Electronic component

Patent metadata

Field	Value
Publication number	US-11626253-B2
Application number	US-202117366143-A
Country	US
Kind code	B2
Filing date	Jul 2, 2021
Priority date	Jul 7, 2020
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces on both sides in a length direction. The internal nickel electrode layers are exposed at the end surfaces. External nickel layers are provided on the end surfaces. External copper electrode layers cover the end surfaces on which the external nickel layers are provided. A deviation amount in the width direction between positions of ends of two adjacent internal nickel electrode layers on both side surfaces is at least about 0.5 μm. The external nickel layers are provided on the end surface, in a region excluding a rounded ridge portion. Nickel and tin layers are provided outside the external copper electrode layer.

First claim

What is claimed is:

1. An electronic component comprising:
a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces provided on both sides in a length direction intersecting a lamination direction, wherein the internal nickel electrode layers are exposed at the end surfaces, the side gap portions being provided on both sides of the multilayer main body in a width direction intersecting the lamination direction and the length direction;
external nickel layers on the end surfaces of the multilayer body; and
external copper electrode layers covering the end surfaces on which the external nickel layers are provided; wherein
a deviation amount in the width direction between positions of ends of two internal nickel electrode layers adjacent in the lamination direction on both side surfaces is about 0.5 μm or less;
at least a portion of the internal nickel electrodes is directly bonded to the external copper electrode layers;
the multilayer body includes a rounded ridge portion;
the external nickel layers are each provided on the end surface of the multilayer body, in a region other than a region including the rounded ridge portion; and
a nickel layer and a tin layer are provided outside the external copper electrode layer.

2. The electronic component according to claim 1 , wherein, where a dimension of the external nickel layer in the lamination direction is defined as TN, and a dimension of the multilayer body in the lamination direction is defined as T 0 , a relationship of TN<T 0 is satisfied; and, where a dimension of the external nickel layer in the width direction is defined as WN, and a dimension of the multilayer body in the width direction is defined as W 0 , a relationship of WN<W 0 is satisfied.

3. The electronic component according to claim 1 , wherein the external nickel layer includes a dielectric.

4. The electronic component according to claim 1 , wherein the external copper electrode layer includes glass.

5. The electronic component according to claim 1 , wherein at least one of a nickel-based oxide or a silicon-based oxide is provided between the external nickel layer and the external copper electrode layer.

6. The electronic component according to claim 1 , further comprising:
outer layer portions on both sides of the inner layer portion in the lamination direction; wherein
the outer layer portion has a thickness larger than a thickness of the side gap portion.

7. The electronic component according to claim 1 , further comprising:
outer layer portions on both sides of the inner layer portion in the lamination direction; wherein
the outer layer portions include a lower outer layer portion on a first side on which a substrate is mounted, and an upper outer layer portion on a second side opposite to the first side in the lamination direction of the inner layer portion; and
the upper outer layer portion has a thickness tg 1 of about 10 μm≤tg 1 ≤about 20 μm.

8. The electronic component according to claim 7 , wherein each of the upper outer layer portion and the lower outer layer portion is made of a ceramic material including barium, titanium and dysprosium.

9. The electronic component according to claim 7 , wherein each of the upper outer layer portion and the lower outer layer portion is made of the same material as the dielectric layers of the inner layer portion.

10. The electronic component according to claim 1 , wherein the side gap portions each has a thickness ts of about 5 about μm≤ts≤about 12 μm.

11. The electronic component according to claim 1 , wherein the electronic component comprises a multilayer ceramic capacitor.

12. The electronic component according to claim 1 , wherein a dimension of the multilayer body in the length direction is about 0.2 mm or more and about 10 mm or less, a dimension of the multilayer body in the width direction is about 0.1 mm or more and about 5 mm or less, and a dimension of the multilayer body in the lamination direction is about 0.1 mm or more and about 5 mm or less.

13. The electronic component according to claim 1 , wherein the dielectric layers are each made of a ceramic material including barium, titanium, and dysprosium.

14. The electronic component according to claim 1 , wherein a thickness of each of the dielectric layers is about 0.40 μm or more and about 0.50 μm or less.

15. The electronic component according to claim 1 , wherein a number of the dielectric layers included in the multilayer main body is fifteen or more and 700 or less.

16. The electronic component according to claim 1 , wherein a thickness of each of the internal nickel electrode layers is about 0.25 μm or more and about 0.33 μm or less.

17. The electronic component according to claim 1 , wherein a number of the internal nickel electrode layers is fifteen or more and 700 or less.

Assignees

• Murata Manufacturing Co

Inventors

• Nishisaka Yasuhiro
• Ikeda Mitsuru

Classifications

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• H01G4/0085

  Fried electrodes · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title