Additive for epoxy adhesive and epoxy adhesive composition for construction including same

US11618840B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11618840-B2
Application numberUS-201816499571-A
CountryUS
Kind codeB2
Filing dateMay 9, 2018
Priority dateMay 12, 2017
Publication dateApr 4, 2023
Grant dateApr 4, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a star-shape having a core/shell structure including a core formed by the polymerization of the cross-linker and a shell formed by a portion of the arm-polymer.

First claim

Opening claim text (preview).

What is claimed is: 1. An additive for an epoxy adhesive, the additive comprising a star-shaped star polymer having a core/shell structure, wherein the star polymer is formed via atomic transfer radical polymerization (ATRP) between an arm-polymer and a cross-linker, wherein the arm-polymer includes a polyacrylate having one halogenated terminal, wherein the core includes a polymer resulting from polymerization of the cross-linker, and a portion of the arm-polymer constitutes the shell, wherein the cross-linker includes 1,4-butanediol dimethacrylate, wherein a molar ratio of 1,4-butanediol dimethacrylate used for formation of the core and the arm-polymer is in a range of 12:1 to 18:1. 2. The additive for the epoxy adhesive of claim 1 , wherein the core has a diameter of 5 nm to 100 nm. 3. A structural epoxy adhesive composition comprising: an epoxy resin; an additive for the epoxy adhesive; and an epoxy curing agent, wherein the additive comprises a star-shaped star polymer having a core/shell structure, wherein the star polymer is formed via atomic transfer radical polymerization (ATRP) between an arm-polymer and a cross-linker, wherein the arm-polymer includes a polyacrylate having one halogenated terminal, and the cross-linker includes a divinyl benzene-based compound, a diacrylate-based compound, or a dimethacrylate-based compound, wherein the core includes a polymer resulting from polymerization of the cross-linker, and a portion of the arm-polymer constitutes the shell. 4. The structural epoxy adhesive composition of claim 3 , wherein a content of the additive for the epoxy adhesive is in a range of 5 to 60 parts by weight based on 100 parts by weight of the epoxy resin. 5. The structural epoxy adhesive composition of claim 3 , wherein the structural epoxy adhesive composition further contains rubber particles, modified urethane resin and modified epoxy resin. 6. The structural epoxy adhesive composition of claim 5 , wherein the epoxy resin includes a bisphenol-A derived epoxy resin, a chelate-substituted functional epoxy resin, and a reactive diluent. 7. The structural epoxy adhesive composition of claim 3 , wherein the additive for the epoxy adhesive is dispersed in the epoxy resin as a medium while forming a micelle or vesicle. 8. The structural epoxy adhesive composition of claim 3 , wherein the structural epoxy adhesive composition is cured at 100° C. to 180° C. to form a cured product thereof, wherein the additive for the epoxy adhesive is dispersed in a form of a micelle or vesicle in the cured product.

Assignees

Inventors

Classifications

  • Presence of (meth)acrylic polymer · CPC title

  • Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

  • C09J11/08Primary

    Macromolecular additives · CPC title

  • Homopolymers or copolymers of acrylic acid esters · CPC title

  • Presence of styrenic polymer · CPC title

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Frequently asked questions

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What does patent US11618840B2 cover?
In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a sta…
Who is the assignee on this patent?
Pusan National Univ Industry Univ Cooperration Foundation, Univ Korea Res & Bus Found, Pusan National Uniersity Industry Univ Cooperration Foundation
What technology area does this patent fall under?
Primary CPC classification C09J11/08. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 04 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).