Electronic components and glasses

Patent metadata

Field	Value
Publication number	US-11627399-B2
Application number	US-202217646865-A
Country	US
Kind code	B2
Filing date	Jan 3, 2022
Priority date	Aug 24, 2018
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

First claim

What is claimed is:

1. An electronic component, comprising:
a component body including a cavity;
a first microphone element arranged in the cavity;
a second microphone element arranged in the cavity and at a position farther from a sound source than the first microphone element;
a first sound conducting hole arranged on a first sidewall, opposite to the first microphone element, of the component body, the first sound conducting hole being configured to conduct a first sound originating from the sound source to the first microphone element; and
a second sound conducting hole arranged on a second sidewall, opposite to the second microphone element, of the component body, the second sidewall being opposite to the first sidewall, the second sound conducting hole being configured to conduct a second sound originating from the sound source to the second microphone element.

2. The electronic component of claim 1 , wherein a position, where the second microphone element is arranged, on the first sidewall is farther away from the sound source than a position, where the first microphone element is arranged, on the second sidewall, such that the second sound can reduce a noise signal in the first sound.

3. The electronic component of claim 1 , wherein a central axis of the first sound conducting hole coincides with a main axis of a sound receiving area of the first microphone element.

4. The electronic component of claim 1 , wherein a central axis of the second sound conducting hole coincides with a main axis of a sound receiving area of the second microphone element.

5. The electronic component of claim 1 , wherein a central axis of the second sound conducting hole coincides with or is parallel to a central axis of the first sound conducting hole.

6. The electronic component of claim 1 , wherein a main axis of a sound receiving area of the second microphone element coincides with or is parallel to a main axis of a sound receiving area of the first microphone element.

7. The electronic component of claim 1 , wherein the second microphone element includes a bone conductive microphone, the bone conductive microphone extending out of the component body through the second sound conducting hole.

8. The electronic component of claim 1 , wherein the component body includes a container body and a cover, wherein:
the container body is hollow to form the cavity,
an opening in flow communication with the cavity is arranged in the container body, and
the cover is arranged on the opening and closes the cavity.

9. The electronic component of claim 8 , wherein the first sound conducting hole is arranged on the cover and vertical or inclined to a surface of the cover.

10. The electronic component of claim 8 , wherein the second sound conducting hole is arranged on a sidewall, opposite to the cover or the first sound conducting hole, of the container body.

11. The electronic component of claim 8 , wherein the electronic component further includes:
a first circuit board; and
a second circuit board, the first circuit board and the second circuit board being inclined to each other and arranged in the cavity.

12. The electronic component of claim 11 , wherein
the first microphone element is arranged on a sidewall, facing the component body, of the first circuit board, and
the second microphone element is arranged on a sidewall, facing the component body, of the second circuit board.

13. The electronic component of claim 12 , wherein the first circuit board is arranged facing the cover and parallel or inclined to the cover, the first microphone element being arranged on a side, facing the cover, of the first circuit board.

14. The electronic component of claim 12 , wherein the second circuit board is arranged facing the container body, the second microphone element being arranged on a side, facing the container body, of the second circuit board.

15. The electronic component of claim 8 , wherein the cover includes a hard bracket and a soft cover integrally molded on a surface of the hard bracket, wherein:
the hard bracket is configured to mechanically connect the container body,
a microphone hole is arranged on the hard bracket,
the soft cover covers the microphone hole,
a first sound barrier is arranged at a position, corresponding to the microphone hole, of the soft cover,
the first sound barrier extends toward inside of the cavity through the microphone hole and defines a sound conducting channel,
one end of the sound conducting channel is communicated with the first sound conducting hole, and
the first microphone element is inserted into the sound conducting channel from the other end of the sound conducting channel.

16. The electronic component of claim 15 , wherein:
a second sound barrier is arranged at a position, corresponding to the second sound conducting hole, of the container body, and
the second sound barrier extends toward the inside of the cavity through the second sound conducting hole to limit a transmission direction of a sound to the second microphone element.

17. The electronic component of claim 11 , wherein
an area of the first circuit board is smaller than an area of the second circuit board, and
the opening and the cover are arranged in a corresponding strip shape, a size of the first circuit board along a width direction of the cover being smaller than a size of the second circuit board along a vertical direction of the first circuit board.

18. The electronic component of claim 11 , wherein the first circuit board and the second circuit board are made of a flexible circuit board or a soft-hard combined double-layer circuit board, wherein:
the flexible circuit board is bent in the cavity to form the first circuit board and the second circuit board; or
the soft-hard combined double-layer circuit board includes a flexible connection board and two hard circuit boards respectively connected to both ends of the flexible connection board, the two hard circuit boards being inclined to each other to form the first circuit board and the second circuit board.

19. An electronic device, comprising:
a glasses bracket, wherein the glasses bracket includes a glasses frame and two temples, each of the two temples including a temple body connected to the glasses frame, at least one of temple bodies of the two temples including an electronic component, the electronic component including:
a component body including a cavity;
a first microphone element arranged in the cavity;
a second microphone element arranged in the cavity and at a position farther from a sound source than the first microphone element;
a first sound conducting hole arranged on a first sidewall, opposite to the first microphone element, of the component body, the first sound conducting hole being configured to conduct a first sound from a sound source to the first microphone element; and
a second sound conducting hole arranged on a second sidewall, opposite to the second microphone element, of the component body, the second sidewall being opposite to the first sidewall, the second sound conducting hole being configured to conduct a second sound from the sound source to the second microphone element.

20. The electronic device of claim 19 , wherein
the each of the two temples further includes a connector that is hinged with, through a hinge, an end of the temple body away from the glasses frame;
the glasses further include a bone conductive loudspeaker, the bone conductive loudspeaker being arranged on the connector, wherein:
the co

Assignees

• Shenzhen Shokz Co Ltd

Inventors

• Wang Yueqiang
• Li Yongjian
• Chen Yunbin
• Zhang Haofeng

Classifications

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R2460/13

  Hearing devices using bone conduction transducers · CPC title

• G02C11/06

  Hearing aids (construction of electric hearing aids H04R25/00) · CPC title

• H04R2201/107

  Monophonic and stereophonic headphones with microphone for two-way hands free communication · CPC title

• G02C11/10 Primary

  Electronic devices other than hearing aids · CPC title