Shared base plate and semiconductor module provided with same

Patent metadata

Field	Value
Publication number	US-11626347-B2
Application number	US-201816975195-A
Country	US
Kind code	B2
Filing date	Apr 25, 2018
Priority date	Apr 25, 2018
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A shared base plate includes a plurality of base portions to which a plurality of electronic components including semiconductor switching elements are to be mounted, and a terminal formed portion formed so as to extend from the base portion to the outer side. The terminal formed portion includes a discrimination terminal which is used as a terminal in one of a first semiconductor module and a second semiconductor module and which is not used as a terminal in the other one. If the discrimination terminal that is not used as a terminal is cut to be short, it becomes possible to easily discriminate the semiconductor module from another semiconductor module having the shared base plate by outer appearances.

First claim

The invention claimed is:

1. A shared base plate to be used for plural types of semiconductor modules different in circuit configuration or component configuration, the plural types of semiconductor modules include at least a first semiconductor module and a second semiconductor module, each of which is covered with its own separate molding resin, the shared base plate comprising:
a base portion to which one of a first plurality of electronic components of the first semiconductor module and a second plurality of electronic components of the second semiconductor module are to be mounted, the first plurality of electronic components and the second plurality of electronic components each including a semiconductor switching element; and
a terminal formed portion formed so as to extend from the base portion to an outer side, wherein
the terminal formed portion includes a discrimination terminal which is used as a terminal when one of the first plurality of electronic components of the first semiconductor module and the second plurality of electronic components of the second semiconductor module are mounted on the base portion and which is not used as a terminal when other of the first plurality of electronic components of the first semiconductor module and the second plurality of electronic components of the second semiconductor module are mounted on the base portion.

2. The shared base plate according to claim 1 , wherein
the terminal formed portion includes a control terminal for input and output of a control signal, and a power terminal which is formed to be wider than the control terminal and through which larger current flows than in the control terminal.

3. The shared base plate according to claim 2 , wherein
the discrimination terminal is used as the control terminal in the first semiconductor module or the second semiconductor module.

4. The shared base plate according to claim 2 , wherein
the discrimination terminal is used as the power terminal in the first semiconductor module or the second semiconductor module.

5. The shared base plate according to claim 2 , wherein
when the discrimination terminal is not used as the control terminal or the power terminal, the discrimination terminal is formed to be shorter than the adjacent control terminal or the adjacent power terminal.

6. The shared base plate according to claim 5 , wherein
the first semiconductor module has at least one bridge circuit, and the second semiconductor module has one relay function circuit.

7. The shared base plate according to claim 5 , wherein
the first semiconductor module has two bridge circuits, and the second semiconductor module has one bridge circuit and one relay function circuit.

8. A semiconductor module comprising:
the shared base plate according to claim 5 ;
a plurality of electronic components mounted to the base portion of the shared base plate, the plurality of electronic components being one of the first plurality of electronic components of the first semiconductor module and the second plurality of electronic components of the second semiconductor module;
a wiring member connecting an electronic component among the plurality of electronic components with the base portion or another electronic component of the plurality of electronic components; and
the molding resin covering the base portion, the plurality of electronic components, and the wiring member.

9. The shared base plate according to claim 2 , wherein
the first semiconductor module has at least one bridge circuit, and the second semiconductor module has one relay function circuit.

10. The shared base plate according to claim 2 , wherein
the first semiconductor module has two bridge circuits, and the second semiconductor module has one bridge circuit and one relay function circuit.

11. A semiconductor module comprising:
the shared base plate according to claim 2 ;
a plurality of electronic components mounted to the base portion of the shared base plate, the plurality of electronic components being one of the first plurality of electronic components of the first semiconductor module and the second plurality of electronic components of the second semiconductor module;
a wiring member connecting an electronic component among the plurality of electronic components with the base portion or another electronic component of the plurality of electronic components; and
the molding resin covering the base portion, the plurality of electronic components, and the wiring member.

12. The shared base plate according to claim 1 , wherein
the first semiconductor module has at least one bridge circuit, and the second semiconductor module has one relay function circuit.

13. The shared base plate according to claim 1 , wherein
the first semiconductor module has two bridge circuits, and the second semiconductor module has one bridge circuit and one relay function circuit.

14. A semiconductor module comprising:
the shared base plate according to claim 1 ;
a plurality of electronic components mounted to the base portion of the shared base plate, the plurality of electronic components being one of the first plurality of electronic components of the first semiconductor module and the second plurality of electronic components of the second semiconductor module;
a wiring member connecting an electronic component among the plurality of electronic components with the base portion or another electronic component of the plurality of electronic components; and
the molding resin covering the base portion, the plurality of electronic components, and the wiring member.

Assignees

• Mitsubishi Electric Corp

Inventors

• Nagao Takashi
• Takeuchi Kensuke

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07653

  changes in shapes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title