Resin composition

Patent metadata

Field	Value
Publication number	US-11634615-B2
Application number	US-201816614351-A
Country	US
Kind code	B2
Filing date	May 18, 2018
Priority date	May 18, 2017
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.

First claim

What is claimed is:

1. A resin composition comprising one or more 2-methylene-1,3-dicarbonyl compounds, wherein:
at least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000;
an amount by weight of 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative to a totality of the 2-methylene-1,3-dicarbonyl compounds is 0.00 to 0.05, with an amount by weight of the totality of the 2-methylene-1,3-dicarbonyl compounds being 1; and
the one or more 2-methylene-1,3-dicarbonyl compounds comprise a structural unit represented by formula (I):

wherein the resin composition comprises at least one 2-methylene-1,3-dicarbonyl compound comprising two or more structural units represented by formula (I) and at least one 2-methylene-1,3-dicarbonyl compound having only one structural unit represented by formula (I); and
wherein an amount by weight of the at least one 2-methylene-1,3-dicarbonyl compound comprising two or more structural units represented by formula (I) relative to the totality of the 2-methylene-1,3-dicarbonyl compounds is 0.05 to 0.95, with the amount by weight of the totality of the 2-methylene-1,3-dicarbonyl compounds being 1.

2. The resin composition according to claim 1 , substantially free of any 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220.

3. The resin composition according to claim 1 , wherein the one or more 2-methylene-1,3-dicarbonyl compounds are represented by formula (II):

wherein:
X 1 and X 2 each, independently, represent a single bond, O or NR 3 , wherein R 3 represents hydrogen or a monovalent hydrocarbon group; and
R 1 and R 2 are each, independently, hydrogen, a monovalent hydrocarbon group, or represented by formula (III):

wherein:
X 3 and X 4 each, independently, represent a single bond, O or NR 5 , wherein R 5 represents hydrogen or a monovalent hydrocarbon group;
W represents a spacer; and
R 4 represents hydrogen or a monovalent hydrocarbon group.

4. The resin composition according to claim 1 , further comprising (A) an inorganic filler.

5. The resin composition according to claim 1 , further comprising (B) a curing catalyst.

6. The resin composition according to claim 1 , further comprising (C) a stabilizer.

7. The resin composition according to claim 1 , wherein an amount by weight of the one or more 2-methylene-1,3-dicarbonyl compounds relative to the resin composition is 0.01 to 1.00.

8. The resin composition according to claim 1 , wherein an amount by weight of one or more 2-methylene-1,3-dicarbonyl compounds having a vapor pressure of 0.01 mmHg or more at 25° C. relative to the totality of the 2-methylene-1,3-dicarbonyl compounds is 0.00 to 0.05, with the amount by weight of the totality of the 2-methylene-1,3-dicarbonyl compounds being 1.

9. The resin composition according to claim 1 , wherein the resin composition is curable by heat.

10. A cured product obtained by curing the resin composition according to claim 1 .

11. An adhesive or sealing material comprising the resin composition according to claim 1 .

12. A semiconductor device comprising a cured product of the adhesive or sealing material according to claim 11 .

13. A film or prepreg comprising the resin composition according to claim 1 .

14. A semiconductor device comprising a cured product of the film or prepreg according to claim 13 .

15. A semiconductor device comprising the cured product according to claim 10 .

16. A method for producing a semiconductor device having an electronic component and a circuit board, the method comprising:
providing an electronic component and a circuit board;
applying the resin composition according to claim 1 to the surface of the electronic component or the circuit board; and
contacting the electronic component and the circuit board.

17. A method for producing a sealed electronic component, comprising:
providing an electronic component; and
sealing the electronic component using the resin composition according to claim 1 .

18. A method for producing an electronic component, comprising:
providing a plurality of members to be incorporated in an electronic component;
applying the resin composition according to claim 1 to the surface of a member to be incorporated in the electronic component; and
contacting the member with another member to be incorporated in the electronic component.

19. A method for producing a member to be incorporated in an electronic component, comprising:
providing a circuit board comprising an electronic circuit; and
applying the resin composition according to claim 1 onto the electronic circuit on the circuit board.

Assignees

• Namics Corp

Inventors

• Arai Fuminori
• Iwaya Kazuki

Classifications

• H10W76/60

  Seals · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title