Wafer inspection method and wafer
US-2020310104-A1 · Oct 1, 2020 · US
Wafer inspection method and wafer
US11624902B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11624902-B2 |
| Application number | US-201816765529-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 9, 2018 |
| Priority date | Nov 24, 2017 |
| Publication date | Apr 11, 2023 |
| Grant date | Apr 11, 2023 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. In the wafer, a gap is formed between the first mirror portion and the second mirror portion so as to form a plurality of Fabry-Perot interference filter portions. A wafer inspection method according to an embodiment includes a step of performing faulty/non-faulty determination of each of the plurality of Fabry-Perot interference filter portions, and a step of applying ink to at least part of a portion overlapping the gap when viewed in a facing direction on the second mirror layer of the Fabry-Perot interference filter portion determined as faulty.
First claim
Opening claim text (preview).
The invention claimed is: 1. A wafer inspection method comprising: a step of preparing a wafer including a substrate layer having a first surface and a second surface opposite to the first surface, a first mirror layer having a plurality of first mirror portions two-dimensionally arranged on the first surface, and a second mirror layer having a plurality of second mirror portions two-dimensionally arranged on the first mirror layer, in which a gap is formed between a portion of the first mirror layer at least including the first mirror portion and a portion of the second mirror layer at least including the second mirror portion facing each other so as to form a plurality of Fabry-Perot interference filter portions in which a distance between the first mirror portion and the second mirror portion facing each other varies by an electrostatic force; a step of performing faulty/non-faulty determination of each of the plurality of Fabry-Perot interference filter portions; and a step of applying ink to at least part of a portion overlapping the gap when viewed in a direction in which the first mirror portion and the second mirror portion face each other on the second mirror layer of the Fabry-Perot interference filter portion determined as faulty in the step of performing faulty/non-faulty determination. 2. The wafer inspection method according to claim 1 , wherein the at least part of the portion to which the ink is applied includes a through-hole formed from a surface of the second mirror layer opposite to the first mirror layer to the gap. 3. The wafer inspection method according to claim 1 , wherein in the step of applying ink, the ink is sequentially applied to one or more Fabry-Perot interference filter portions determined as faulty, after completion of the faulty/non-faulty determination of all the Fabry-Perot interference filter portions in the step of performing faulty/non-faulty determination. 4. The wafer inspection method according to claim 1 , wherein in the step of applying ink, the ink is applied to one Fabry-Perot interference filter portion every time the one Fabry-Perot interference filter portion is determined as faulty in the step of performing faulty/non-faulty determination. 5. The wafer inspection method according to claim 1 , wherein viscosity of the ink before curing is in a range from 500 cP to 50000 cP. 6. A wafer comprising: a substrate layer having a first surface and a second surface opposite to the first surface; a first mirror layer having a plurality of first mirror portions two-dimensionally arranged on the first surface; and a second mirror layer having a plurality of second mirror portions two-dimensionally arranged on the first mirror layer, wherein a gap is formed between a portion of the first mirror layer at least including the first mirror portion and a portion of the second mirror layer at least including the second mirror portion facing each other so as to form a plurality of Fabry-Perot interference filter portions in which a distance between the first mirror portion and the second mirror portion facing each other varies by an electrostatic force, and ink is applied to at least one faulty Fabry-Perot interference filter portion while the ink is not applied to at least one non-faulty Fabry-Perot interference filter portion, among the plurality of Fabry-Perot interference filter portions. 7. The wafer according to claim 6 , wherein the ink has penetrated into the gap formed in the faulty Fabry-Perot interference filter portion.
Assignees
Inventors
Classifications
using interference filters, e.g. multilayer dielectric filters · CPC title
Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title
having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays · CPC title
Subject matter not provided for in other groups of this subclass · CPC title
Coherent sources; lasers · CPC title
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Frequently asked questions
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- What does patent US11624902B2 cover?
- A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. In the wafer, a gap is formed between the first mirror portion and the second mirror portion so as to form a plurality of Fabry-Perot interference filter portions. A waf…
- Who is the assignee on this patent?
- Hamamatsu Photonics Kk
- What technology area does this patent fall under?
- Primary CPC classification G02B26/001. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).