Vapor chamber and manufacturing method of the same

Patent metadata

Field	Value
Publication number	US-11635263-B2
Application number	US-202016870297-A
Country	US
Kind code	B2
Filing date	May 8, 2020
Priority date	May 10, 2019
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

First claim

What is claimed is:

1. A heat dissipating device, comprising:
a second casing coupled to a first casing, the first casing including a recessed portion, wherein
the recessed portion at least partially defines an evaporator section of the heat dissipating device,
a condenser section of the heat dissipating device is disposed surrounding the recessed portion,
the first casing and the second casing enclose an internal space of the heat dissipating device,
a plurality of first support structures are arranged in the recessed portion,
a plurality of second support structures are arranged in the condenser section, and
a plurality of heat transfer structures are arranged in the recessed portion,
wherein at least one first support structure of the plurality of first support structures is arranged on at least one heat transfer structure of the plurality of heat transfer structures, and
wherein the plurality of heat transfer structures are arranged in parallel and extending away in order of increasing lengths from a central portion of the recessed portion.

2. The heat dissipating device of claim 1 , further comprising a wick structure disposed in the recessed portion.

3. The heat dissipating device of claim 1 , wherein the plurality of heat transfer structures are rectangular-shaped and arranged parallel to each other in a staggered formation in the recessed portion.

4. The heat dissipating device of claim 3 , wherein the plurality of heat transfer structures are arranged in parallel rows and each row includes two heat transfer structures.

5. The heat dissipating device of claim 3 , wherein the plurality of heat transfer structures are arranged in parallel rows and each row includes a single heat transfer structure.

6. The heat dissipating device of claim 1 , wherein the plurality of heat transfer structures are arranged in parallel rows, each row including a single heat transfer structure, and
one or more first support structures of the plurality of first support structures are arranged in one or more rows of the heat transfer structures.

7. The heat dissipating device of claim 1 , wherein the plurality of heat transfer structures are arranged in two or more rows, and
and each row includes two or more heat transfer structures arranged parallel to each other.

8. The heat dissipating device of claim 7 , wherein one or more first support structures of the plurality of first support structures are arranged in one or more rows of the heat transfer structures.

9. The heat dissipating device of claim 1 , wherein the first casing includes a bonding edge along all sides of the first casing and enclosing the internal space, and
at least one side includes an opening in the bonding edge.

10. The heat dissipating device of claim 1 , wherein
the first casing and second casing each include an inner surface that faces the internal space, and wherein
a wick structure is disposed on each of the inner surfaces, on one or more of the plurality of heat transfer structures, and on one or more of the plurality of first support structures.

Assignees

• Cooler Master Co Ltd

Inventors

• Chen Chi-Lung

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/0233 Primary

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20318

  Condensers · CPC title

• F28D15/04 Primary

  with tubes having a capillary structure · CPC title