Invisible headliner microphone

US11638077B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11638077-B2
Application numberUS-202117393008-A
CountryUS
Kind codeB2
Filing dateAug 3, 2021
Priority dateMay 25, 2018
Publication dateApr 25, 2023
Grant dateApr 25, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the microphone element. A vehicle cabin side of the headliner is covered by an acoustically transparent layer such that the microphone assembly is not visible within the vehicle cabin.

First claim

Opening claim text (preview).

What is claimed is: 1. A headliner assembly for a vehicle comprising: a headliner comprised of an acoustically transparent layer that is exposed to a cabin of the vehicle and a base substrate layer defining a first opening; and a microphone assembly including a housing that defines an integrally-formed hollow shaft element that is configured to be received by the first opening to define an air path, and a microphone element mounted to a circuit board and aligned with the air path such that the air path directs sound from the cabin to the microphone element, wherein the circuit board defines a second opening that is axially aligned with the microphone element such that the air path directs sound from the cabin through the second opening and to the microphone element. 2. The headliner assembly of claim 1 , further comprising a gasket element installed between the circuit board and the shaft element and extending the air path. 3. The headliner assembly of claim 2 , wherein an inner surface of the gasket element is conically-shaped with a radius that matches that of the shaft element at a contact point with the shaft element and that decreases toward the circuit board. 4. The headliner assembly of claim 1 , wherein the shaft element defines a conically-shaped inner surface. 5. The headliner assembly of claim 1 , wherein the second opening of the circuit board is axially aligned with the first opening of the base substrate layer. 6. The headliner assembly of claim 5 , wherein the circuit board defines a second opening that is axially aligned with the microphone element such that the air path directs sound from the cabin through the second opening and to the microphone element. 7. The headliner assembly of claim 1 , wherein the second opening of the circuit board is aligned with the first opening of the base substrate layer. 8. A headliner assembly for a vehicle comprising: a headliner comprised of an acoustically transparent layer that is exposed to a cabin of the vehicle and a base substrate layer defining a first opening; a microphone assembly including a housing that defines an integrally-formed hollow shaft element that is configured to be received by the first opening to define an air path, and a microphone element mounted to a circuit board and aligned with the air path such that the air path directs sound from the cabin to the microphone element; and a gasket element installed between the circuit board and the shaft element and extending the air path, wherein an inner surface of the gasket element is conically-shaped with a radius that matches that of the shaft element at a contact point with the shaft element and that decreases toward the circuit board. 9. The headliner assembly of claim 8 , wherein the shaft element defines a conically-shaped inner surface.

Assignees

Inventors

Classifications

  • Acoustic transducers and sound field adaptation in vehicles · CPC title

  • H04R1/08Primary

    Mouthpieces; {Microphones;} Attachments therefor · CPC title

  • for microphones (H04R1/24, H04R1/26 take precedence) · CPC title

  • H04R1/083Primary

    Special constructions of mouthpieces · CPC title

  • for microphones or earphones · CPC title

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Frequently asked questions

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What does patent US11638077B2 cover?
A microphone assembly includes a shaft element that is configured to be received in an opening defined by a base substrate layer of a headliner. The shaft element defines an air path. The microphone assembly includes a microphone element mounted on a circuit board within a housing. The microphone element is aligned with the air path such that the air path directs sound from the cabin to the mic…
Who is the assignee on this patent?
Harman Becker Automotive Systems Gmbh
What technology area does this patent fall under?
Primary CPC classification H04R1/08. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 25 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).