Flexible circuit peripheral nerve stimulator with low profile hybrid assembly

Patent metadata

Field	Value
Publication number	US-11623082-B2
Application number	US-201615063202-A
Country	US
Kind code	B2
Filing date	Mar 7, 2016
Priority date	Mar 7, 2016
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A peripheral nerve stimulator configured as a flexible circuit to stimulate or block the operation of a nerve or nerve bundle, including electrode array, cable and bond pad portions connected to an electronics package. The electrode array is configured for peripheral nerve modulation and may be curved cylindrically to encompass a nerve. A cylindrical curve can be imparted through thermoforming or by applying a stretchable polymer. The stretchable polymer places the electrode array portion into a cylinder when the electrode array portion is in a relaxed position. The electronics package includes low profile, stacked thin chip electronic components that are tunable in-situ, requiring less vertical and lateral space than stacked passives. The thin chip components may be high density trench capacitors, metal-on-semiconductor capacitors positioned on an integrated circuit chip. The thin chip components may include metal-insulator-metal capacitors having a tunable capacitance value and/or may be a binary capacitor array.

First claim

What is claimed is:

1. A peripheral nerve stimulator, comprising:
a flexible circuit comprising,
a polymer base layer forming an electrode array portion, a bond pad portion and a cable portion positioned between the electrode array portion and the bond pad portion,
a plurality of patterned metal traces deposited on the polymer base layer,
a plurality of first patterned metal electrodes deposited on the polymer base layer in the electrode array portion,
a plurality of patterned metal bond pads deposited on the polymer base layer in the bond pad portion,
wherein at least one of the patterned metal electrodes in the electrode array portion is connected to at least one of the patterned bond pads in the bond pad portion by at least one of the metal traces traversing the cable portion, and
a low elastic modulus polymer layer deposited on the polymer base layer, the metal traces, the plurality of patterned metal electrodes and the plurality of patterned metal bond pads, the low elastic modulus polymer layer selected to have a coefficient of thermal expansion different from the polymer base layer, and the difference in coefficient of thermal expansion between the polymer base layer and the low elastic modulus polymer layer causing the array portion and cable portion to form in a cylinder as a result of cooling after curing of the polymer layers such that the low elastic modulus layer pulls the base polymer layer in a cylinder to prepare the array to wrap around a nerve bundle, the array portion adapted to wrap around a nerve and the cable portion adapted to wrap around the array portion; and

An electronics package bonded to the bond pads, including thin chip electronic components including thin chip capacitors that are tunable in-situ.

2. The peripheral nerve stimulator of claim 1 , wherein the polymer base layer is polyimide, and wherein the low elastic modulus polymer layer is silicone.

3. The peripheral nerve stimulator of claim 2 , wherein the metal traces, the plurality of patterned metal electrodes and the plurality of patterned metal bond pads are made from platinum.

4. The peripheral nerve stimulator of claim 1 , further comprising an inductive coil to provide electric current to the electronics package.

5. The peripheral nerve stimulator of claim 1 , wherein the electronics within the in-situ tunable components include stacked capacitors.

6. The peripheral nerve stimulator of claim 5 , wherein the stacked capacitors are high density trench capacitors.

7. The peripheral nerve stimulator of claim 1 , wherein the tunable in-situ components include thin chip components being at least one metal-insulator-metal capacitor.

8. The peripheral nerve stimulator of claim 7 , wherein the at least one metal-insulator-metal capacitor has a tunable capacitance value.

9. The peripheral nerve flexible circuit of claim 1 , wherein the polymer base layer is polyimide, and wherein the low elastic modulus polymer layer is polyurethane.

10. The peripheral nerve stimulator of claim 1 , wherein the polymer base layer is PET (polyethylene terephthalate), LCP (liquid crystal polymer), ultra-high or high molecular weight polyethylene, PTFE, or polysulfone, and wherein the low elastic modulus polymer layer is silicone, EVA (ethylene vinyl acetate), or polyurethane.

Assignees

• Second Sight Medical Products Inc
• Cortigent Inc

Inventors

• Greenberg Robert J
• Talbot Neil H
• Ok Jerry

Classifications

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title