Method of manufacturing ceramic tape

US11629915B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11629915-B2
Application numberUS-202117468752-A
CountryUS
Kind codeB2
Filing dateSep 8, 2021
Priority dateJun 29, 2015
Publication dateApr 18, 2023
Grant dateApr 18, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing ceramic tape includes a step of directing a tape of partially-sintered ceramic into a furnace. The tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic. The method further includes steps of conveying the tape through the furnace and further sintering the tape as the tape is conveyed through the furnace. The porosity of the tape decreases during the further sintering step.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing ceramic tape, comprising: directing a tape of partially-sintered ceramic into a furnace, wherein the tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic; conveying the tape through the furnace; and further sintering the tape as the tape is conveyed through the furnace, wherein the porosity of the tape decreases during the further sintering. 2. The method of claim 1 , further comprising drawing the tape of partially-sintered ceramic from a source prior to directing the tape into the furnace. 3. The method of claim 2 , wherein the source is a spool of the tape of partially-sintered ceramic. 4. The method of claim 1 , further comprising applying tension to the tape during the further sintering. 5. The method of claim 4 , further comprising holding the tape flat with the tension during the further sintering. 6. The method of claim 5 , wherein the tension comprises 20 megapascals. 7. The method of claim 1 , following the further sintering, further comprising winding the tape on a spool. 8. The method of claim 7 , wherein the spool has a diameter of at least 0.5 cm. 9. The method of claim 8 , wherein length of the tape on the spool is at least 10 m, width is at least 10 mm, and thickness is at least 10 μm. 10. The method of claim 9 , wherein the width is no greater than 20 cm and the thickness is no greater than 500 μm. 11. The method of claim 1 , wherein, during the further sintering, temperatures experienced by portions of the tape in the furnace are at least 800° C., while other portions of the tape outside the furnace are experiencing lower temperatures. 12. The method of claim 11 , wherein the other portions of the tape outside of the furnace are experiencing room temperature. 13. The method of claim 1 , wherein the porosity of the tape after the further sintering is less than 1%. 14. The method of claim 1 , wherein the ceramic comprises alumina, zirconia, lithium garnet, and/or spinel. 15. The method of claim 1 , wherein the tape is conveyed through the furnace at a rate of at least 1 inch per minute. 16. The method of claim 1 , wherein, as the tape is directed into the furnace, the tape still includes at least 30% porosity by volume. 17. A method of manufacturing ceramic tape, comprising: drawing a tape of partially-sintered ceramic from a source, wherein the tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic; directing the tape of partially-sintered ceramic into a furnace, conveying the tape through the furnace; further sintering the tape as the tape is conveyed through the furnace, wherein the porosity of the tape decreases during the further sintering; and applying tension to the tape during the further sintering. 18. The method of claim 17 , wherein the tension comprises 20 megapascals. 19. A method of manufacturing ceramic tape, comprising: directing a tape of partially-sintered ceramic into a furnace, wherein the tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic, wherein the ceramic comprises alumina, zirconia, lithium garnet, and/or spinel; conveying the tape through the furnace; and further sintering the tape as the tape is conveyed through the furnace, wherein the porosity of the tape decreases during the further sintering, wherein length of the tape is at least 10 m, width of the tape is at least 10 mm, and thickness of the tape is at least 10 μm. 20. The method of claim 19 , wherein the width is no greater than 20 cm and the thickness is no greater than 500 μm.

Assignees

Inventors

Classifications

  • Translucent or transparent ceramics other than alumina · CPC title

  • Surface properties, e.g. surface roughness · CPC title

  • Linear firing shrinkage · CPC title

  • Tape casting, e.g. with a doctor blade · CPC title

  • C04B35/64Primary

    Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) · CPC title

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What does patent US11629915B2 cover?
A method of manufacturing ceramic tape includes a step of directing a tape of partially-sintered ceramic into a furnace. The tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic. The method further includes steps of conveying the t…
Who is the assignee on this patent?
Corning Inc
What technology area does this patent fall under?
Primary CPC classification C04B35/64. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 18 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).