LED luminaire having enhanced thermal management

Patent metadata

Field	Value
Publication number	US-11635197-B2
Application number	US-202117553029-A
Country	US
Kind code	B2
Filing date	Dec 16, 2021
Priority date	Feb 8, 2016
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.

First claim

The invention claimed is:

1. A luminaire comprising:
a driver assembly comprising a driver heatsink having an interior in which a circuit board assembly is positioned; and
a LED assembly comprising an array of light emitting diodes and a heatsink, wherein the driver assembly is vertically integrated over an aperture in the LED assembly to divide an air flow passing through the aperture, with a first portion of the divided airflow contacting the heatsink of the LED assembly and a second portion of the divided air flow contacting an exterior of the driver heatsink.

2. The luminaire of claim 1 , wherein the aperture is in a central region of the LED assembly.

3. The luminaire of claim 1 , wherein the aperture is offset from a central region of the LED assembly.

4. The luminaire of claim 1 , wherein the driver heatsink is thermally isolated from the LED heat sink.

5. The luminaire of claim 1 , wherein the driver heatsink interior includes a recess in which one or more capacitors of the circuit board assembly are positioned.

6. The luminaire of claim 5 , wherein the one or more capacitors are located to the circuit board assembly base.

7. The luminaire of claim 1 , wherein the driver assembly comprises an endcap assembly including an endplate having one or more components coupling the LED assembly to the driver assembly.

8. The luminaire of claim 1 , wherein the circuit board assembly comprises a card edge for electrical connection with the LED assembly via a wire harness assembly.

9. The luminaire of claim 1 , wherein the driver assembly further comprises a ground contact fastener coupling the circuit board to the driver heatsink.

10. The luminaire of claim 1 , wherein the LED assembly comprises a plurality of LED boards.

11. The luminaire of claim 10 , wherein the LED boards are arranged to define the aperture.

12. The luminaire of claim 1 further comprising a sensor assembly positioned in the aperture of the LED assembly.

13. The luminaire of claim 12 , wherein the sensor assembly is recessed in the aperture, precluding light from the LED assembly from directly striking the sensor assembly.

14. The luminaire of claim 12 , wherein the sensor assembly is connected directly to the driver assembly.

15. The luminaire of claim 1 , wherein the LED assembly comprises one or more optical components satisfying spacing criterion of 0.7 to 2.0.

16. The luminaire of claim 1 , wherein the LED assembly comprises a monolithic lens array.

17. The luminaire of claim 16 , wherein the monolithic lens array is field interchangeable.

18. The luminaire of claim 1 having a light output of 15,000 to 70,000 lumens at an efficiency of at least 125 lumens per watt.

19. The luminaire of claim 1 , wherein the driver assembly has a thermal resistance of 0.57° C./W to 1° C./W.

20. The luminaire of claim 19 having a color rendering index (CRI) of at least 70 and a correlated color temperature of 4000K.

Assignees

• Ideal Ind Lighting Llc

Inventors

• Bendtsen Andrew
• Wilcox Kurt
• Karpichev Boris
• Roberts John
• Goelz David
• Keiter Douglas E
• Bernard Randy

Classifications

• F21V23/0464

  the sensor sensing the level of ambient illumination, e.g. dawn or dusk sensors · CPC title

• F21V23/007

  enclosed in a casing · CPC title

• F21V23/0478

  by means of an image recording device, e.g. a camera · CPC title

• F21V31/005

  Sealing arrangements therefor · CPC title

• F21V29/74 Primary

  with fins or blades · CPC title