Secondary battery and electronic apparatus
US-2024332742-A1 · Oct 3, 2024 · US
US11618840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11618840-B2 |
| Application number | US-201816499571-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 9, 2018 |
| Priority date | May 12, 2017 |
| Publication date | Apr 4, 2023 |
| Grant date | Apr 4, 2023 |
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In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a star-shape having a core/shell structure including a core formed by the polymerization of the cross-linker and a shell formed by a portion of the arm-polymer.
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What is claimed is: 1. An additive for an epoxy adhesive, the additive comprising a star-shaped star polymer having a core/shell structure, wherein the star polymer is formed via atomic transfer radical polymerization (ATRP) between an arm-polymer and a cross-linker, wherein the arm-polymer includes a polyacrylate having one halogenated terminal, wherein the core includes a polymer resulting from polymerization of the cross-linker, and a portion of the arm-polymer constitutes the shell, wherein the cross-linker includes 1,4-butanediol dimethacrylate, wherein a molar ratio of 1,4-butanediol dimethacrylate used for formation of the core and the arm-polymer is in a range of 12:1 to 18:1. 2. The additive for the epoxy adhesive of claim 1 , wherein the core has a diameter of 5 nm to 100 nm. 3. A structural epoxy adhesive composition comprising: an epoxy resin; an additive for the epoxy adhesive; and an epoxy curing agent, wherein the additive comprises a star-shaped star polymer having a core/shell structure, wherein the star polymer is formed via atomic transfer radical polymerization (ATRP) between an arm-polymer and a cross-linker, wherein the arm-polymer includes a polyacrylate having one halogenated terminal, and the cross-linker includes a divinyl benzene-based compound, a diacrylate-based compound, or a dimethacrylate-based compound, wherein the core includes a polymer resulting from polymerization of the cross-linker, and a portion of the arm-polymer constitutes the shell. 4. The structural epoxy adhesive composition of claim 3 , wherein a content of the additive for the epoxy adhesive is in a range of 5 to 60 parts by weight based on 100 parts by weight of the epoxy resin. 5. The structural epoxy adhesive composition of claim 3 , wherein the structural epoxy adhesive composition further contains rubber particles, modified urethane resin and modified epoxy resin. 6. The structural epoxy adhesive composition of claim 5 , wherein the epoxy resin includes a bisphenol-A derived epoxy resin, a chelate-substituted functional epoxy resin, and a reactive diluent. 7. The structural epoxy adhesive composition of claim 3 , wherein the additive for the epoxy adhesive is dispersed in the epoxy resin as a medium while forming a micelle or vesicle. 8. The structural epoxy adhesive composition of claim 3 , wherein the structural epoxy adhesive composition is cured at 100° C. to 180° C. to form a cured product thereof, wherein the additive for the epoxy adhesive is dispersed in a form of a micelle or vesicle in the cured product.
Presence of (meth)acrylic polymer · CPC title
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
Macromolecular additives · CPC title
Homopolymers or copolymers of acrylic acid esters · CPC title
Presence of styrenic polymer · CPC title
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