Mask assembly, deposition apparatus having the same, and method of fabricating display device using the same
US-2019386221-A1 · Dec 19, 2019 · US
US11618940B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11618940-B2 |
| Application number | US-201916531866-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 5, 2019 |
| Priority date | Nov 5, 2018 |
| Publication date | Apr 4, 2023 |
| Grant date | Apr 4, 2023 |
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A method of manufacturing a display apparatus includes: sequentially fixing a display substrate and a mask assembly to a carrier; transporting the mask assembly and the display substrate to a deposition unit via the carrier; and depositing a deposition material on the display substrate by passing the deposition material through the mask assembly, by using the deposition unit.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a display apparatus, the method comprising: sequentially fixing a display substrate and a mask assembly to a carrier; transporting the mask assembly and the display substrate to a deposition unit via the carrier; and depositing a deposition material on the display substrate by passing the deposition material through the mask assembly, by using the deposition unit, wherein the carrier comprises: a body portion; an electro permanent magnetic chuck arranged on a boundary portion of the body portion and configured to selectively fix the mask assembly; and a substrate fixing unit arranged in the body portion to selectively fix the display substrate. 2. The method of claim 1 , wherein the carrier fixes the mask assembly by using the electro permanent magnetic chuck. 3. The method of claim 1 , further comprising moving the mask assembly to approach the display substrate via a magnetic force. 4. The method of claim 1 , further comprising separating the mask assembly from the carrier. 5. The method of claim 4 , further comprising separating the display substrate from the carrier.
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title
characterised by supporting substrates others than wafers, e.g. chips · CPC title
characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title
characterised by movements or sequence of movements of transfer devices · CPC title
in gaseous form, e.g. by CVD or PVD · CPC title
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