Micro light-emitting device display apparatus having bump

Patent metadata

Field	Value
Publication number	US-11626549-B2
Application number	US-202017002790-A
Country	US
Kind code	B2
Filing date	Aug 26, 2020
Priority date	Apr 16, 2020
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A micro light-emitting device display apparatus includes a circuit substrate, at least one micro light-emitting device, and at least one conductive bump. The circuit substrate includes at least one pad. The micro light-emitting device is disposed on the circuit substrate and includes at least one electrode. At least one of the pad and the electrode has at least one closed opening. The conductive bump is disposed between the circuit substrate and the micro light-emitting device. The conductive bump extends into the closed opening and defines at least one void with the closed opening. The electrode of the micro light-emitting device is electrically connected to the pad of the circuit substrate with the conductive bump.

First claim

What is claimed is:

1. A micro light-emitting device display apparatus, comprising:
a circuit substrate comprising at least one pad;
at least one micro light-emitting device disposed on the circuit substrate and comprising at least one electrode, wherein the at least one pad and the at least one electrode respectively have a first closed opening and a second closed opening; and
at least one conductive bump disposed between the circuit substrate and the at least one micro light-emitting device, wherein the at least one conductive bump extends into the first closed opening and second closed opening and defines a first void with the first closed opening and a second void with the second closed opening, and the at least one electrode of the at least one micro light-emitting device is electrically connected to the at least one pad of the circuit substrate with the at least one conductive bump,
wherein the first void has a height less than a height of the at least one pad and the second void has a height less than a height of the at least one electrode,
wherein an orthographic projection of the at least one conductive bump on the circuit substrate completely overlaps an orthographic projection of the first closed opening on the circuit substrate.

2. The micro light-emitting device display apparatus according to claim 1 , wherein the circuit substrate has a surface, and the circuit substrate comprises a plurality of pads, at least one of the plurality of pads has the first closed opening exposing a part of the surface of the circuit substrate.

3. The micro light-emitting device display apparatus according to claim 1 , wherein the at least one micro light-emitting device further comprises:
an epitaxial structure layer comprising a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer and having a surface and a through hole, wherein the at least one electrode is disposed on the surface, and the through hole sequentially penetrates the second-type semiconductor layer, the light-emitting layer, and a part of the first-type semiconductor layer; and
an insulating layer disposed on the surface and an inner wall of the through hole, wherein the at least one electrode comprises a first electrode and a second electrode, the first electrode is filled into the through hole and electrically connected to the first-type semiconductor layer, and the second electrode passes through the insulating layer and is electrically connected to the second-type semiconductor layer.

4. The micro light-emitting device display apparatus according to claim 3 , wherein the second electrode has the at least one second closed opening, and the second closed opening is a groove.

5. The micro light-emitting device display apparatus according to claim 1 , wherein the at least one micro light-emitting device further comprises:
an epitaxial structure layer comprising a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer, the first-type semiconductor layer having an upper surface, and the second-type semiconductor layer having a lower surface; and
an insulating layer disposed on the lower surface, wherein the at least one electrode passes through the insulating layer and is electrically connected to the second-type semiconductor layer.

6. The micro light-emitting device display apparatus according to claim 5 , further comprising:
a plurality of micro light-emitting devices;
a flat layer disposed on the circuit substrate and located between the plurality of micro light-emitting devices; and
a common electrode extendedly disposed from the upper surface of the first-type semiconductor layer of one of the plurality of micro light-emitting devices along the flat layer to the upper surface of the first-type semiconductor layer of another of the plurality of micro light-emitting devices, and electrically connected to the first-type semiconductor layer.

7. The micro light-emitting device display apparatus according to claim 5 , wherein the circuit substrate has a surface and a plurality of pads, at least one of the plurality of pads comprises the first closed opening, and the first closed opening exposes a part of the surface of the circuit substrate.

8. The micro light-emitting device display apparatus according to 1, wherein the first closed opening and second closed opening comprise a shape of polygon, circle, ellipse, or irregular shape.

Assignees

• Playnitride Display Co Ltd

Inventors

• Chen Yi-Ching
• Shih Yi-Chun
• Chen Pei-Hsin

Classifications

• H10H20/8506

  Containers · CPC title

• H10H20/8312

  extending at least partially through the bodies · CPC title

• H10H20/82

  Roughened surfaces, e.g. at the interface between epitaxial layers · CPC title

• H10H20/819

  characterised by their shape, e.g. curved or truncated substrates · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title