Method for manufacturing alkali-free glass substrate and alkali-free glass substrate

US11629092B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11629092-B2
Application numberUS-201816644251-A
CountryUS
Kind codeB2
Filing dateAug 30, 2018
Priority dateSep 5, 2017
Publication dateApr 18, 2023
Grant dateApr 18, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is an alkali-free glass substrate having a high strain point and excellent bubble count, and a method for manufacturing the alkali-free glass substrate. The method includes: a batch preparing process of preparing a raw material batch so as to obtain alkali-free glass containing, in mass %, 50 to 80% of SiO 2 , 15 to 30% of Al 2 O 3 , 0 to 4.5% of B 2 O 3 , 0 to 10% of MgO, 0 to 15% of CaO, 0 to 10% of SrO, 0 to 15% of BaO, 0 to 5% of ZnO, 0 to 5% of ZrO 2 , 0 to 5% of TiO 2 , 0 to 15% of P 2 O 5 and 0 to 0.5% of SnO 2 as a glass composition; a melting process of melting the prepared raw material batch; a fining process of fining the molten glass; and a forming process of forming the fined glass into a sheet shape. The raw material batch is melted such that a bubble enlarging temperature of the obtained glass is lower than a maximum temperature of the fining process.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing an alkali-free glass substrate, comprising: a batch preparing process of preparing a raw material batch so as to obtain alkali-free glass having a strain point of 700° C. or more; a melting process of melting the prepared raw material batch in a melting furnace; a fining process of fining the molten glass; and a forming process of forming the fined glass into a sheet shape, wherein the raw material batch is melted such that a bubble enlarging temperature of the obtained glass is lower than a maximum temperature of the fining process, wherein during the melting process electricity is supplied to the prepared raw material batch by applying electricity between a plurality of electrodes arranged on a bottom wall of the melting furnace and the prepared raw material batch is melted by Joule heat thereof, and the alkali-free glass contains, in mass %, 50 to 80% of SiO 2 , 15 to 30% of Al 2 O 3 , 0 to 4.5% of B 2 O 3 , 0 to 10% of MgO, 0 to 8% of CaO, 0 to 10% of SrO, 0 to 15% of BaO, 0 to 5% of ZnO, 0 to 5% of ZrO 2 , 0 to 5% of TiO 2 , 0 to 15% of P 2 O 5 and 0 to 0.5% of SnO 2 as a glass composition. 2. The method for manufacturing an alkali-free glass substrate according to claim 1 , further comprising an evaluation process of evaluating bubble count of the obtained glass, wherein the bubble enlarging temperature is adjusted based on the bubble count of the obtained glass. 3. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein the raw material batch is melted such that the bubble enlarging temperature of the obtained glass is 1550 to 1680° C. 4. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein radiation heating by burner combustion is not used in combination in the melting process. 5. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein a chloride is added to the raw material batch. 6. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein a raw material serving as a boron source is not added to the raw material batch. 7. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein a boric anhydride is used in at least a part of a glass raw material serving as a boron source. 8. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein the raw material batch does not contain a hydroxide raw material. 9. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein a glass cullet is added to the raw material batch, and the glass cullet includes, as at least a part thereof, a glass cullet made of glass having a β-OH value of 0.4/mm or less. 10. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein the glass raw material and/or the melting process are adjusted such that the obtained glass has a β-OH value of 0.2/mm or less. 11. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein the obtained glass has a strain point higher than 700° C. 12. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein the obtained glass has a thermal shrinkage rate of 20 ppm or less. 13. The method for manufacturing an alkali-free glass substrate according to claim 1 , wherein the alkali-free glass contains, in mass %, 50 to 80% of SiO 2 , 15 to 30% of Al 2 O 3 , 0 to 4.5% of B 2 O 3 , 0 to 10% of MgO, 2.5 to 8% of CaO, 0 to 10% of SrO, 0 to 15% of BaO, 0 to 5% of ZnO, 0 to 5% of ZrO 2 , 0 to 5% of TiO 2 , 0 to 15% of P 2 O 5 and 0 to 0.5% of SnO 2 as a glass composition.

Assignees

Inventors

Classifications

  • characterised by materials, geometry or structure of the substrates · CPC title

  • comprising manufacture, treatment or coating of substrates · CPC title

  • wherein the TFTs are in active matrices · CPC title

  • Glass production, e.g. reusing waste heat during processing or shaping · CPC title

  • Improving the yield, e-g- reduction of reject rates · CPC title

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What does patent US11629092B2 cover?
Provided is an alkali-free glass substrate having a high strain point and excellent bubble count, and a method for manufacturing the alkali-free glass substrate. The method includes: a batch preparing process of preparing a raw material batch so as to obtain alkali-free glass containing, in mass %, 50 to 80% of SiO 2 , 15 to 30% of Al 2 O 3 , 0 to 4.5% of B 2 O 3 , 0 to 10% of MgO, 0 to 15% of …
Who is the assignee on this patent?
Nippon Electric Glass Co
What technology area does this patent fall under?
Primary CPC classification C03C3/097. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 18 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).