Microcavity-enhanced optical bolometer

US11635330B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11635330-B2
Application numberUS-202117335017-A
CountryUS
Kind codeB2
Filing dateMay 31, 2021
Priority dateJan 26, 2021
Publication dateApr 25, 2023
Grant dateApr 25, 2023

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Optical microcavity resonance measurements can have readout noise matching the fundamental limit set by thermal fluctuations in the cavity. Small-heat-capacity, wavelength-scale microcavities can be used as bolometers that bypass the limitations of other bolometer technologies. The microcavities can be implemented as photonic crystal cavities or micro-disks that are thermally coupled to strong mid-IR or LWIR absorbers, such as pyrolytic carbon columns. Each microcavity and the associated absorber(s) rest on hollow pillars that extend from a substrate and thermally isolate the cavity and the absorber(s) from the rest of the bolometer. This ensures that thermal transfer to the absorbers is predominantly from radiation as opposed to from conduction. As the absorbers absorb thermal radiation, they shift the resonance wavelength of the cavity. The cavity transduces this thermal change into an optical signal by reflecting or scattering more (or less) near-infrared (NIR) probe light as a function of the resonance wavelength shift.

First claim

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The invention claimed is: 1. A device for imaging thermal infrared radiation, the device comprising: an array of pixels, each pixel in the array of pixels comprising an absorbing material to absorb incident thermal infrared radiation and a photonic crystal cavity in thermal communication with the absorbing material, absorption of the incident thermal infrared radiation by the absorbing material causing a shift in a resonance of the photonic crystal cavity; a coherent light source, in optical communication with the array of pixels, to couple probe light to the photonic crystal cavities, the probe light probing the shifts in the resonances of the photonic crystal cavities; a beam splitter, in optical communication with the coherent light source, to split off a portion of the probe light as a local oscillator reference signal; and a detector array, in optical communication with the array of pixels, to detect interference of the probe light scattered by the photonic crystal cavities with the local oscillator reference signal, the interference representing the shifts in the resonances of the photonic crystal cavities. 2. The device of claim 1 , wherein the absorbing material comprises a pyrolytic carbon pillar having a diameter of about 2 μm to about 3 μm and a height of about 3 μm to about 10 μm. 3. The device of claim 1 , wherein the absorbing material comprises at least one of pyrolytic carbon pillars, vertically aligned carbon nanotubes, a layer of nanostructured black gold, a ceramic layer, or a polymer layer. 4. The device of claim 1 , wherein the incident thermal infrared radiation comprises at least one of mid-infrared radiation or long-wave infrared radiation. 5. The device of claim 1 , wherein the resonance of the photonic crystal cavity has a center wavelength of between about 1450 nm and about 1650 nm. 6. The device of claim 1 , further comprising: a substrate; and hollow pillars, extending from the substrate, to support pixels in the array of pixels above the substrate and to thermally isolate the array of pixels from the substrate. 7. The device of claim 6 , wherein each of the hollow pillars has a diameter of about 1.0 μm to about 1.5 μm, a height of about 1.5 μm to about 2.5 μm, and a thickness of about 20 nm to about 40 nm. 8. The device of claim 6 , wherein the substrate is coated with at least one of an indium tin oxide layer or an anti-reflection coating. 9. The device of claim 1 , further comprising: a substrate; and tethers, extending from the substrate, to support pixels in the array of pixels above the substrate and to thermally isolate the array of pixels from the substrate. 10. The device of claim 1 , further comprising: a metasurface, in optical communication with the array of pixels, the coherent light source, and the detector array, to direct the probe light from the coherent light source to the array of pixels and to direct the probe light scattered by the photonic crystal cavities to the detector array. 11. The device of claim 1 , further comprising: a waveguide, in optical communication with the coherent light source and evanescently coupled to the array of pixels, to guide the probe light from the coherent light source and to evanescently couple the probe light to the photonic crystal cavities in the array of pixels. 12. A device for imaging thermal infrared radiation, the device comprising: an array of pixels, each pixel in the array of pixels comprising an absorbing material to absorb incident thermal infrared radiation and a photonic crystal cavity in thermal communication with the absorbing material, absorption of the incident thermal infrared radiation by the absorbing material causing a shift in a resonance of the photonic crystal cavity; a light source, in optical communication with the array of pixels, to couple probe light to and from the photonic crystal cavities, the probe light probing the shifts in the resonances of the photonic crystal cavities; a detector array, in optical communication with the array of pixels, to detect the probe light scattered by the photonic crystal cavities; a substrate; and hollow pillars, extending from the substrate, to support pixels in the array of pixels above the substrate and to thermally isolate the array of pixels from the substrate, wherein the hollow pillars support the array of pixels above the substrate by a distance of about λ LWIR /4, where λ LWIR is a median wavelength of the incident thermal infrared radiation. 13. A method of making an optical bolometer, the method comprising: forming a photonic crystal cavity in a first substrate; forming an absorbing pyrolytic carbon pillar on the first substrate in thermal communication with the photonic crystal cavity; separating a stamp comprising the photonic crystal cavity and the absorbing pyrolytic carbon pillar from the first substrate; and disposing the stamp on supports extending from a second substrate, the supports thermally isolating the stamp from the second substrate. 14. The method of claim 13 , wherein forming the absorbing pyrolytic carbon pillar on the first substrate comprises: forming a pillar made of polymer on the first substrate; and pyrolyzing the pillar to yield the absorbing pyrolytic carbon pillar. 15. The method of claim 14 , wherein forming the pillar on the first substrate comprises forming the pillar about 7 μm to about 10 μm from the photonic crystal cavity. 16. The method of claim 14 , wherein, after the pyrolyzing, the pillar has a diameter of about 2 μm to about 3 μm and a height of about 3 μm to about 10 μm. 17. The method of claim 13 , further comprising, before disposing the stamp on the supports: forming a polymer mold on the second substrate; disposing an oxide layer on the polymer mold; forming a hole in the oxide layer; and removing the polymer mold from under the oxide layer through the hole in the oxide layer to yield one of the supports. 18. The method of claim 17 , wherein each support has a diameter of about 1.0 μm to about 1.5 μm, a height of about 1.5 μm to about 2.5 μm, and a thickness of about 20 nm to about 40 nm. 19. The method of claim 17 , further comprising: coating the second substrate with at least one of an indium tin oxide layer or an anti-reflection coating. 20. The method of claim 13 , further comprising: disposing a metasurface in optical communication with the photonic crystal cavity to direct probe light from a light source to the photonic crystal cavity and to direct the probe light scattered by the photonic crystal cavity to a detector array. 21. A device for imaging mid-infrared (IR) and/or long-wave infrared (LWIR) radiation, the device comprising: a substrate; an array of pixels, each pixel in the array of pixels comprising at least one pyrolytic carbon pillar to absorb incident mid-IR and/or LWIR radiation and a photonic crystal cavity in thermal communication with the at least one pyrolytic carbon pillar, absorption of the incident mid-IR and/or LWIR radiation by the at least one pyrolytic carbon pillar causing a shift in a resonance of the photonic crystal cavity; hollow pillars, extending from the substrate, to support each pixel in the array of pixels above the substrate and to thermally isolate the array of pixels from the substrate; a light source, in optical communication with the array of pixels, to couple probe light to the photonic crystal cavities, the probe light probing the shifts in the resonances of the photonic crystal cavities; and a detector a

Assignees

Inventors

Classifications

  • using capacitors, e.g. pyroelectric capacitors · CPC title

  • using change of resonant frequency, e.g. of piezoelectric crystals · CPC title

  • by beating two waves of a same source but of different frequency and measuring the phase shift of the lower frequency obtained · CPC title

  • Waveguides · CPC title

  • G01J5/0853Primary

    having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid · CPC title

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What does patent US11635330B2 cover?
Optical microcavity resonance measurements can have readout noise matching the fundamental limit set by thermal fluctuations in the cavity. Small-heat-capacity, wavelength-scale microcavities can be used as bolometers that bypass the limitations of other bolometer technologies. The microcavities can be implemented as photonic crystal cavities or micro-disks that are thermally coupled to strong …
Who is the assignee on this patent?
Massachusetts Inst Technology
What technology area does this patent fall under?
Primary CPC classification G01J5/0853. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 25 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).