates a first magnetic field,
wherein at least two sensor elements of the at least three sensor elements receive a second magnetic field associated with the first magnetic field,
wherein the at least two sensor elements of the at least three sensor elements form at least one sensor element pair and provide a signal indicative of the position of the target,
wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field at least partially and spatially overlaps with the at least two sensor elements of the at least three sensor elements such that an at least partial overlap exists between the at least one sensor element of the at least three sensor elements generating the first magnetic field and the at least two sensor elements of the at least three sensor elements, and
wherein the at least partial overlap is configured so that the at least two sensor elements of the at least three sensor elements encounter counteracting magnetic flux from the generated first magnetic field.

2. The apparatus according to claim 1 , wherein the number of sensor elements generating the first magnetic field is lower than the number of sensor elements receiving the second magnetic field.

3. The apparatus according to claim 1 , wherein the number of sensor elements generating the first magnetic field is higher than the number of sensor elements receiving the second magnetic field.

4. The apparatus according to claim 1 , wherein the at least two sensor elements of the at least three sensor elements forming the at least one sensor element pair are operated in a common mode or differential mode.

5. The apparatus according to claim 1 , wherein the second magnetic field is the first magnetic field affected by the target.

6. The apparatus according to claim 1 , wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field is configured to generate an alternating first magnetic field.

7. The apparatus according to claim 1 , wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field is configured to generate a rotational invariant first magnetic field.

8. The apparatus according to claim 1 , wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field spatially surrounds the at least two sensor elements of the at least three sensor elements.

9. The apparatus according to claim 1 , wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field is located at a center of the at least two sensor elements of the at least three sensor elements.

10. The apparatus according to claim 1 , wherein the at least three sensor elements are coils.

11. The apparatus according to claim 1 , wherein the semiconductor chip including the at least three sensor elements is implemented together with means for driving the at least one sensor element generating the first magnetic field and/or means for processing outputted signals from the at least two sensor elements of the at least three sensor elements in one die or a molded package.

12. The apparatus according to claim 1 , wherein the apparatus is configured for offset invariant sensing of the position of the target.

13. The apparatus according to claim 1 , wherein the at least two sensor elements of the at least three sensor elements are symmetrically arranged with respect to the at least one sensor element of the at least three sensor elements generating the first magnetic field.

14. The apparatus according to claim 1 , wherein the at least two sensor elements of the at least three sensor elements are arranged in a first plane of a first layer of the semiconductor chip and the at least one sensor element of the at least three sensor elements generating the first magnetic field is arranged in a second plane of a second layer of the semiconductor chip, the first plane of the first layer of the semiconductor being different than and parallel to the second plane of the second layer of the semiconductor chip.

15. An apparatus for sensing a position of a target, in particular for offset invariant sensing of the position of the target, the apparatus comprising:
at least three sensor elements;
wherein at least one sensor element of the at least three sensor elements generates a first magnetic field,
wherein at least two sensor elements of the at least three sensor elements receive a second magnetic field associated with the first magnetic field and wherein the at least two sensor elements of the at least three sensor elements form at least one sensor element pair and provide a signal indicative of the position of the target,
wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field at least partially and spatially overlaps with the at least two sensor elements of the at least three sensor elements such that an at least partial overlap exists between the at least one sensor element of the at least three sensor elements generating the first magnetic field and the at least two sensor elements of the at least three sensor elements, and
wherein the at least partial overlap is configured so that the at least two sensor elements of the at least three sensor elements encounter counteracting magnetic flux from the generated first magnetic field.

16. A method for sensing the position of a target, the method comprising:
providing a semiconductor chip that includes at least three sensor elements arranged in one or more layers of a substrate of the semiconductor chip;
generating a first magnetic field by at least one sensor element of at least three sensor elements;
receiving a second magnetic field by at least two sensor elements of the at least three sensor elements, wherein the second magnetic field is associated with the first magnetic field, and wherein the at least one sensor element of the at least three sensor elements generating the first magnetic field at least partially and spatially overlaps with the at least two sensor elements of the at least three sensor elements such that an at least partial overlap exists between the at least one sensor element of the at least three sensor elements generating the first magnetic field and the at least two sensor elements of the at least three sensor elements, and
due to the at least partial overlap, the at least two sensor elements of the at least three sensor elements encounter counteracting magnetic flux from the generated first magnetic field; and
calculating a signal from signals outputted by the at least two sensor elements of the at least three sensor elements receiving the second magnetic field, wherein the signal is indicative of the position of the target.

17. The method according to claim 16 , further comprising:
calculating a sum signal from the signals outputted by the at least two sensor elements of the at least three sensor elements receiving the second magnetic field; and
determine the position based at least partially on the calculated sum signal and/or differential signal.

18. The method according to claim 16 , further comprising:
calculating a differential signal from the sign

Assignees

• Melexis Tech Sa

Inventors

• Kluge Wolfram
• Ihle David
• Rudiger Jorg
• Beyer Sascha

Classifications

• G01D5/2225

  by a movable non-ferromagnetic conductive element · CPC title

• G01D5/2053 Primary

  by a movable non-ferromagnetic conductive element · CPC title