Process for producing a plate heat exchanger and plate heat exchanger

Patent metadata

Field	Value
Publication number	US-11633796-B2
Application number	US-202117544653-A
Country	US
Kind code	B2
Filing date	Dec 7, 2021
Priority date	Aug 1, 2019
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

First claim

The invention claimed is:

1. A plate heat exchanger, comprising two metal plates, wherein
at least one of the plates has channel structures,
the plates are joined to one another by a solder layer away from the channel structures, and
the solder layer comprises eutectic microstructures having a longest dimension of less than 50 micrometers,
wherein at least one of the plates comprises a connection element and a solder ring, and the connection element is bonded to at least one of the plates by the solder ring.

2. The plate heat exchanger according to claim 1 , wherein one of the plates is a base plate, and the other plate is a forming plate.

3. The plate heat exchanger according to claim 2 , wherein the forming plate comprises the channel structures.

4. The plate heat exchanger according to claim 2 , wherein the base plate has a thickness of 0.5 to 5.0 millimeters.

5. The plate heat exchanger according to claim 2 , wherein the base plate has a thickness of 1.0 to 2.0 millimeters.

6. The plate heat exchanger according to claim 2 , wherein the forming plate has a thickness of 0.2 to 2.0 millimeters.

7. The plate heat exchanger according to claim 2 , wherein the forming plate has a thickness of 0.8 to 1.0 millimeters.

8. The plate heat exchanger according to claim 1 , wherein the plates comprise an aluminum alloy.

9. The plate heat exchanger according to claim 8 , wherein the aluminum alloy is a high strength aluminum alloy.

10. The plate heat exchanger according to claim 1 , wherein the eutectic microstructures are formed in solder accumulations in a transition region from abutted areas of the plates to the channel structures.

11. The plate heat exchanger according to claim 1 , wherein at least one of the plates comprises a connection opening.

12. The plate heat exchanger according to claim 1 , wherein at least one of the plates comprises a connection opening, and the connection element is on or in the connection opening.

13. The plate heat exchanger according to claim 1 , wherein the channel structures are formed by internal pressure forming of at least one of the plates.

14. The plate heat exchanger according to claim 1 , further comprising stiffness- increasing beads, wherein the stiffness-increasing beads are not in fluid connection with the channel structures.

15. The plate heat exchanger according to claim 1 , wherein at least one of the plates has a yield strength of more than 100 MPa.

16. The plate heat exchanger according to claim 1 , wherein at least one of the plates has a yield strength of more than 140 MPa.

17. The plate heat exchanger according to claim 1 , wherein at least one of the plates has a yield strength of more than 160 MPa.

Assignees

• Benteler Automobiltechnik Gmbh
• Benteler Automobiletechnik Gmbh

Inventors

• Boehnke Max
• Huschen Ulrich
• Grussmann Elmar
• Rusche Ulrich
• Grewe Jochem

Classifications

• F28F21/084

  from aluminium or aluminium alloys · CPC title

• F28F2275/04

  by brazing · CPC title

• B23P15/26 Primary

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• F28D9/0056

  with U-flow or serpentine-flow inside conduits; with centrally arranged openings on the plates · CPC title

• B23K2101/14

  Heat exchangers · CPC title