Vehicle seat back and method of manufacturing the same

US11634052B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11634052-B2
Application numberUS-202117464269-A
CountryUS
Kind codeB2
Filing dateSep 1, 2021
Priority dateNov 9, 2018
Publication dateApr 25, 2023
Grant dateApr 25, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A vehicle seat back may include an integrated suspension structure including a suspension wire and suspension mounting guides coupled to both sides of the suspension wire; and a seat back pad foamed for integrating with the integrated suspension structure in a state in which the integrated suspension structure is inserted into a mold for seat back pad formation.

First claim

Opening claim text (preview).

What is claimed is: 1. A vehicle seat back comprising: an integrated suspension structure including a suspension wire and suspension mounting guides coupled to a first portion and a second portion of the suspension wire; and a seat back pad foamed for integrating with the integrated suspension structure, wherein the suspension wire includes: a plurality of horizontal wires; a plurality of vertical wires connected perpendicular to the plurality of horizontal wires; and a plurality of hook wires extending obliquely forward from distal end portions of the horizontal wires; wherein each of the suspension mounting guides has: a support groove formed for insertion of a seat back frame; and hook fastening holes formed in a front of the support groove for insertion of the plurality of hook wires of the suspension wire into the hook fastening holes; and wherein a side airbag guide is formed to protrude from at least one of the suspension mounting guides in a direction away from the suspension wire, and the side airbag guide is integrally formed with the suspension mounting guides. 2. The vehicle seat back of claim 1 , wherein the seat back pad is foamed for integrating with the integrated suspension structure while the integrated suspension structure is inserted into a mold for seat back pad formation. 3. The vehicle seat back of claim 1 , wherein the integrated suspension structure is embedded in the seat back pad during foaming of the seat back pad, and support grooves formed in the suspension mounting guides are exposed to an outside of the seat back pad. 4. The vehicle seat back of claim 3 , wherein end portions of a side plate of a seat back frame are inserted into the support grooves of the suspension mounting guides.

Assignees

Inventors

Classifications

  • Moulds · CPC title

  • Attachment or adjustment thereof · CPC title

  • B60N2/64Primary

    Back-rests {or cushions (B60N2/2222 takes precedence)} · CPC title

  • B60N2/7094Primary

    Upholstery springs · CPC title

  • Incorporating or moulding on preformed parts, e.g. inserts or reinforcements · CPC title

Patent family

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Frequently asked questions

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What does patent US11634052B2 cover?
A vehicle seat back may include an integrated suspension structure including a suspension wire and suspension mounting guides coupled to both sides of the suspension wire; and a seat back pad foamed for integrating with the integrated suspension structure in a state in which the integrated suspension structure is inserted into a mold for seat back pad formation.
Who is the assignee on this patent?
Hyundai Motor Co Ltd, Kia Corp, Hyundai Transys Inc
What technology area does this patent fall under?
Primary CPC classification B60N2/64. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 25 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).