Electronic component and method of manufacturing the electronic component

Patent metadata

Field	Value
Publication number	US-11626252-B2
Application number	US-202117366136-A
Country	US
Kind code	B2
Filing date	Jul 2, 2021
Priority date	Jul 7, 2020
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.

First claim

What is claimed is:

1. An electronic component comprising:
a multilayer body including a multilayer main body and side gap portions, wherein the multilayer main body includes an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces provided on both sides in a length direction intersecting a lamination direction, the internal nickel electrode layers being exposed at the end surfaces, and the side gap portions being provided on both sides of the multilayer main body in a width direction intersecting the lamination direction and the length direction;
external nickel layers on the end surfaces of the multilayer main body; and
external copper electrode layers covering the end surfaces on which the external nickel layers are provided; wherein
at least one of a nickel-based oxide or a silicon-based oxide is provided between the external nickel layer and the external copper electrode layer;
a nickel layer and a tin layer are provided outside the external copper electrode layer; and
in a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, when the external nickel layer is divided into four equal portions in the lamination direction by three linear lines extending in the length direction, an average value of a thickness of the external nickel layer on a center linear line among the three linear lines is defined as Tem, and an average value of a thickness of the external nickel layer on all of the three linear lines is defined as Tea, and a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.

2. The electronic component according to claim 1 , wherein a relationship of about 0.33≤Tea/Tem≤about 1.1 is satisfied.

3. The electronic component according to claim 1 , wherein a relationship of about 0.8 μm≤Tea≤about 15 μm, and a relationship of about 2 μm≤Tem≤about 7 μm are satisfied.

4. The electronic component according to claim 1 , wherein the dielectric layers each have a thickness tu of about 0.40 μm≤tu≤about 0.50 μm.

5. The electronic component according to claim 1 , wherein the internal nickel electrode layers each have a thickness tn of about 0.25 μm≤tn≤about 0.33 μm.

6. The electronic component according to claim 1 , wherein the side gap portions each have a thickness ts of about 5 μm≤ts≤about 12 μm.

7. The electronic component according to claim 1 , further comprising:
outer layer portions provided on both sides of the inner layer portion in the lamination direction; wherein
the outer layer portions include a lower outer layer portion provided on a first side on which a substrate is mounted, and an upper outer layer portion provided on a second side opposite to the first side, in the lamination direction of the inner layer portion; and
the upper outer layer portion has a thickness tg 1 of about 10 μm≤tg 1 ≤about 20 μm.

8. The electronic component according to claim 1 , wherein the electronic component comprises a multilayer ceramic capacitor.

Assignees

• Murata Manufacturing Co

Inventors

• Nishisaka Yasuhiro
• Ikeda Mitsuru

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/008 Primary

  Selection of materials · CPC title

• C04B35/01

  based on oxide ceramics · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• C04B2235/656

  characterised by specific heating conditions during heat treatment · CPC title