Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same

Patent metadata

Field	Value
Publication number	US-11639438-B2
Application number	US-202117479259-A
Country	US
Kind code	B2
Filing date	Sep 20, 2021
Priority date	Nov 6, 2020
Publication date	May 2, 2023
Grant date	May 2, 2023

Abstract

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:

First claim

What is claimed is:

1. An epoxy resin composition for encapsulation of semiconductor devices, the epoxy resin composition comprising:
an epoxy resin;
a curing agent;
an inorganic filler; and
a curing catalyst,
wherein:
the epoxy resin includes an epoxy resin represented by Formula 1:

in Formula 1,
X is O, S, C(═O), a substituted or unsubstituted C 1 to C 5 alkylene group, or NH;
one of R 1 , R 2 , R 3 , R 4 , and R 5 is a group represented by Formula 2, and
remaining ones of R 1 , R 2 , R 3 , R 4 , and R 5 are each independently hydrogen, a halogen, an amino group (—NH 2 ), a cyano group (—CN), a hydroxyl group (—OH), a substituted or unsubstituted C 1 to C 20 alkyl group, a substituted or unsubstituted C 3 to C 20 cycloalkyl group, a substituted or unsubstituted C 6 to C 20 aryl group, or a substituted or unsubstituted C 7 to C 20 arylalkyl group;
one of R 6 , R 7 , R 8 , R 9 , and R 10 is a group represented by Formula 2,
remaining ones of R 6 , R 7 , R 8 , R 9 , and R 10 are each independently hydrogen, a halogen, an amino group, a cyano group, a hydroxyl group, a substituted or unsubstituted C 1 to C 20 alkyl group, a substituted or unsubstituted C 3 to C 20 cycloalkyl group, a substituted or unsubstituted C 6 to C 20 aryl group, or a substituted or unsubstituted C 7 to C 20 arylalkyl group,

in Formula 2,
* is a linking site, and
R 11 is a substituted or unsubstituted C 1 to C 10 alkylene group.

2. The epoxy resin composition as claimed in claim 1 , wherein:
the epoxy resin represented by Formula 1 is represented by Formula 1-1, Formula 1-2, or Formula 1-3:

in Formulae 1-1, 1-2, and 1-3,
X is defined the same as that of Formula 1;
R 11 and R 12 are each independently a substituted or unsubstituted C 1 to C 10 alkylene group; and
R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are each independently hydrogen, a halogen, an amino group, a cyano group, a hydroxyl group, a substituted or unsubstituted C 1 to C 20 alkyl group, a substituted or unsubstituted C 3 to C 20 cycloalkyl group, a substituted or unsubstituted C 6 to C 20 aryl group, or a substituted or unsubstituted C 7 to C 20 arylalkyl group.

3. The epoxy resin composition as claimed in claim 2 , wherein, in Formulae 1-1, 1-2, and 1-3, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are each independently hydrogen or a substituted or unsubstituted C 1 to C 3 alkyl group.

4. The epoxy resin composition as claimed in claim 1 , wherein the epoxy resin represented by Formula 1 is present in the epoxy resin composition in an amount of about 2 wt % to about 17 wt %, based on a total weight of the epoxy resin composition.

5. The epoxy resin composition as claimed in claim 1 , wherein the inorganic filler includes alumina.

6. The epoxy resin composition as claimed in claim 1 , wherein the epoxy resin composition includes:
about 2 wt % to about 17 wt % of the epoxy resin;
about 0.5 wt % to about 13 wt % of the curing agent;
about 70 wt % to about 95 wt % of the inorganic filler; and
about 0.01 wt % to about 5 wt % of the curing catalyst, all wt % being based on a total weight of the epoxy resin composition.

7. A semiconductor device encapsulated using the epoxy resin composition for encapsulation of semiconductor devices as claimed in claim 1 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Park Yong Yeop
• Lee Dong Hwan
• Bae Kyoung Chui
• Seo Min Joon
• Lee Chui Ho

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C08G59/688

  containing phosphorus · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title