Multilayer ceramic capacitor

Patent metadata

Field	Value
Publication number	US-11626251-B2
Application number	US-202117232357-A
Country	US
Kind code	B2
Filing date	Apr 16, 2021
Priority date	Apr 22, 2020
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a multilayer body; and
two external electrodes; wherein
the multilayer body including:
a multilayer body main portion including an inner layer portion including a plurality of dielectric layers and a plurality of internal electrode layers that are alternately stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction;
two side gap portions on opposite sides of the multilayer main body in a width direction intersecting the stacking direction;
two main surfaces on opposite sides in the stacking direction;
two side surfaces on opposite sides in the width direction; and
two end surfaces on opposite sides in a length direction intersecting the stacking direction and the width direction;

the two external electrodes each being provided at one of the two end surfaces of the multilayer body, and each extending from one of the two end surfaces to a portion of the main surface;
an end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body;
a positional deviation in the width direction between ends in the width direction of any two adjacent internal electrode layers among the plurality of internal electrode layers which are vertically adjacent to each other in the stacking direction is about 0.5 μm or less; and
in a cross section of the width direction and the stacking direction passing through a center or an approximate center of the multilayer body, a line at the side surface connecting the ends of any two adjacent internal electrode layers among the plurality of internal electrode layers in the stacking direction is convex toward outside.

2. The multilayer ceramic capacitor according to claim 1 , wherein a thickness at a portion of the side gap portion in contact with the multilayer main body is about 10 μm or less.

3. The multilayer ceramic capacitor according to claim 1 , wherein a protruding amount of an end of the side gap portion on a side of the main surface is about 5% or more and about 20% or less of a dimension of the multilayer main body in the stacking direction.

4. The multilayer ceramic capacitor according to claim 1 , wherein magnesium is segregated at a portion of the side gap portion in contact with the internal electrode layer.

5. The multilayer ceramic capacitor according to claim 1 , wherein the side gap portion includes:
an inner side gap layer in contact with the multilayer main body, and
an outer side gap layer in contact with the inner side gap layer.

6. The multilayer ceramic capacitor according to claim 1 , wherein the external electrode includes:
a foundation electrode layer including a conductive metal and a glass component, and in contact with the multilayer body, and
a conductive resin layer including a thermosetting resin and a metal component, and in contact with the foundation electrode layer.

7. The multilayer ceramic capacitor according to claim 1 , wherein the multilayer body has a dimension in the length direction of about 0.2 mm or more and about 10 mm or less, a dimension in the width direction of about 0.1 mm or more and about 10 mm or less, and a dimension in the stacking direction of about 0.1 mm or more and about 5 mm or less.

8. The multilayer ceramic capacitor according to claim 1 , wherein each of the plurality of dielectric layers has a thickness of about 0.5 μm or less.

9. The multilayer ceramic capacitor according to claim 1 , wherein each of the plurality of dielectric layers includes BaTiO 3 as a main component.

10. The multilayer ceramic capacitor according to claim 9 , wherein each of the plurality of dielectric layers includes at least one of Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds as a sub-component.

11. The multilayer ceramic capacitor according to claim 1 , wherein each of the plurality of internal electrode layers includes at least one of Ni, Cu, Ag, Pd, Au, or Ag—Pd alloy.

12. The multilayer ceramic capacitor according to claim 1 , wherein each of the plurality of internal electrode layers has a thickness of about 0.5 μm or more and about 2.0 μm or less.

13. The multilayer ceramic capacitor according to claim 1 , wherein
each of the two side gap portions includes a dielectric material including grains; and
a particle size of the grains of the dielectric material decreases from an inner portion towards an outer portion of the two side gap portions.

14. The multilayer ceramic capacitor according to claim 13 , wherein the particle size of the grains is about 400 nm or more and about 450 nm or less at an outermost side of the outer portion, and about 600 nm or more at an innermost side of the inner portion.

15. The multilayer ceramic capacitor according to claim 13 , wherein the particle size of the grains at an innermost side of the inner portion is about 1.5 times or more than the particle size of the grains at the outermost side of the outer portion.

16. The multilayer ceramic capacitor according to claim 1 , wherein a thickness of each of the two outer layer portions is about 20 μm or more and about 60 μm or less.

17. The multilayer ceramic capacitor according to claim 1 , wherein a thickness of each of the two outer layer portions is about 20 μm or more and about 40 μm or less.

Assignees

• Murata Manufacturing Co

Inventors

• Ikeda Mitsuru

Classifications

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• H01G2/065 Primary

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title