Flexible circuit electrode array and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11627664-B2
Application number	US-201916425809-A
Country	US
Kind code	B2
Filing date	May 29, 2019
Priority date	Oct 26, 2005
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A method for manufacturing a flexible circuit electrode array, comprising:
a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on the insulator polymer base layer; b) applying a layer of photoresist on the metal trace layer and patterning the metal trace layer and forming metal traces on the insulator polymer base layer; c) activating the insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with the base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of the insulator polymer layer and selective etching the insulator layer and the top coating layer to obtain at least one via; and e) filling the via with electrode material.

A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.
The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.

First claim

What we claim is:

1. A flexible circuit comprising:
a flexible polymer base layer forming an electrode portion, a cable portion, and a bond pad portion, the bond pad portion adapted to connect to an electronic control unit;
a patterned metal layer including layers of base titanium, platinum and top titanium, on the flexible polymer base layer, including at least one electrode pad, at least one bond pad and at least one trace connecting the electrode pad to the bond pad, the patterned metal layer including a base coating layer, conducting layer, and a top coating layer;
a flexible polymer top layer deposited on the flexible polymer base layer and the patterned metal layer, including at least one opening, smaller than the electrode pad, to expose the electrode pad;
the top coating layer defining an opening aligned with the opening in the flexible polymer top layer;
an electrode plated directly on the conducting layer of the electrode pad through the top coating layer and the flexible polymer top layer and overlapping the flexible polymer top layer, wherein the electrode pad overlaps the opening in the flexible polymer layer, and the electrode overlaps the flexible polymer layer such that the flexible polymer layer is between the electrode and electrode pad; and
wherein there is no boundary between a top surface of the flexible polymer base layer and the flexible polymer top layer so that the flexible polymer base layer and flexible polymer top layer form a flexible polymer single layer, due to the top surface of the flexible polymer base layer and the flexible polymer top layer being cured together.

2. The flexible circuit according to claim 1 , wherein the flexible polymer base layer and flexible polymer top layer are polyimide and curing is imidizing the polyimide.

3. The flexible circuit according to claim 1 , further comprising a soft polymer layer, softer than the flexible polymer single layer, over at least a portion of the flexible polymer single layer.

4. The flexible circuit according to claim 1 , further comprising at least one bumper bonded to a peripheral edge of the flexible circuit.

Assignees

• Second Sight Medical Products Inc
• Cortigent Inc

Inventors

• Greenberg Robert Jay
• Talbot Neil Hamilton
• Neysmith Jordan Matthew
• Ok Jerry

Classifications

• H05K2203/095

  Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes · CPC title

• H05K2203/0554

  Metal used as mask for etching vias, e.g. by laser ablation · CPC title

• H05K3/06 Primary

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K2201/0317

  Thin film conductor layer; Thin film passive component · CPC title