Nanosized dendrimeric epoxy resin to prevent casing-casing annulus pressure issues

Patent metadata

Field	Value
Publication number	US-11618842-B2
Application number	US-202017014148-A
Country	US
Kind code	B2
Filing date	Sep 8, 2020
Priority date	Sep 8, 2020
Publication date	Apr 4, 2023
Grant date	Apr 4, 2023

Abstract

A method includes introducing an epoxy resin system to a wellbore defect in a wellbore. The epoxy resin system comprises a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group and a curing agent. The method includes maintaining the epoxy resin system in the wellbore such that a cured epoxy resin system product forms in the wellbore defect.

First claim

What is claimed is:

1. A method, comprising:
introducing an epoxy resin system to a wellbore defect that causes pressure build up in a casing-casing annulus in a production well extending from a surface to a formation having a perforation extending therein, and
maintaining the epoxy resin system in the production well such that a cured epoxy resin system product forms in the wellbore defect so as to seal the wellbore defect without sealing off the perforation,
where the epoxy resin system comprises a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group and a curing agent.

2. The method of claim 1 where the POSS epoxy resin is poly(glycidyl silsesquioxane).

3. The method of claim 1 where the curing agent is selected from the group consisting trimethyl hexamethylene diamine (TMD), diethylenetriamine (DETA), triethylenetetramine (TETA), metaxylenediamine (MXDA), aminoethylpiperazine (AEP), tetraethylenepentamine (TEPA), polyetheramine, isophoronediamine (IPDA), diethyltoluenediamine (DETDA), polyoxypropylene diamine, and combinations thereof.

4. The method of claim 1 where the epoxy resin system further comprises an additional epoxy resin.

5. The method of claim 4 where the additional epoxy resin comprises a mixture of bisphenol-A(epichlorohydrin) epoxy resin and a composition comprising oxirane, mono[C12-14-alkyloxy)methyl] derivatives.

6. The method of claim 1 where the epoxy resin system is introduced into the wellbore defect.

7. The method of claim 1 further comprising detecting the wellbore defect.

8. The method of claim 1 further comprising introducing into the casing-casing annulus a flushing fluid.

9. The method of claim 1 further comprising introducing into the casing-casing annulus a cleaning fluid.

10. The method of claim 9 where the cleaning fluid is an acidic fluid.

11. The method of claim 1 further comprising operating the production well such that a differential pressure forms across the cured epoxy resin system product.

12. The method of claim 11 where the cured epoxy resin system product in the wellbore defect is configured to withstand a differential pressure of up to about 30,000 psid (pounds per square inch differential) (206.8 megapascals differential (MPad)).

13. The method of claim 1 where the wellbore defect is a seal failure on a production packer.

14. The method of claim 1 where the wellbore defect is a cement crack in the casing-casing annulus.

15. The method of claim 1 where the wellbore defect is a seal failure in a production tubing.

16. The method of claim 1 further comprising detecting the wellbore defect by measuring the pressure in the casing-casing annulus.

17. The method of claim 1 where the cured epoxy resin system product prevents communication of formation pressure through the casing-casing annulus.

18. The method of claim 1 where the introducing the epoxy resin system to a wellbore defect comprises introducing the epoxy resin system though a casing head.

19. The method of claim 1 where the wellbore defect has an uphole part, wherein the cured epoxy resin system product forms on the uphole part.

Assignees

• Saudi Arabian Oil Co

Inventors

• Wagle Vikrant
• Ramasamy Jothibasu
• Al-Yami Abdullah S
• Alanqari Khawlah A

Classifications

• C09K8/44 Primary

  containing organic binders only · CPC title

• C08G77/045

  containing less than 25 silicon atoms · CPC title

• C04B26/30 Primary

  Compounds having one or more carbon-to-metal or carbon-to-silicon linkages {; Other silicon-containing organic compounds; Boron-organic compounds} · CPC title

• C09K8/428

  for squeeze cementing, e.g. for repairing · CPC title